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2002-09-02 IMP signs IC development joint venture in Ningbo
IMP Inc. has signed a joint venture agreement with Minghua Co. of Ningbo, China
2005-12-21 Zoran announces joint product development with Xoceco
Zoran announced the opening of a joint product development laboratory with Xoceco, which will enable both companies to collaborate more closely on the development of innovative new products using Zoran's highly integrated solutions for digital TV chassis and STB.
2005-01-05 Xilinx to initiate joint research in India
Xilinx Inc. said it is in talks with leading universities in India to initiate joint research and development likely to start later this year.
2005-01-05 Xilinx to initiate joint research in India
Xilinx Inc. said it is in talks with leading universities in India to initiate joint research and development likely to start later this year.
2004-03-03 Xilinx forms Indian joint development center for FPGAs
Xilinx Inc. has announced a partnership with CMC Ltd. for a joint development center in Hyderabad in southern India.
2006-01-13 Using software synthesis for multiprocessor OS and software development
The next great revolution in computer architecture is certain to be multiprocessing, just as it has always beenalways right around the corner.
2002-02-12 UMC seeks control of Japan joint-venture fab
United Microelectronics Corp. is seeking to gain management control of its 300mm wafer joint venture with Hitachi Ltd, UMC chairman and chief executive Robert Tsao said Friday (Feb. 8
2003-07-21 TSMC, Applied Materials ink deal on ECP development
Taiwan Semiconductor Mfg Co. has entered into a joint development agreement with Applied Materials Inc. to develop TSMC's next-gen copper chips.
2004-09-13 Toshiba, Samsung joint venture unveils DVD-ROM
Toshiba introduced its SD-M1912 DVD-ROM, which is the first drive to ship from the new Toshiba Samsung Storage Technology joint venture
2015-03-23 The development of JTAG/boundary-scan standards
Learn about the fruits of labour of the JTAG or Joint Test Action Group committee, and how these altered the test landscape dramatically
2003-09-29 TELI, Coreco ink supply, joint development pact
Tokyo Electronic Ind. Co. Ltd (TELI) has signed a multi-year strategic agreement with Coreco Inc., in which the latter will supply its smart camera technology to TELI.
2008-02-20 TEL, Sharp form thin-film PV joint venture
TEL has entered the photovoltaic cell production business with a joint venture with Sharp to commercialize plasma CVD systems for thin-film silicon PV
2004-04-19 Tegal, Sharp partner nano layer deposition development
Tegal Corp. and Sharp Laboratories of America have entered into an agreement to collaborate on a focused joint development program (JDP) to accelerate the adoption and integration of next generation high-K dielectrics.
2003-07-31 Team targets data storage development
Toshiba Corp. has entered into a comprehensive agreement with M-Systems that will combine both companies' technology for the development of new NAND flash-based data storage products
2014-11-03 SunPower grows presence in China with second joint venture
The U.S.-based solar systems manufacturer is investing $20 million in a power venture that will construct at least 3GW of solar plants in China's Sichuan province.
2003-08-07 Sunplus, Silicon Image enter joint development pact
Sunplus Technology Co. Ltd and Silicon Image have partnered to jointly develop highly-integrated, advanced SoC solutions.
2010-05-27 SunEdison, First Reserve ink solar joint venture
SunEdison and First Reserve Corp. have entered a joint venture agreement, which could provide for the acquisition of up to $1.5 billion in current and future SunEdison solar photovoltaic energy projects
2005-11-30 Stratus, NEC ink 10-year joint product development
Stratus Technologies and NEC signed two 10-year agreements establishing a joint product development alliance and a long-term hardware purchasing arrangement.
2012-07-05 STMicroelectronics and HIT establish joint lab
STMicroelectronics and Harbin Institute of technology establish a joint lab to assist engineering students as well as encourage bilateral cooperation
2005-11-04 STMicroelectronics and HDIC joint venture releases flexible digital TV middleware
STMicroelectronics (ST) has announced that affiliate company Shanghai-BMCa joint venture with HDIC, released its complete MBT middleware solution for TV set-top boxes (STBs) intended for the Chinese market and international operators
2003-09-02 STMicro, Sanyo partner on digital TV development
STMicroelectronics and Sanyo Ind. Ltd have agreed on the joint development of a digital TV receiver technology for deployment in Sanyo's newest range of iDTV products.
2003-11-11 STMicro, MobiDiag ink biochip development pact
STMicroelectronics has signed a joint development agreement with MobiDiag to create a complete system for genomic-based detection of infectious diseases based on a silicon MEMS biochip.
2007-12-21 ST, TJ FAW open joint automotive lab in China
STMicroelectronics and TIANJIN FAW Xiali Automobile, a China-based automotive manufacturer, have inaugurated their joint automotive application laboratory in Tianjin, China
2005-02-18 ST abandons GSM baseband chip development
STMicroelectronics disclosed Tuesday (Feb. 15) that it has abandoned a major effort to develop a second-generation GSM baseband chipset.
2005-11-18 Sony, NEC to set up optical disc drive joint venture
Sony Corp. and NEC Corp. have signed a memorandum of understanding (MOU) on a joint venture (JV) for the manufacture of optical disc drives
2006-03-02 Sony, NEC to establish joint venture company
Sony and NEC announced that they have signed a definitive agreement to establish a joint venture company, Sony NEC Optiarc Inc., in carrying out optical disc drive business
2002-10-03 Solicore, ICP end development pact
Solicore Inc. has ended a joint development agreement with solar energy products manufacturer ICP Global Technologies.
2004-05-27 Silicon Lab, TCL form joint wireless development lab
Silicon Laboratories Inc. and TCL Mobile Communication Co. Ltd have established a joint development laboratory focused on RF design for wireless handsets.
2004-12-09 Silicon Lab, Helicomm sign Zigbee development agreement
Silicon Laboratories Inc. and Helicomm have entered into a ZigBee joint development, and marketing agreement.
2011-04-25 Sigma Designs, Vietnam Multimedia Corp. form joint venture
Sigma Designs and Vietnam Multinedia Corporation have formed a joint venture company to develop and market high-performance set-top boxes for digital television, smart energy products and home-connectivity solutions
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