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2008-04-30 Singapore inventor gets patent for flip-chip IC assembly tech
Teck Kheng Lee of Singapore has been granted U.S. patent for his development of a method for assembling a flip chip semiconductor device
2005-07-05 RGB-based device offers optimized control of color, brightness
The Optoelectronics Division of Bivar has introduced a new surface mount RGB-based device for optimized control of color and brightness, including a brilliant white, packaged in a low-profile, industry standard PLCC- 4 device
2012-02-09 Nokia to lay off 4,000, moves assembly to Asia
The transition would allow Nokia to work more closely with suppliers and enable it to introduce innovations into the market more quickly and ultimately be more competitive.
2006-09-19 Zener diode micro-assembly protects sensitive electronics
Raychem's new product helps protect sensitive electronics from damage caused by inductive voltage spikes, voltage transients, incorrect power supplies and reverse bias.
2012-02-06 TSMC to roll 3D IC assembly service next year
The company has one year to get all physical design kits and EDA support in place to allow customers to design with COWOS, the technology standing for chip on wafer on substrate.
2008-04-21 Synplicity tips device-independent FPGA design tool
A device-independent IP configuration and system-level assembly environment has been introduced by Synplicity.
2010-11-15 Surface-mount RTP device helps protect against thermal events damage
Tyco Electronics introduced has a technology that enables manufacturers to incorporate surface-mountable thermal protection in their standard RoHS-compliant reflow assembly process
2011-06-29 Renesas closes assembly, test division
After examining the trajectory of the Tokyo Device Division within the overall back-end production policy of the company, Renesas has decided to close down its operations
2004-12-22 Philips BiCMOS logic device in DQFN package
Philips released what it touts as the industry's smallest BiCMOS logic device in the DQFN package
2005-07-21 New resettable overcurrent protection device from Raychem
Raychem Circuit Protection unveiled a low resistance, resettable overcurrent protection device designed for communications infrastructure applications
2015-03-02 Mobile device market feels pressure from tech fatigue
As new mobile devices have expanded to fill the available space, the battle is now focused on niche differentiations, rather than the happy times of a market growing at full throttle.
2008-03-10 Magnetic device lets one 'feel' 3D computer objects
Researchers at Carnegie Mellon University have developed a device that could allow people to feel textures and shapes of 3D designs created on computerswithout awkward mechanical gear
2006-02-22 Magnetic device features dual-coil config for design flexibility
Datatronics introduced an advanced DR359 series of surface-mount inductor/transformer that combines a unique dual-coil design with a low-profile package.
2003-03-10 Lantronix offers embedded device server in RJ-45 scheme
Lantronix has shipped its XPort embedded device server in a ruggedized RJ-45 package
2002-08-15 Kinsun RF cable assembly tackles WLAN, portable apps
Kinsun Ind. Inc. has announced an RF cable assembly that consists of a 1.13mm(x) coaxial cable and MMCX/MCX connectors, targeted for Bluetooth and WLAN applications
2012-08-27 HotRail Assembly machine supports RF power amps
The HotRail radio frequency assembly cell from Palomar Technologies is a fully automatic, high-accuracy system that provides heat profile vs. time eutectic reflow on a single, large work area build site
2003-06-20 Hermetic Surface Mount Device (SMD), Its Advantages and Solutions to Assembly Integration.
This application note discusses the advantages of using hermetic surface mounted devices and presents several procedures for Assembly Integration
2015-01-20 Enhance device reliability through PCB cleanliness
High level of cleaning eliminates failures caused by board contamination. Products are less susceptible to corrosion-induced failures, thus reducing the need for maintenance or repair.
2011-07-04 Enhance audio quality of mobile-device loudspeakers
Know some of the methods portable electronics makers can employ to achieve louder, higher-quality sound out of small, lightweight, inexpensive speakers.
2009-12-28 Digital accelerometer, analog gyro fit in one device
STMicroelectronics debuts a module that integrates a three-axis digital accelerometer with a two-axis analog gyroscope.
2008-09-11 Compact HDMI interface hastens board assembly capacity
NXP Semiconductors has released what it claimed as the industry's first fully integrated interface conditioning chips for the HDMI 1.3 port.
2013-04-09 Choosing medical device interconnects
Biocompatibilty, durability and reliability are key attributes to consider when selecting the right interconnects for remotely connecting healthcare professionals and patients.
2003-04-29 China's GAPT deploys Teradyne device test system
Global Advanced Packaging Technology Co. Ltd has purchased another test system from Teradyne Inc. - the Catalyst, for a wide range of device testing
2003-01-14 Amkor to provide TI with wafer assembly, test support
Amkor Technology Inc. will provide Texas Instruments with subcontractor assembly facilities that will give TI substantial additional manufacturing capacity for its DLP technology
2006-07-31 AC process streamlines Pb-free flip-chip assembly
Henkel's NCP materials provide an alternative to traditional, mechanical soldering by bonding bumps to the substrate through a Pb-free compatible thermal compression process.
2005-01-19 Vishay PTC device with 30mm? pick-up area
Vishay announced a new range of components that integrate two positive temperature coefficient thermistors into a single surface-mount package.
2004-02-16 Photosynthesis inspires molecular-assembly process
Nanotechnologists have recently succeeded in their attempts to build molecular systems based on highly efficient versions of the molecular "machine" that plants use to turn sunlight into energy.
2003-06-11 APT-RF releases LDMOS device for Avionics market
Advanced Power Technology has released its 1011LD110 and 1011LD110 series of LDMOS transistors that are targeted for the Avionics market.
2000-09-01 Applying MES technology in PCB assembly
Industry manufacturers, whether box build or PCB assembly, should maintain premium quality for both the products and the information that comes off the line. To be able do this, they must employ an innovative technology called MES (management execution system) to help reinforce better production results
2012-04-03 3M reveals Static Management Program for device makers
The program allows electronics and components manufacturers to remotely monitor facilities for EOS/ESD on a real-time basis.
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