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2008-04-18 RFMD moves all production testing to China
RFMD has announced it will consolidate its production test facilities for high volume cellular products to reduce cycle time, better serve its customer base and improve overall profitability
2013-10-24 Xilinx, TSMC announce CoWoS 3D IC volume production
The programmable Virtex-7 HT family claims to be the industry's first heterogeneous 3D ICs in production that feature up to sixteen, 28Gb/s and seventyCtwo, 13.1Gb/s transceivers
2007-06-08 Xilinx marks production qualification milestone of Virtex-5 devices
Xilinx has announced production qualification of its LX50 and LX50T FPGAs, the first two devices in the Virtex-5 65nm series.
2006-11-24 Wire-bondable devices come in silicon and ceramic
IRC's new family of surface-mount, wire-bondable devices consists of resistors, network arrays, capacitors, multitap chip resistors and divider networks on silicon and ceramic
2007-03-01 Winbond unrolls parallel, serial flash devices
Winbond has announced three new parallel flash memory devices in its W19B product family and two new serial flash memory devices in its SpiFlash W25X family
2005-06-17 Winbond to ramp up 300mm production using ESI Model 9830
Winbond Electronics Corp. has purchased multiple ESI Model 9830 semiconductor link processing systems from Electro Scientific Industries Inc. to be installed at its latest 300mm fab in Taichung, Taiwan.
2007-07-25 Winbond tips new parallel flash memory devices
Winbond Electronics Corp. has added new products to its W19B family with the introduction of 16-, 32- and 64Mbit parallel flash memory devices
2007-07-19 WiMAX test system revs up production throughput
Agilent Technologies Inc. and GCT Semiconductor Inc. have partnered to jointly implement a WiMAX manufacturing test system for GCT's WiMAX chipsets.
2014-10-22 WiFi devices from TI guarantee WiFi interoperability
Texas Instruments revealed that its SimpleLink WiFi CC3100 and CC3200 devices, aimed at the Internet of Things, have been WiFi-certified at the chip level, ensuring easy integration into an IoT system
2013-12-04 Volume production of thermoelectric modules almost at hand
The researchers from Fraunhofer have shown that half-Heusler compounds, which are highly suitable materials for thermoelectric processes, can be produced significantly and more efficiently.
2005-02-24 VoicePort devices support one complete FXS channel
Legerity announced early this week the availability of additional members of its VE880 VoicePort series.
2004-05-07 Vishay devices offer up to 100A surge capabilities
Vishay has disclosed that its first family of surface-mount thyristor surge-protective devices provide excellent clamping performance
2001-09-27 USB2.0 and 1394: At-speed production testing of 480+Mbps transceivers
This article reviews the basic differences between 1394 and USB2.0 devices at the electrical signaling level and how that compares to production test system capabilities in the factory.
2005-02-28 USB MCUs tailored for PC human input devices
Cypress released a new family of low-speed USB microcontrollers targeting PC human input devices, including keyboards, mice and wireless dongles
2009-09-24 USB devices target car navigation, infotainment
Cypress expands its automotive-grade portfolio with USB devices for navigation and infotainment
2007-06-13 Ultrathin MEMS-based sensor suits portable devices
Freescale Semiconductor has started sampling a MEMS-based sensor with a three-axis digital-output accelerometer that the company says is the thinnest on the market.
2007-01-29 Ultrathin crystal unit suits mobile devices
Epson Toyocom has released an ultrathin SMD tuning fork crystal unit that measures 3.2-by-1.5-by-0.6mm, making it a good fit for mobile devices
2006-07-24 Ultra-thin inductors target portable devices
Combining a miniature surface-mount package with effective EMI protection, Datatronic Distribution's new inductors are suitable for a variety of compact, portable devices
2013-08-30 Ultra low power PSoC 1 devices with integrated USB
The new CY8C24x93 device series from Cypress is optimised for battery-powered applications and leverages a 1.1?A Standby mode and 100nA Deep-Sleep mode to extend battery life.
2005-04-28 TSMC unveils 65nm process, production due December
Foundry chip maker Taiwan Semiconductor Mfg Co. Ltd unveiled its 65nm manufacturing process at its Technology Symposium held in San Jose, California, declaring that first wafers processed with the rules are expected in December.
2008-11-19 TSMC ramps 40nm volume production
TSMC Ltd. has announced the volume production of the first semiconductor foundry 40nm logic manufacturing process with the successful ramp of its 40nm General Purpose (G) and Low Power (LP) versions
2005-02-07 TSMC libraries support Nexsys 90nm production
Taiwan Semiconductor Mfg Co. (TSMC) has unveiled a full suite of internally developed libraries that support its Nexsys 90nm technology.
2013-04-15 TSMC FinFET production set in 2013
Company executives detailed the new processes and how they aim to get there and also gave an update on 3D chip stacks and their on-going ramp of today's 28nm process node.
2007-08-23 TSMC begins 0.13? embedded flash production
Taiwan Semiconductor Manufacturing Co. Ltd (TSMC) has qualified its 0.13? embedded flash process and has entered production
2014-11-14 TSMC 'ahead of schedule' in 16FF+ production
Taiwan Semiconductor Manufacturing Co. has entered risk production for its 16nm FinFET Plus process, which, according to analysts, is yet another sign that the chip foundry is ahead of schedule with its first 3D chips that will be at the core of smaller, more powerful mobile devices.
2002-10-23 Tower to produce 0.135m devices with Applied Materials
Applied Materials Inc. has received orders for chip making equipment worth more than $45 million from Tower Semiconductor Ltd.
2003-12-02 Toshiba to expand memory production in Japan
Toshiba Corp. announced that it will be increasing its semiconductor business capital expenditure in order to expand memory production at its Oita operations in Kyushu, Japan
2009-05-04 Toshiba ramps up 32nm NAND production
Toshiba Corp. is accelerating the production of its NAND flash memory products, based on its long-awaited, 32nm process technology
2002-06-11 Toppoly commences LTPS TFT-LCD production
Toppoly Optoelectronics Corp. has begun the pilot run for its Fab 1 facility, which produces low-temperature polysilicon TFT-LCDs.
2008-05-26 Tool cuts test time for automotive devices
Advantest has introduced the T7723 mixed-signal test system with high-throughput and highly parallel test capabilities for testing high-density automotive devices
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