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2004-07-20 Wirebond woes reported for advanced low-k die
Problems in wirebonding to dice that use a particular low-k dielectric material in the interconnect stack were reported in a technical paper given Wednesday (July 14, 2004) at the Semi Technology Forum within the Semicon West exhibition.
2005-07-06 Vishay array features monolithic die with eight protection diodes
Vishay Intertechnology expanded its line of ultra-small LLP-packaged products designed for data-line protection in compact portable electronics with the release of two new low-capacitance ESD protection diode arrays.
2002-10-17 Using the ispPAC30 to Monitor Die Temperature in the ORCA-4 and FPSC ICs
This application note describes how the ispPAC30 is suited to perform temperature monitoring in FPGAs and FPSCs.
2007-07-04 User guide for QDRII as QDRI 36Mbit QDRI 2-burst B-die
Samsung's 36Mbit QDRI 2burst B-die devices are 37,748,736bits quad data rate synchronous pipelined burst SRAMs.
2007-12-04 Universal GPS, Galileo RFIC comes in tested die
Maxim Integrated Products has introduced the MAX2769E/W, claimed to be the industry's first universal GNSS receiver for GPS, WAAS, Egnos, Galileo and Glonass navigation satellite systems in a single tested die.
2004-12-02 Understanding the quality and reliability requirements for bare die applications
This app note provides common understanding of bare dire applications.
2002-03-11 Tru-Si, OSE-USA codevelop high-yield stacked die chips
Tru-Si Technologies Inc. has formed a joint development agreement with IC package provider OSE-USA to create an ultra-thin microchip die that can be stacked and interconnected with up to four die per package for volume manufacturing.
2013-06-24 Tresky rolls out versatile die bonder product line
Tresky's die bonder integrates "True Vertical Technology", making it possible to bond in deep cavities.
2004-04-13 Toshiba rolls out first 4Gb single-die MLC NAND flash unit
Toshiba has disclosed that it has introduced the semiconductor industry's first 4Gb single-die, multi-level cell, NAND flash memory.
2012-04-02 TI expands IC packaging options with bare die
The bare die program allows customers to order small quantities as low as 10 pieces for initial prototyping purposes, and larger quantities of full waffle trays for production purposes.
2011-05-25 Three workers die in Foxconn explosion
Three workers died during the Foxconn factory explosion last Friday, May 20. Foxconn is one of the manufacturers of Apple's new iPad 2.
2010-08-06 Thermal implications for die stacks
This technical note presents a case study of a handset simulation in which an LPDRAM is stacked on an application processor (PoP) and the resulting thermal-profile modeling.
2012-07-26 Techniques, procedures for die bonding
Here's a look at various techniques for die bonding, a process of connecting die to the package for communication to the outside world.
2007-04-10 Spansion bundles NOR, ORNAND, Quad on a die
Spansion plans to combine its MirrorBit NOR, ORNAND and Quad flash memory on a single die, making it the latest flash memory player to rethink its architecture in an effort to offer handset designers a one-stop-shop approach to choosing a memory subsystem.
2015-08-27 Small RF filters handle multiple bands in single die
RF filter specialist Resonant claims to have developed multi-band techniques that allow two or three filters to share the same die, as well as creating tunable models that can change their frequency.
2003-06-18 Silicon Wave Bluetooth die provides high-density integration
Silicon Wave's UltimateBlue 3000 radio processor and the SiW1712 radio modem are available as standalone bare die products.
2013-06-28 Silicon Labs touts single-die alternative to quartz crystals
Silicon Labs joins the scalability and economy of CMOS and the stability of MEMS in its patented single-chip MEMS oscillator, dubbed CMEMS.
2011-02-16 Silicon die integrates Wi-Fi, Bluetooth
Atheros's XSPAN AR9462 combo solution integrates 2-stream, dual-band 802.11n and Bluetooth 4.0 technologies onto a single die.
2009-11-10 Samsung slims down multi-die memory package
Samsung claims the thinnest multi-die memory package measuring 0.6mm in height, just half the thickness of a conventional memory package of eight stacked chips or dies.
2005-01-18 Samsung announces 'first eight-die MCP technology'
Samsung has developed what it touts as the world's first eight-die MCP technology, designed for use in high capacity mobile devices.
2001-04-15 Same-die tactic eases DDR transition
The industry consensus is clear: DDR's time has come. Now what design issues must engineers consider, and what can DRAM suppliers do to make this memory transition happen smoothly and seamlessly?
2007-05-28 Re-synthesis solution cuts 24% die area
California-based Nangate Inc. claims that its re-synthesis solution will provide digital IC designers with the advantages of full custom design implementation while preserving the benefits of cell-based design methodologies.
2011-08-29 Placement system touts high-speed die bonding
Single machine solution eases IC manufacturing with die bonding speeds at 3,500cph per head at 25?m.
2010-12-03 PCM die found in mobile phone
UBM TechInsights reports it has found a phase-change memory die inside a Samsung handset.
2013-07-10 Palomar set to debut latest die bonder tech at SEMICON West
Palomar Technologies will unveil the 8000i Wire Bonder and the VisionPilot technology aimed to support automated complex microelectronics packaging and production.
2012-08-16 Palomar boosts die bonder service support in Singapore
The firm expanded into a Singapore-based demonstration laboratory in order to support increasing demand for in-person 8000 Wire Bonder and 3800 Die Bonder demonstrations for APAC customers.
2007-04-16 On Die Termination control
This application note discusses On Die Termination (ODT) control, including possible termination methods.
2007-01-24 NXP sets up Asia's 'first' die-level failure analysis center
Beefing up its Asian operations, NXP Semiconductors will put up Asia's first and its second die-level failure analysis center in Taiwan.
2015-01-30 Non-volatile memory IP claims notable die cost reduction
The DesignWare Medium Density NVM IP products from Synopsys bring flash functionality to 5V CMOS and BCD process technologies, where embedded reprogrammable NVM is needed.
2005-10-14 Multi-die packaging gains ground, says analyst
Applications such as cellular telephones, Bluetooth, and digital cameras are going to cause the market for high-density packaging market to grow by 32 percent in 2005 to 1.5 billion units, according The Information Network, a market research company.
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