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2004-01-26 Zhougxun switches offer >1,000Vac dielectric strength
Zhejiang Zhougxun Electronics Co. Ltd has expanded its portfolio of pushbutton switches with the release of the PBS-111 series.
2004-01-08 We Net plugs offer 500V dielectric withstanding voltage
The RJ-45 plugs from We Net Co. Ltd are housed in polycarbonate material with copper alloy contacts and 50?inches of gold plating over nickel.
2003-12-12 Wave Tech connectors have 500V dielectric voltage
Wave Tech Co. Ltd has released its CF series of SMT type compact Flash memory-card connectors that features a PBT glass-filled UL 94V-0 insulator material, zinc alloy shell, and phosphor bronze terminal.
2005-07-06 Transistor's gate stack structure uses Hf-based, high-k dielectric
NEC Corp. has announced the development of a transistor featuring a new gate stack structure using a Hf-based, high-k dielectric and a metal gate electrode
2005-01-20 Transistor's gate stack structure uses Hf-based high-k dielectric
NEC and NEC Electronics announced the development of a transistor that features a new gate stack structure using a Hf-based high-k dielectric and a metal gate electrode.
2004-09-20 Toko releases 'smallest' coaxial dielectric filters
Toko disclosed the availability of a new series of coaxial dielectric filters that is available in two models.
2006-05-19 Thermal dielectric material offers high temp/voltage properties
Laird Technologies has introduced the T-preg HTD, a thermally conductive, electrically insulating pre-impregnated composite fiber.
2003-01-17 Sprague-Goodman rolls plastic dielectric trimmer caps
The company has expanded its line of FILMTRIM plastic dielectric trimmer capacitors.
2006-07-11 SLC capacitors deliver high dielectric constant
AVX has introduced the Ultra Maxi series of single-layer ceramic capacitors claiming a record high dielectric constant.
2008-10-14 Resistors tout 4,000Vac dielectric withstanding voltage
TT electronics IRC has raised the dielectric withstanding voltage of its high density power resistors to 4000Vac.
2009-02-23 PCB dielectric material selection and fiber weave effect on high-speed channel routing
This application note is for printed circuit board (PCB) designers planning to use the high-speed transceivers available in Stratix II GX and Stratix IV GX devices and addresses two key design topics.
2013-11-22 Novel dielectric material to enhance eWLB packages
Nanium released an improved dielectric material and process solution for its fan-out wafer-level packaging (FOWLP) technology, embedded wafer-level ball grid array (eWLB).
2003-04-21 NEC to use Applied Materials dielectric films
NEC Electronics has selected Applied Materials Inc.'s Black Diamond and BLOk (Barrier low-k) dielectric films for its UX6 chips.
2004-09-22 NEC develops high-K gate dielectric film transistor
NEC Corp. and NEC Electronics Corp. have developed a technology for the realization of sub 0.1?m generation, low-power SOC devices, which require high-K gate dielectric film to suppress leakage current.
2002-06-10 KLA-Tencor rolls system for gate dielectric processes
KLA-Tencor Corp. has introduced Quantox XP, its next-generation, non-contact, in-line electrical monitoring and characterization system for controlling advanced gate dielectric processes at 130nm and below nodes.
2003-12-17 Kiu Wai encoders with 50Vac dielectric strength
Kiu Wai Electronics Mfg Ltd has announced the release of its EC16 position encoders that feature a rating power of 12Vdc 4mA, insulation resistance of 50Vdc 10 megohms, dielectric strength of 50Vac for 1 min, and contact resistance of 100 megohms (first period) and 200 megohms (after used).
2002-04-15 KEC dielectric material has dielectric constant of 38
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2005-04-19 Intel may drop high-k gate dielectric, despite work on next version
Intel Corp. may drop the use of a high-k dielectric in the transistor gate stack at the 45nm manufacturing process node, according to Paolo Gargini, Intel Fellow and the company's director of technology strategy.
2013-06-25 Imec creates dielectric to scale NAND flash below 20nm
Researchers from Imec have created a dielectric that is scalable in thickness, making the material promising for further scaling of 2D NAND flash memory below 20nm.
2007-06-18 IBM pitches air gaps as 'ultimate' dielectric
IBM Corp. has vowed to commercialize the ultimate dielectrica pure vacuumbetween metal lines of its 32nm chips, thereby reducing parasitic capacitance on interconnection layers by 36 percent.
2013-08-02 High-voltage power amplifier for dielectric applications
Trek's Model 20/20C-HS high-speed, high-voltage amplifier provides high speed of response with slew rate greater than 800V/us and output current to 60mA peak AC.
2006-03-16 GaAs dielectric points past silicon
Freescale Semiconductor's laboratory recently announced that it has cracked a 40-year-old puzzlehow to deposit a defect-free dielectric on GaAs.
2004-06-17 Excel USB connectors with 750Vac dielectric strength
The ESB 0 series of USB connectors from Excel Cell features a dielectric strength of 750Vac and durability of 1,500 cycles.
2011-06-28 Dielectric capacitors for high voltage RF apps
AVX has expanded its HQ Series MLC surface mount RF power capacitors to include P90 dielectric versions for high-power, high-frequency applications.
2004-01-22 Coils transformers have 1.5kVrms dielectric strength
The line matching audio transformers from Coils Electronic Co. Ltd has a dielectric strength of 1,500Vrms (between primary and secondary).
2013-01-28 Characterising low-dielectric-constant films
Read about accurate and substrate-independent characterisation of films as thin as 200nm.
2003-04-22 AVX capacitor features new dielectric material
AVX Corp. has announced the availability of a new series of SLCs that is capable of operating over the -55C to 125C temperature range.
2002-07-09 ASM receives patents for PECVD low-k dielectric technology
ASM Int. N.V. has been granted patents no. 6,352,945, 6,383,955 and 6,410,463 by the U.S. Patent & Trademark Office.
2001-11-01 A novel SBU dielectric and coating system
This technical article describes a novel dielectric coating system as well as a new material that enhances thin foil use and via plugging.
2004-07-20 Wirebond woes reported for advanced low-k die
Problems in wirebonding to dice that use a particular low-k dielectric material in the interconnect stack were reported in a technical paper given Wednesday (July 14, 2004) at the Semi Technology Forum within the Semicon West exhibition.
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