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2010-02-02 802.11n to drive Wi-Fi chip market this year
Worldwide Wi-Fi IC shipments in 2009 increased approximately 28 percent y-on-y, according to data from ABI Research.
2009-12-21 64Gbyte NAND flash packs dedicated controller
Toshiba Corp. launched a 64Gbyte embedded NAND flash memory module, claimed to achieve the highest capacity yet in the industry.
2010-06-09 5Mpixel sensor brings 1080p HD video to handsets
From OmniVision Technologies Inc. comes a complete 5Mpixel SoC camera solution aimed at penetrating the high-volume autofocus camera phone market.
2010-02-18 5MP image sensor delivers 720p HD video at 60fps
OmniVision Technologies Inc. has launched the OV5647 1/4-inch, 5Mpixel RAW CMOS image sensor based on its 1.4?m OmniBSI backside illumination (BSI) technology.
2009-11-03 3D TV: Sure win or long shot?
Participants at the FPD International 2009 panel stressed key reasons why they must seize the moment now to push 3D into the home and a list of reasons why it remains a long shot.
2009-02-06 3D sensor moves from car to CE
Emerging consumer electronics applications have prompted smart 3D sensor chip maker Canesta Inc. to adapt its 3D CMOS image technology from automotive applications to a new consumer version of its 3D image processing chip.
2008-08-12 32Gbyte NAND flash meets eMMC, eSD standards
Toshiba Corp. has launched the 32Gbyte embedded NAND flash memory devices that are touted to offer the largest density yet, plus full compliance with the eMMC and eSD standards.
2010-10-12 30nm-process 2-Gb DDR3 SDRAM yields 45% more chips per wafer
Elpida Memory Inc. announced completion of a 30nm process 2-gigabit DDR3 SDRAM.
2006-06-22 300mA dual ULDO offers 'lowest' dropout
Micrel's new voltage linear regulator is touted to offer the industry's lowest dropout for a 300mA dual LDO.
2005-10-10 2MP image sensor from OmniVision touts full integration
OmniVision Technologies claims to offer the industry's first fully integrated 1/4-inch 2-Megapixel CameraChip, giving the company a leadership position in the mobile camera phone market.
2006-02-15 2MP CameraChip integrates AF control
OmniVision unveiled the OV2645, which it touts as the world's first 1/4-inch, 2 Megapixel CameraChip with fully integrated autofocus (AF) control on a single chip.
2009-10-15 18Mpixel camera phone, anyone?
It won't be long before your camera phone will turn into a real camera with a real phone. But what will it take to make that happen? And will it affect alleven the most basic phones?
2009-09-14 160GB HDDs offer high durability, quiet operation
Toshiba Corp.'s new single-platter 1.8-inch HDD offers industry's highest areal density of 723Mbit/mm2.
2015-03-09 15 innovative things seen at MWC 2015
Here is a presentation of 15 curious things spotted at the recently concluded Mobile World Congress in Spain, which highlighted many connected devices and technologies.
2004-08-05 1394 finding design-ins despite competition
The market for products meeting the IEEE 1394 specification continues to be characterized by both tremendous opportunity and enormous ambiguity, according to a report by In-Stat/MDR.
2006-02-28 1.3Mpixel sensor improves image quality for camera phones
Avago Technologies raises the price and performance bar with its 1/4-inch optical format, 1.3Mpixel CMOS image sensor for camera phones.
2005-08-12 1.3MP CMOS image sensor simplifies camera module design
Micron's new 1.3 Megapixel CMOS image sensor is equipped with the company's proprietary low-noise, high-sensitivity DigitalClarity technology that promises brilliant color images even under some of the poorest lighting conditions.
2006-06-09 1,024bit EPROM runs on as low as 2.2V
Dallas Semi has introduced the DS25LV02, a 1,024bit EPROM designed to operate from supply voltages as low as 2.2V.
2007-12-21 'Smallest' TVS diodes absorb up to 20kV EDS
Infineon has developed what it claims to be the smallest TVS diodes, with a footprint of 0.6mm x 0.3mm and a height of 0.3mm.
2010-10-14 'Smallest' linear Hall sensor IC boasts I²C interface
austriamicrosystems' AS5510 dubbed the smallest linear Hall sensor IC
2009-03-06 'First' quarter-inch image sensors integrate EDoF
STMicroelectronics has introduced the market's first quarter-inch optical format, 3Mpixel raw Bayer sensors with integrated Extended-Depth-of-Field (EDoF) capabilities. The image sensors offer an alternative to auto-focus camera solutions.
2006-06-07 Cool power MOSFETs target portable apps
ON Semi's Cool family of power MOSFETs promises to deliver high performance and design flexibility for portable applications.
2002-02-07 null
The unit volume for CMOS sensors is projected by iSuppli Corp.'s Market Intelligence Service group to grow from 18 million devices worth in 2001, to 72 million units by 2005.
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