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2013-06-06 Fraunhofer, EV Group work on direct wafer bonding for solar cells
Fraunhofer ISE collaborated with EV Group to develop equipment and process technology to enable electrically conductive and optically transparent direct wafer bonds at room temperature.
2013-05-29 Removing field failures at wafer level (Part 1
Here's a look at Sonoscan's new automated wafer inspection system and its advantages
2012-01-09 Rapid acoustic inspection for 300MM wafer generation (Part 2
Read about a system that is touted to deliver superior precision, resolution and throughput in wafer inspection
2011-12-30 Rapid acoustic inspection for 300MM wafer generation (Part 1
As wafers become larger and individual die become smaller, acoustic micro imaging is developing the non-destructive tools that can remove defective die to boost reliability and yield.
2007-06-01 IBM gets on the road to 3D packaging
News that IBM Corp. this year will sample its first commercial devices to make direct metal connections between chips marks a small but significant milestone on the road to 3D packaging
2014-05-19 Silicon photonics oil the works for high-speed switching
Optical components are integrated with multi-chip modules using packaging advancements with micro bumps and module substrates. The next target is to scale the technology in a cost-efficient approach.
2014-01-23 Optimise CMOS for MEMS-based frequency control
CMEMS fabrication process can be used to fabricate both micro-electromechanical and CMOS electronic devices on a single die.
2006-07-01 Here comes the sun
Sticker shock at the gas pumps combined with concerns over the diminishing supply of non-renewable energy sources like coal, oil and natural gas have added new urgency to the search for alternatives.
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