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2011-03-04 JSR, IBM launch self-assembly litho structure
Targeted at the sub-20nm half-pitch node, the new DSA technology enables phase separation, resulting in good profiles and more flexible use in both logic and memory applications.
2012-02-14 Imec rolls 300mm directed self-assembly process line
The fab-compatible patterning solution can pave the way for scaling EUV lithography to production level, pushing the boundaries of 193nm tech.
2011-03-07 Directed self-assembly gains steam
Despite its inherent defects, DSA could have applications in areas such as flash memory production where the regular structure of circuits and cost sensitivity of the market may make it attractive.
2012-11-16 Disc storage capacity boosted self-assembling polymers
Researchers at the University of Texas-Austin claim to have developed a method of directed self-assembly that could boost hard drive capacity fivefold.
2015-02-20 Imec improves defectivity to near single-digit values
imec and partners, Merck & Co Inc. and Tokyo Electron, have improved directed self-assembly defectivity, approaching single-digit values. Results will be reported at the SPIE Advanced Lithography conference next week.
2014-03-04 DSA technique pushes chip fabrication below 20nm
The MIT researchers' directed self-assembly technique utilises block copolymer self-assembly that facilitates the reduction of pattern sizes in photolithography and electron-beam photolithography.
2012-02-17 TEL joins DSA, maskless litho projects
Japan's Tokyo Electron Ltd (TEL) is working with on two collaborative lithography research projects spearheaded by the CEA-Leti research institute.
2010-03-02 SPIE Litho wraps with delays, double-patterning
The themes of this year's SPIE Advanced Lithography event were clear: D and Ddelays and double-patterning. Indeed, EUV is delayed. So is maskless. And nanoimprint is still stuck in R&D.
2014-03-20 Samsung announces prod'n of 20nm-based 4Gb DDR3 memory
A key element of the latest design and manufacturing technology by Samsung is a modified double patterning and atomic layer deposition that allows for continued scaling.
2010-04-07 Quest for the right road to lithography
The industry has long known that without a viable NGL solutionwhich most assumed would be EUVMoore's Law scaling would slow and the secular growth rate of the IC industry would decline.
2012-03-08 Imec rolls 14nm process development kit
Claiming an industry first, the PDK is targeted at next-generation technologies such as FinFET and EUV lithography.
2010-12-21 IBM, AZ Electronic Materials work on next-gen litho
IBM Research-Almaden will team up with AZ Electronic materials to develop materials based on block copolymers targeted at DSA processes. DSA technology is a potential bottoms-up lithography process meant to meet 16nm and 11nm half-pitch design requirements.
2009-08-19 IBM taps DNA scaffolding to build tiny circuit boards
Researchers have developed a way to use DNA origami structures with current chip manufacturing equipment.
2007-05-07 New IBM tech enables faster ICs
IBM scientists announced that they have devised a way to create vacuum spaces between copper wires in semiconductors, which will reportedly lead to chips that consume less power and run faster.
2016-01-04 Nanoparticles carve straight paths on semiconductor surface
Scientists from NIST found that gold particles can operate like snow blowers, boasting a trenching capability that paves the way for innovative uses such as disease diagnosis and DNA forensics.
2010-03-03 Nanoimprint still awaits takeoff in HDDs
While nanoimprint has not cracked mainstream production in semiconductor fabs, as some had hoped at one time, the technology has been delayed in perhaps its biggest potential market: HDDs.
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