Global Sources
EE Times-Asia
Stay in touch with EE Times Asia
EE Times-Asia > Advanced Search > direct-write

direct-write Search results

?
?
total search38 articles
2010-03-11 Long road still to e-beam direct-write litho
While multiple development efforts on e-beam direct-write lithography have reported progress, a one prominent lithography researcher claims production tools are still a minimum of five years away.
2010-10-26 E-beam litho system supports mask, direct-write apps
The electron-beam lithography system from Vistec Electron Beam GmbH will support both mask writing and direct-write applications.
2011-03-14 U.S. Circuits obtains Maskless Lithography DI system
Maskless Lithography Inc. reports that U.S. Circuits Inc. has taken delivery of a direct-write imaging system at its Southern California facility.
2009-02-26 Chip vendors unite for e-beam initiative
The eBeam Initiative, a multi-company effort dedicated to the advancement of e-beam direct-write technology for semiconductor prototyping and low-volume manufacturing, was formally launched at the SPIE Advanced Lithography.
2006-07-18 Vistec unrolls new electron beam lithography tool
Vistec announced it has already accepted orders for the new VB300 electron beam lithography tool targeting nano-lithography e-beam direct write and next-gen mask appslications.
2007-06-06 R&D partnership tackles nanostructure fabrication
Genisys, JEOL and Cornell's Nanoscale Science and Technology Facility are partnering to develop direct write e-beam data preparation and electron process correction technology for nanometer-range structures.
2008-06-03 Maskless tools to boost ASIC throughputs
E-Shuttle Inc. is set to improve its direct-write e-beam capabilities and explore the future use of next-generation maskless tools from Mapper Lithography NV and other startups in the arena, making e-beam tools a probative technology in mainstream production fabs.
2009-10-06 D2S, Advantest partner on maskless SoCs
D2S unveils packed stencil technology that works with Advantest's e-beam direct write lithography equipment.
2009-06-15 TSMC weighs in on e-beam, EUV litho
Foundry giant Taiwan Semiconductor Manufacturing Co. Ltd is still backing two horses in the race to the next lithography extreme ultraviolet lithography (EUVL) and clustered electron-beam.
2011-09-09 TSMC to start EUV lithography
In two weeks, TSMC will start using its first extreme ultraviolet machine.
2010-03-01 TSMC takes on 40nm yields, high-k, litho issues
At the TSMC Japan Executive Forum in Yokohama, Shang-Yi Chiang, senior VP of R&D at TSMC, addressed several issues about the silicon foundry giant.
2009-03-03 TSMC details litho roadmap, taps maskless
Taiwan Semiconductor Manufacturing Co. Ltd has detailed it lithography roadmap and said it is still backing maskless technology at the SPIE Advanced Lithography conference.
2009-01-14 Trio works on e-beam solutions
Vistec Electron Beam Lithography Group, CEA/Leti and D2S Inc. have announced a collaboration focused on refining and validating advanced design-for-e-beam (DFEB) solutions for the 45nm and 32nm nodes.
2008-10-14 Trio collaborates to develop maskless ICs
Fujitsu Microelectronics Ltd and e-Shuttle Inc. have agreed to adopt D2S' advanced design for e-beam (DFEB) technology, starting with a 65nm low power (LP) library.
2006-10-10 TFT equipment market to reach $1.14B in '07, says DisplaySearch
TFT array exposure equipment market is expected to reach $1.14 billion in 2007, and is forecast to range around $1 billion per year through 2009 according to the latest report of DisplaySearch.
2012-02-17 TEL joins DSA, maskless litho projects
Japan's Tokyo Electron Ltd (TEL) is working with on two collaborative lithography research projects spearheaded by the CEA-Leti research institute.
2005-04-27 STMicro, eASIC trumpet 24-hour turnaround chip tape-out
Structured ASIC specialist eASIC Corp. has licensed its 0.13?m technology to STMicroelectronics and claims the Franco-Italian group achieved 24 hours turnaround from RTL to tape-out for a printer platform chip.
2010-03-02 SPIE Litho wraps with delays, double-patterning
The themes of this year's SPIE Advanced Lithography event were clear: D and Ddelays and double-patterning. Indeed, EUV is delayed. So is maskless. And nanoimprint is still stuck in R&D.
2015-03-25 Semicon manufacturing welcomes EUV lithography progress
The recent SPIE Advanced Lithography conference showcased a number of headway in extreme ultraviolet lithography that could possibly redefine how the process is being conducted.
2004-12-09 Plastic Logic, E Ink, team for large area flexible display
Plastic Logic Ltd and E Ink Corp. have reached a nonexclusive agreement to cooperate on the design and fabrication of flexible all-plastic electronic displays, Plastic Logic said Monday (Dec. 6).
2010-10-21 PCM gears up for prime time
Blending the attributes of NOR- and NAND-type flash memory, EEPROM memory, and DRAM, phase-change memory is presented as the best candidate to continue the scaling of NVM.
2009-03-02 Panelists skeptical on next-gen litho
Experts debated and sparred over the future of patterning during a panel discussion at the SPIE Advanced Lithography conference.
2002-12-26 Nanoimprint lithography ready to make its mark
A potentially low-cost form of lithography affectionately known as
2002-01-02 Micronic expands SLM licensing agreement with German group
Micronic Laser Systems AB has expanded its cooperation with Fraunhofer Institute for Microelectronic Circuits and Systems (IMS).
2009-03-06 Litho woes: R&D gap, downturn
It was a triple-whammy for lithographers at the SPIE Advanced Lithography conference as the industry continues to be plagued by an R&D gap, technology delays, and, of course, the lousy economy.
2007-02-27 IBM pushes for immersion at 22nm
IBM outlined last week its lithography roadmap, saying that it would extend 193nm immersion lithography down to the 22nm node for logic production.
2010-09-22 Forecast: all leading-edge designs will require e-beam
D2S Inc. CEO Aki Fujimora discusses the role of electron beam lithography in the future of semiconductor manufacturing.
2004-11-17 Flash memory device with 10MBps write speed
Samsung disclosed that it has developed a 1Gb OneNAND flash memory device utilizing the company's advanced 90nm process technology.
2008-11-17 Fab tech roll call: survival of the fittest
Manufacturers are rolling out 45nm ICs, with 32nm designs in the works; 22nm and even smaller devices are in R&D. But delivery of chips at 32nm and beyond won't be a cool breeze.
2012-03-15 Electronics firms clamour for more collaboration
Executives of Cadence, TSMC and ARM are calling for other companies to step up their collaborations to deal with the growing complexity of technologies of semiconductor design.
Bloggers Say

Bloggers Say

See what engineers like you are posting on our pages.

?
?
Back to Top