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2008-08-29 STATS ChipPAC, Infineon ink eWLB manufacturing deal
STATS ChipPAC Ltd has entered into an agreement with Infineon Technologies AG to provide manufacturing services for products based on Infineon's first generation embedded eWLB technology.
2013-11-22 Novel dielectric material to enhance eWLB packages
Nanium released an improved dielectric material and process solution for its fan-out wafer-level packaging (FOWLP) technology, embedded wafer-level ball grid array (eWLB).
2011-10-10 eWLB tech aimed for mobile, cloud apps
STATS ChipPAC's FO-WLP technology platform combines eWLB, TSV and IPD to enhance packaging solutions.
2007-11-14 Infineon reveals new packaging technology
Infineon Technologies unveils a new package technology, and has tapped Advanced Semiconductor Engineering as its IC packaging partner.
2013-08-22 Embedded packaging cuts PoP height by 40%
STATS ChipPAC's ultra thin embedded Wafer Level Ball Grid Array (eWLB) technology offers height reduction in the bottom PoP architecture to provide an ultra thin z-height of 0.3mm.
2015-01-21 Compact module packs 10 dies side-by-side in a 2 x 5 array
The module touts 200um edge spacings and uses the company's Fan-Out/embedded Wafer-Level BGA (eWLB) technology to bring about a compact module intended for medical devices.
2008-08-11 Trio seeks to cut costs in chip packaging
Infineon has granted licenses for its embedded Wafer-Level BGA chip packaging technology to competitor STMicroelectronics as well as STATS ChipPAC to lower costs and achieve higher market acceptance.
2012-01-16 STATS ChipPAC builds new factory
Once the new building is completed, STATS ChipPAC's combined manufacturing space in Singapore will increase from 55 277.30 to 73 579.21 square meters (595,000 to 792,000 square feet).
2013-04-18 SiGe transceivers target mm wave wireless backhaul
Infineon's BGTx0 family claims to simplify system design and production logistics by replacing more than 10 discrete devices.
2012-12-24 Rudolph buys Azores, enters back-end litho market
Rudolph has entered the back-end advanced packaging lithography market with the new JetStep Lithography System, a disruptive innovation featuring a 2X reduction stepper.
2011-01-04 Market trends and the electronics industry
As the cost of IC design advanced nodes increases, companies are also looking at embedded systems to shorten the development cycle and increase the potential for hardware reuse.
2008-06-10 Infineon readies tiny 3G solution for HSDPA, HSUPA
Infineon Technologies AG has come up with a new generation of 3G platform family.
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