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2005-02-14 TTPCom, NEC Electronics to team on dual-mode 3G/2G chips
TTP Communications plc and NEC Electronics Corp. announced Thursday (Feb. 10) they would join forces to develop dual-mode chips that will include TTPCom EDGE/GPRS/GSM silicon and software architecture.
2013-04-04 Spreadtrum rolls out dual-core 1.2GHz smartphone chipset
Spreadtrum's SC8825, which supports dual-mode TD-SCDMA/HSPA and the SC6825, which supports EDGE/GPRS/GSM, are based on a highly efficient multi-core architecture.
2008-02-04 'First' programmable multimode LTE modem rolls
NXP Semiconductors will demonstrate what it claims as the world's first LTE/HSPA/UMTS/Edge/GPRS/GSM multimode baseband platform.
2013-03-20 Spreadtrum wins big in smartphone market
Spreadtrum leads in China Mobile's TD-SCDM-based smartphone market with its single-core smartphone platforms. The company is said to have had more than a 50 percent market share among China Mobile's TD-SCDMA handsets in 2012.
2014-01-29 Spreadtrum rolls latest single-core smartphone platform
The platform integrates a Cortex-A7 CPU running at speeds up to 1.2GHz as well as GPS, WiFi, Bluetooth and FM connectivity functions.
2012-09-19 Spreadtrum moves into WCDMA market
China fabless firm Spreadtrum is seeking to venture into the non-TD-SCDMA market into integrated baseband/apps processor smartphone platforms to compete with major players such as MediaTek and Qualcomm.
2015-01-20 Shift in China's mobile market threatens U.S. chip companies
Among big changes in the works are China Mobile's shift in procurement policy from five-mode smartphones to three-mode models and plans among Chinese apps processor vendors to embrace connectivity.
2006-05-29 RTLinux-powered cellphones may be in production soon, says FSMLabs
RTLinux-powered 2.5G and 3G cellphones may be in production soon, said FSMLabs.
2006-05-11 Qualcomm samples UMTS solutions ahead of schedule
Qualcomm will be sampling three of its UMTS solutions ahead of schedule in order to enable the quicker delivery of affordable and compelling 3G handsets to the UMTS market.
2006-11-07 Nexperia solution powers SIM Tech UMA phones
NXP Semiconductors announced that SIM Technology is using the Nexperia cellular system solution 6120 to provide Unlicensed Mobile Access handsets around the world.
2010-02-18 Modem ref design supports HSPA speeds
U-blox has expanded its high-speed wireless connectivity reference design portfolio with full high-speed packet access (HSPA) capabilities: 7.2Mbit/s download and 5.8Mbit/s upload speeds.
2008-01-03 Fujitsu equips mobile suite with 3.5G connectivity
Fujitsu PC Asia Pacific has released its 3.5G-enabled mobile suite packed with high speed connectivity in seven different models, spanning across display sizes of 5.6- to 14.1-inches wide.
2013-01-18 Ever elusive LTE design wins continue to plague CES
Companies such as ST-Ericsson, Renesas Mobile, NVidia and Marvell have spent the past year developing LTE base band chips, but the still no news about actual design wins for the technology.
2011-01-31 Compiler enables higher productivity for development of DSP algorithms
Synopsys Synphony Model Compiler offers higher productivity for Microsemi customers developing DSP algorithms, offering a more automated implementation and verification flow for engineers using MATLAB/Simulink.
2006-10-23 Broadcom WCDMA processor powers Panasonic 3G handsets
Broadcom announced that its WCDMA processor is now shipping in Panasonic's new SoftBank 705P 3G/GSM mobile handset.
2003-06-23 Broadcom takes Edge to 200Kbps
Broadcom Corp. has begun sampling a complete cellular handset platform based on the Edge standard.
2004-07-21 Broadcom completes acquisition of Zyray
Broadcom Corp. has completed the acquisition of Zyray Wireless Inc., a provider of baseband coprocessors addressing WCDMA mobile devices.
2003-12-18 Broadcom adopts CEVA DSP core
CEVA Inc., a licensor of DSP cores and integrated applications, announced that Broadcom Corp. has deployed the CEVA-TeakLite DSP Core.
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