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2002-04-29 Maxwell IC packaging protects against nuclear radiation
Maxwell Technologies Inc. has announced the availability of the Xray-Pak packaging solution that is intended to shield ICs that process and store data in military satellites from the radiation effects of nuclear blasts
2015-07-03 Examining 3D embedded substrate power packaging
Here is a look at 3D embedded substrate power packaging technologies, which will be increasingly deployed in everything from cell phones to hybrid electric vehicles
2005-02-02 PCB 'synthesis' product automates component placement
A startup launched by CMU researchers is preparing CircuitSpace, a PCB 'synthesis' tool that claims to be the first to bring user-assisted automated component placement to PCB designers
2008-01-10 New packaging tech integrates cooling, power generation
Nextreme has integrated cooling and power generation into the copper pillar bumping process used in high-volume electronic packaging
2015-10-26 Impact of wearables, IoT on electronic design
Today's IoT and wearable products must deliver ever-increasing capabilities in smaller packages with more aerodynamic shapes. Engineers will need all the help they can get.
2004-11-17 Component makers' designs comply with RoHS
Technology Forecasters Inc. recently released the results of a survey done with component manufacturers
2014-10-29 Advances in power supply packaging
Here's a look at where the power industry is going in terms of component integration and thermal management. It also covers the developments in DC/DC power converter density
2014-04-10 Advances in power converter packaging
Find out how packaging advances are matching semiconductor progress in power converter miniaturisation
2006-05-01 3D flexible circuits ease packaging
When it comes to designing flexible circuits, there is no better teacher than your fabrication house, says Andy Buja. He shares a few more design tips.
2016-03-15 The endless pursuit of smaller packages
In this article, we explore the creativity in semiconductor package integration, while anticipating the release of the Samsung's Galaxy S7 and the iPhone 7.
2002-03-26 Market upswing on the horizon?
The electronic components industry is back in business, at least that's what research organizations and publications have proclaimed over the past few weeks
2011-03-22 Supply issues trigger panic buying among OEMs
Electronic distributors have noted increased orders from OEM customers who are all making sure they have enough inventory on hand to keep them going despite supply disruptions
2002-04-16 SPI tactile sensor measures 0.1psi to 9,000psi
The Xsensor electronic tactile force and pressure indicating sensor allows engineers real-time monitoring of 0.1psi to 9,000psi of force produced between any two contacting, impacting or mating surfaces
2002-11-01 Photonic integration takes a new shift
Changes in achieving silicon optical bench integration raised the issue whether the integration of electronic and photonic components is still necessary
2012-01-05 New 28nm platforms: Transforming Asia from world's factory to global R&D hub
The convergence of several long-term economic, market and technological trends are driving demand for a new class of devices that combine the capacity and customizability of ASICs, flexibility of FPGAs and cost effectiveness of ASSPs.
2002-03-21 Multilink, IPAG collaborate on optoelectronic solutions
Multilink Technology Corp. has cooperated with Innovative Processing AG (IPAG) for the marketing, design and test of 40Gbps optical PIN diode receivers, electronic traveling wave amplifiers and optoelectronic, monolithically-integrated devices
2014-06-02 Mitigating counterfeiting requires a combination of methods
Layering a combination of method to come up with a more robust solution to foil the entry of counterfeit products in the supply chain involves considering the product, packaging and other labelling
2012-10-04 Globalfoundries partners up with timing product specialist
Sand 9's micro-electromechanical systems (MEMS) timing devices provide an alternative with performance and quality improvements over legacy quartz crystal solutions.
2008-10-01 Chip package options abound
When creating a new IC, device packaging is often overlooked until the end of process. However, choosing the right package can reduce time-to-market and create tangible benefits for customers. Here is a look at some of the available options and what they have to offer
2002-09-04 Shipley to acquire fiber-optic components provider
Shipley Co. LLC will acquire the technology, equipment, IP, and remaining workforce of Haleos Inc.
2002-03-05 DuPont buys 16.6 percent stake in Merrimac
DuPont Electronic Technologies has purchased from Merrimac Ind. Inc. a 16.6 percent equity stake worth $5.3 million
2002-03-07 China should install DWDM to increase T/R pair use, says ElectroniCast chief
With China's entry into the World Trade Organization, the country is expected to demonstrate strong growth as they compete with international rivals in the fiber-optic optoelectronic transmitter/receiver pairs (T/R pair) market.
2008-01-14 SoC supports full 1,080p for HDTVs
Toshiba America Electronic Components Inc. has added the TC90413XBG to its line of SoCs for mass-market ATSC high-definition LCD TVs
2006-04-11 Processor accepts analog A/V signals for DTV, STBs
Toshiba America Electronic Components announced the TB1311AFG analog video front-end processor
2014-03-25 Power trends take spotlight at APEC 2014
During this year's APEC, global players such as Fairchild, Intersil and Texas Instruments revealed their business plans and product offerings in anticipation of the power efficiencies demanded by next-generation electronic devices
2012-05-24 On-ground molded interconnect antenna touts tiny footprint
Molex's 2.4GHz SMD on-ground antenna weighs in at only 0.03g measuring 3 x 3 x 4mm for tablets, headsets, smart meters and other portable electronic devices running Bluetooth, WiFi, ZigBee and other wireless standards
2015-05-12 Impact of piling on package manufacturing
To accomplish various performance enhancements, packaging engineers should consider intriguing combinations being constructed at the chip to package level
2011-06-06 Fusible resistors offer failsafe operation
Stackpole Electronics has rolled out its 4watt axial leaded fusible wirewound SP3A Series resistors that have achieved "UL Recognized Component" status through qualification to the UL1412 standard
2007-07-20 Epoxy cures at room temperature, withstands 235C
Master Bond's EP33 is a two-component epoxy that cures at room temperature cure and withstands temperatures in the 205C to 235C range
2007-10-16 Adhesive provides 7,500psi tensile strength
Master Bond has unveiled the EP30D-12, a versatile two-component elastomer featuring high strength, toughness and chemical resistance developed
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