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2009-11-26 Terepac, IMEC unite for flexible packaging
Terepac's patented photochemical printing process places thinned silicon dies and passive components on flexible substrates.
2013-07-10 A*STAR IME consortium delve into advanced packaging
A*STAR IME and a group of semiconductor firms have teamed up to address reliability and performance issues in packaging solutions for compact sized consumer electronics and high power electronics.
2016-05-02 When shipping electronics, ensure proper temperature control
While the principles of proper shipping are largely common sense for goods such as electronics, for example, temperature control is vital but something that may not be the main priority
2007-09-20 Vietnam reaches for electronics dreamdespite hurdles
The Saigon Hi-Tech Park looks a little more than a flattened patch of land on the dusty outskirts of Ho Chi Minh City in Vietnam, but like the country itself, it's a place with big dreams that look set to become a realityhurdles notwithstanding.
2006-05-24 Verification IP tailored for consumer electronics storage
Denali Software announced the availability of a new verification IP package to address the wide range of storage device standards used in consumer electronics products
2006-12-08 UTAC expands Thailand packaging operations
United Test and Assembly Center Ltd will pump more than $100 million into its Thailand operations over the next three years as it shifts more low-end packaging activities to the country
2011-09-20 U.S. gov't backs printed electronics
Fuel efficiency, cost reduction and advanced electronics performance drive the ever-increasing government support for printed electronics
2004-07-14 Two firms apply carbon nanotubes to chip packaging
Carbon Nanotechnologies Inc. (CNI) has agreed with Kostat Inc. to develop and commercialize conductive polymers for module trays, carrier tapes and other semiconductor packaging and chip and die delivery applications
2012-04-02 TI expands IC packaging options with bare die
The bare die program allows customers to order small quantities as low as 10 pieces for initial prototyping purposes, and larger quantities of full waffle trays for production purposes.
2006-02-24 Thin-film electronics to reach $15.5B by 2011
Emerging thin-film electronics applications will generate $15.5 billion in revenue by 2011, according to a report from industry consulting firm NanoMarkets
2015-02-04 The missing link: WBG tech integration with power electronics
The power electronics industry has been concentrating its R&D on WBG technologies and under this strategy, silicon carbide and gallium nitride turned out to be powerful solutions, noted Yole
2016-03-09 Thailand semiconductor to tap into $280B car electronics space
Constituting a nearly $100 billion industry, Thailand's E&E sector has played a vital role in growing the country's economy and positioning Thailand as one of the semiconductor leaders in Southeast Asia.
2012-03-22 Supercapacitors to answer energy issues in portable electronics
An EC that combines the power performance of capacitors with the high energy density of batteries would represent a significant advance in energy storage technology.
2005-11-11 Sumitomo backs packaging firm with $20 million
Quantum Leap Packaging Inc., a provider of electronics component packaging that uses liquid crystal polymer compounds, is to receive $20M in equity finance from Sumitomo
2007-02-01 Streamline body electronics system development with model-based design
Model-based design reduces time-to-market by ensuring throughout the design process that the control system meets requirements, and by enabling hardware validation as it becomes available through hardware-in-the-loop testing.
2012-07-16 Smart packaging electronics to be available by 2014
Thin Film and Bemis aim to produce a time-temperature sensor to be used by consumer goods by 2014.
2004-08-04 Shoulder Electronics resonators operate to 8MHz
Shoulder Electronics released a new series of surface-mount resonators that operate within the 2MHz to 8MHz frequency range 0.5 percent
2007-08-17 Shifting trends in packaging industry favor big players
Industry insiders agree the packaging business is getting increasingly expensive, a trend that naturally favors larger players
2004-08-05 Sharp and Tessera expand packaging agreement
Seeking to broaden its exposure to the consumer electronics market, Tessera Technologies Inc. has expanded an existing agreement to license semiconductor packaging technology to Sharp Corp.
2014-07-24 Semicon R&D joint labs to advance future electronics
A*STAR IME and industry partners formed the Advanced Semiconductor Joint Labs to develop and innovate semiconductor technologies for future electronics markets
2004-03-16 SEMI: Semiconductor packaging materials market to reach $11.7B
The market for semiconductor packaging materials is expected to grow from $7.9 billion in 2003 to $11.7 billion by 2008, according to SEMI and TechSearch International's latest report entitled
2014-11-17 Samsung tops printed, flexible and organic electronics space
Samsung has an estimated PFOE R&D spending of $1.2 billion, as well as high open innovation scores due to its extensive outside partnerships and investments, stated Lux Research.
2007-07-06 Samsung advances technology for green electronics
Samsung announced it has succeeded in introducing more than a half dozen technological advancements that extend battery life in notebooks, MP3 players, digital cameras, video camcorders.
2003-08-07 Resistor networks feature high-density packaging
The RA and RB series of resistor networks from Hosonic Electronic (Zhuhai) Co. Ltd feature miniature and high-density packaging
2011-12-20 Rambus, ITRI team up for 3D packaging
According to the two organizations, they will work together as members of Ad-STAC to push system integration using silicon interposer technology.
2006-06-15 Probe 2000, Best Electronics open probe card ops in the Philippines
Probe 2000 and Best Electronics have agreed to set up a new probe card repair and manufacturing operation in Best Electronics' semiconductor test factory in the Philippines
2013-08-06 Printed electronics enables flexible sensor design
Discover how printed electronics is opening up large flexible sensor design opportunities
2014-03-27 Printable flexible timer set to enrich packaging
A demonstrator product for a flexible multi-functional timer is on its way to changing the landscape of packaging and other practical consumer applications
2015-03-20 Power module packaging eases power electronics issues
The power packaging market is on the rise, pulled by the interconnection and substrate segments, respectively 14 per cent and 13 per cent between 2014 and 2020, revealed Yole
2006-01-25 PMDs offer low packaging profiles
NEC Electronics' new low-voltage power management devices promise to deliver very low packaging profiles that enable designers to realize a smaller design footprint.
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