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2011-12-01 Cu electroplating cuts solar cell fabrication cost
Kaneka and Imec have detailed a silver-free approach in manufacturing heterojunction silicon solar cells that tout higher efficiencies.
2005-12-07 Casio uses Semitool's Raider tool for Pb-free electroplating apps
Semitool announced the delivery of a follow-on order for Semitool's electroplating Raider tool by Japan-based Casio Micronics Co. Ltd. Casio will use the Raider for advanced Pb-free electroplating applications.
2002-07-05 Unitive adopts Semitool's packaging platform
Semitool Inc. has announced the delivery of its electroplating system product, the Advanced Packaging Platform (APx), to Unitive Inc.
2005-05-17 STATS ChipPAC to offer 300mm electroplated wafer bumping services
STATS ChipPAC Ltd announced it will offer 300mm electroplated wafer bumping services in the third quarter of 2005 to complete its full turnkey service offering for advanced flip chip applications.
2001-09-11 Plated and solder dipped finishes for semiconductor components
This application note describes plated or hot-solder-dipped coatings for semiconductor component external solder terminations.
2001-04-01 Back-end copper metallization for flip chip
The IC industry's move toward the broad implementation of copper for back-end metallization is being driven by cost reduction that results from the use of an electroplating process.
2013-12-17 Printing process enables mass prod'n of solar cells
With the PiXDRO ink jet printing technology from Roth & Rau B.V., Meyer Burger offers a printing process suitable for the mass production of high efficiency solar cells in combination with electroplating.
2003-09-22 Wafer bumping technology qualified at Chartered
Unitive Semiconductor Taiwan Corp. (UST) has announced that its electroplated wafer bumping technology has been qualified at Chartered Semiconductor.
2003-07-21 TSMC, Applied Materials ink deal on ECP development
Taiwan Semiconductor Mfg Co. has entered into a joint development agreement with Applied Materials Inc. to develop TSMC's next-gen copper chips.
2005-05-13 TSMC to get wafer bumping service from STATS
Taiwan Semiconductor Mfg Co. (TSMC) customers will receive 300mm wafer bumping service from STATS ChipPAC Ltd.
2004-07-29 Semitool licenses seed layer enhancement to Ebara
Semitool Inc. has licensed its seed layer enhancement patents to Japan-based Ebara Corp.
2014-01-14 Powerstax transformer rectifiers boast up to 500 kVA
Transformer rectifier units from Powerstax allow an AC input to be converted into a steady DC output, delivering power levels of up to 500 kVA.
2004-02-16 Photosynthesis inspires molecular-assembly process
Nanotechnologists have recently succeeded in their attempts to build molecular systems based on highly efficient versions of the molecular "machine" that plants use to turn sunlight into energy.
2005-03-16 PC-based tools lower barrier to MEMS
Take a closer look at how low-cost PC-based tools can help hurdle the challenges in MEMS design.
2010-04-07 Partners work on solar cell electroless plating
The CNSE of the University at Albany and Technic Inc. have entered in an R&D partnership designed to enable critical improvements in manufacturing processes for solar cells.
2010-12-01 Optical inspection system targets 2mµ wafer defects
Altatech Semiconductor S.A. launches high-throughput AltaSight EyeEdge inspection system
2010-03-22 Novellus, IBM launch 3D TSV program
Novellus Systems and IBM Corp. are opening a joint development program to design a manufacturing-worthy, copper-based, 3D semiconductor through-silicon via (TSV) process.
2007-09-03 New COG mounting tech rolls for next-gen LCD
Seiko Epson has announced a new type of bump for mounting chips to drive next-generation LCD panels and new COG mounting technology for such panels.
2002-04-19 MEMSCAP rolls out MEMS-based microwave filters
MEMSCAP SA has developed what it claims to be the first commercially-available MEMS-based microwave filter for use in local multipoint distribution services, and is aimed at reducing the size and cost of customer premise equipment.
2015-04-16 Leading technologists talk about Moore's law
It has been 50 years since Moore's law came to light, and now three top technologists share their thoughts pertaining to Moore's law as well as their take on its proponent, Gordon E. Moore.
2014-05-30 Ionised PVD system facilitates void-free fill for TSVs
The system from Applied Materials employs improved ion density, directionality, and tunable energy to deposit barrier and copper seed layers inside high aspect ratio TSVs.
2003-10-22 IMEC, EVG partner on packaging, bonding techniques
Inter-university MicroElectronics Center (IMEC) and EV Group (EVG) have signed a joint development agreement on wafer-level packaging and MEMS wafer bonding.
2008-06-10 IBM splashes water on hot 3D chips
IBM's Zurich recently demonstrated 3D chip stacks that are cooled with water. The team predicted high-end IBM multicore computers will migrate from the copper-plate water-cooling method to the 3D chip-stack in five to 10 years.
2007-07-23 IBM fab starts using Pb-free packaging process
IBM Corp. has started using C4NP, a Pb-free process that reduces the cost of packaging flip-chip devices.
2006-09-18 Freescale develops wireless push
Freescale Semiconductor is stepping up its wireless push, armed with innovations in magnetoresistive memory and packaging, and guided by a new general manager, Sandeep Chennakeshu, recruited from Ericsson's handset group.
2014-05-14 Cobalt-sheated lines prevent electromigration in the 10nm
Applied Materials' platform encapsulates copper features in cobaltan element that adheres well to both the TaN barrier and copperto prevent voids and electromigration.
2012-05-08 Chinese firm builds MEMS wafer fab
Construction of the wafer fab started in March 2012 and the buildings will sit in the Hanking MEMS Industrial Park, which occupies about 647,497 square meters in Fushun Economic Development Zone.
2013-09-03 Buck converter digital peak current mode control
Learn about the buck converter control theory, system design concepts, hardware design concepts, and the steps involved in software implementation.
2002-07-25 ATMI purchases copper delivery system from Microbar
ATMI Inc. has purchased Microbar Inc.'s Copper 2.0 Suite Delivery and Waste Recovery System product line for advanced electrochemical deposition of copper.
2006-12-21 AMD goes 'green' with Pb-free bumping tech
Advanced Micro Devices has entered into an agreement to license Amkor Technology's Pb-free electroplated wafer bumping technology.
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