Global Sources
EE Times-Asia
Stay in touch with EE Times Asia
EE Times-Asia > Advanced Search > engineering teams

engineering teams Search results

?
?
total search482 articles
2011-04-14 New Atom chips to overcome Intel's mobile dilemma
Intel's 45nm Atom Z670 or Oak Trail, and a follow-up 32nm dual-core Atom chip called Cedar Trail should help expand its presence in the mobile market and enable slimmer netbook designs with larger displays.
2002-08-09 Neoreach, RFIC to co-develop W-CDMA chipset
Neoreach Inc. has signed an MOU with the RF Microelectronics Lab to co-develop a new RF CMOS.
2008-02-15 Multiband Mobile WiMAX receiver rolls from Agilent
Agilent Technologies has introduced a measurement receiver for Mobile WiMAX, extending the technology support of its existing drive test receiver platform.
2012-03-01 Modules for oscilloscopes support up to 100G Ethernet
The toolset from Tektronix is for the DSA8300 digital signal analyzer that provides a single mainframe solution for optical compliance test for Ethernet at speeds ò10G, 40G and 100G.
2016-01-08 Mixed-signal IC design: Forecasts for 2016
This article will examine the key trends, challenges, and emerging solutions in mixed-signal system design enablement, focusing on mixed-signal verification.
2010-09-01 Micron deploys Applied Materials' E3 process control system
Micron expects E3 to improve efficiency, product quality at 300mm wafer facilities
2008-04-02 Measurement receiver supports all wireless techs in all RF bands
Agilent has launched six new models for its W1314A measurement receiver platform designed to simultaneously measure all wireless technologies in all RF bands in a given market using a single unit.
2010-08-23 Marvell moves into PLC
Marvell has acquired the IP and assets of DS2, a supplier of high speed semiconductor solutions for powerline communications.
2004-05-14 Local talents propel India's tech industry
As more multinational companies settle their investments in India, the demand for more capable and qualified manpower will also increase.
2006-02-01 Language standards from IEEE open choices
Once seen as competitors, SystemC and SystemVerilog languages appear to be settling into largely complementary niches.
2008-10-14 Konarka builds 'largest' thin-film solar factory
Konarka Technologies Inc. has opened what it claims to be the largest roll-to-roll flexible thin-film solar manufacturing facility, preparing for the commercialization and mass production of its patent-protected thin film solar material, Power Plastic.
2006-05-01 IP's future: Survival of the fittest
Darwin's natural selection theory is well at work in the IP industry. New demands on the IP vendor are creating a more stringent selection process.
2005-08-17 Integrated PCI Express solution reduces third-party IP vendor risk
Rambus has delivered a fully integrated solution that allows optimization for a variety of applications.
2011-02-03 Implementation platform addresses Gigascale design
Synopsys Inc. releases the 2010.12 Galaxy Implementation Platform that addresses the scalability, convergence and throughput needs of gigascale IC design.
2013-02-26 Implement analogue functions in rugged FPGAs
By using digital implementations of analogue functions, engineers can add critical functionality without adding weight, power or size to the design.
2014-09-05 Imagination unveils MIPS I-class IP cores
The I6400 can be implemented across a very wide range of performance, power, and area operating points and achieves high frequencies in aggressive implementations.
2003-01-16 IC suppliers ramp system-level design
Many IC suppliers are morphing into subsystem-level suppliers for system integrators, so chip companies must therefore master integration at multiple levels - from IC to board to system
2010-11-04 Huawei seeks CTO for processors
The China telecom is looking for a chief technology officer for its processor technology group who can help the company cut down the processors it uses to two or three chips.
2008-11-17 How to grow an electronics giant
How Samsung Electronics Co. Ltd made the transition from a CE dwarf to a global brand is a well-told story. Less well-known, however, is the story of how Samsung, based in Seoul, South Korea, achieved its current supremacy by battling Japan companies on their own turfCE and memory chips.
2003-05-12 Fujitsu, Red Hat partner on Linux solutions
Fujitsu Ltd and Red Hat have signed a global partnership agreement to technically enhance and market Red Hat Enterprise Linux solutions for enterprise customers on Fujitsu's Intel-based servers.
2013-04-15 Fujitsu's mobile platform ships out with Synopsys' PHY IP
Synopsys and Fujitsu Semiconductor worked closely to maintain clear and consistent communication throughout the product development cycle to ensure a successful tape-out.
2003-10-09 Fujitsu named first foundry by Transmeta
Fujitsu Semiconductor has been selected by Transmeta Corp. as the first foundry for its 90nm Efficeon processors.
2007-10-18 Freescale, Continental co-develop 3-core MCU for car brakes
Freescale and Continental have joined forces to design a high-performance, triple-core MCU optimized for electronic brake system applications.
2008-02-18 Freescale's 3G MXC reference design gets upgrade
The 3G Mobile eXtreme Convergence (MXC) reference design for smart wireless devices has been enhanced by Freescale Semiconductor with newly-introduced design solutions which reduce cost and time-to-market for manufacturers, operators and integrators.
2007-03-05 Freescale reduces EDA tool flow
Freescale reported significant design efficiency improvements and a sizeable reduction in the number of EDA "tool flows" the company supports in its global development and design activities.
2014-10-01 Five hurdles to FPGA-based prototyping
Despite the advantages offered by FPGA-based prototyping, there are some significant hurdles to overcome. The five challenges presented here surfaced early on, and they haven't changed much over the years.
2015-02-02 Eternity Tech, NorthStar Battery team up for OPzV batteries
The companies partnered in developing a tubular 2V OPzV battery range with capacities from 300Ah-3000Ah geared for the telecom market.
2012-01-19 Electronics trends in Asia: Opportunities and challenges
Starting with semiconductor fabrication and memories and graduating to be the region of choice for the production of the latest smartphones and tablets, Asia has now become the undisputed center of electronics innovation.
2007-02-28 DNP, Takumi partner on photomask inspection
Dai Nippon Printing Co. Ltd teamed up with Takumi Technology to develop an automated criticality aware photomask inspection system aimed to reduce the manufacturing cost and turn-around-time of advanced photomasks.
2007-08-07 Digital radio test set targets emerging markets
Aeroflex has launched an entry-level version of its 6113 digital radio test set for mobile base stations, targeted primarily at emerging markets including Africa, South America and Eastern Europe.
Bloggers Say

Bloggers Say

See what engineers like you are posting on our pages.

?
?
Back to Top