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2004-08-05 Intel unveils EUV micro-exposure tool
Intel Corp. has installed an extreme ultraviolet (EUV) micro-exposure tool (MET) from Exitech Ltd at its development fab in Sta. Clara, California
2009-11-19 Toshiba touts EUV photoresist for 20nm process
Toshiba Corp. has developed a photoresist suitable for use with EUV lithography and proved its viability in the first 20nm generation process technology
2011-11-22 Issues of EUV lithography
Chip makers need EUV to be ready well in advance of when they plan to use it in volume manufacturing so they can establish chip design rules and tweak their manufacturing processes
2009-02-26 Firms gear for EUV litho despite tool delay
ASML Holding NV has slightly delayed the delivery schedule for its "pre-production" extreme ultraviolet (EUV) lithography tool by a quarter or so
2010-01-25 450mm, EUV, TSVs suffer further delays
IC Insights sees more delays for two emerging and key IC manufacturing technologies: 450mm and extreme ultraviolet (EUV) lithography
2011-02-11 Technique promises nanoscale resolution with visible light
The new technique uses multiphoton absorption with photoresists to achieve nanoscale resolution with focused visible light, thus delaying or even eliminating the need to move to extreme UV light sources
2008-07-16 Litho options falling behind process needs
Who killed high-index lithography, and was politics the cause? These questions remain for chipmakers looking for a route to next-gen manufacturing in a shifting lithography landscape.
2015-07-13 IBM surpasses Intel with 7nm node tech
IBM Research claims to have perfected the extreme ultra-violet (EUV) lithography and using silicon-germanium channels for its finned field-effect transistors (FinFETs
2007-02-27 IBM pushes for immersion at 22nm
IBM outlined last week its lithography roadmap, saying that it would extend 193nm immersion lithography down to the 22nm node for logic production.
2010-01-05 Grand challenges to to niggling nettles in 2010
EE Times editors list nettlesome issues they'd most like to see electronics engineers sort out next year ranging from grand challenges of engineering to niggling nettles of consumer gadgetry.
2003-06-16 Infineon moves forward on 157nm research
Infineon Technologies AG and Clariant Corp. are collaborating to develop photoresists for the 157nm technology
2003-02-07 Shipley opens R&D facility for microelectronic materials
Shipley Co. L.L.C. has opened its Advanced Technology Center in Marlborough, Massachusetts.
2004-07-09 Sematech to open R&D center for immersion lithography
International Sematech on Tuesday (July 6, 2004) announced the formation of an R&D center to develop and push immersion lithography into the marketplace.
2012-10-03 Researchers from Cornell advance lithography with LSA tech
Laser-spike annealing has the potential to shorten processing time while also improving image quality of semiconductor lithography.
2002-07-10 JMAR announces breakthrough in lithography technology
JMAR Technologies Inc. is using "Collimated Plasma Lithography" to more accurately describe its breakthrough technology for processing higher performance silicon and GaAs chips.
2002-04-30 First phase construction of Shipley center nears completion
Shipley Co., a wholly owned subsidiary of Rohm and Haas, has revealed that the first phase of construction of its Advanced Technology Center (ATC) is nearing completion.
2010-08-19 Film deposition technology for sub-32nm
Novellus Systems has announced its development of conformal film deposition technology for depositing 100 percent step coverage dielectric films on structures with aspect ratios of up to 4:1, a solution to sub-32nm requirements.
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