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2011-05-23 SIPLACE Singapore opens new branch in Korea
ASM Assembly System Singapore Pte Ltd, also known as SIPLACE, continues to develop customer support and service in Asia by establishing a new branch office in Korea.
2002-02-19 ServerWorks' core logic doubles memory of Pentium servers
Developed with IBM Research, the ServerWorks MXT SystemI/O core logic doubles the effective memory capacity of Intel Pentium III-based servers and halves the number of DIMMs required for system operation.
2011-05-11 Riverwood Solutions expands in China
Riverwood Solutions opens its second office in China to service rapidly growing needs of its OEM customer base.
2003-06-11 Pentek VME board increases I/O flexibility
Pentek Inc. has introduced a high-performance, four-processor VME board with two expansion module sites.
2010-11-23 PCIe Spec 3.0 doubles interconnect bandwidth
Products designed to the PCIe 3.0 architecture can achieve bandwidth near 1GBps in one direction on a single-lane configuration and scale to an aggregate approaching 32GBps on sixteen-lanes.
2008-01-25 Panasonic expands China factory
Matsushita Electric Industrial announced that it will invest $93 million to facilitate the expansion of Panasonic Semiconductor (Suzhou) in Jiangsu Province, China.
2011-03-10 Osram converts chip plants to raise LED output
Osram's facilities in Malaysia and Germany will introduce 6-inch wafers, a move that could almost double the company's chip production capacity for white LEDs by the end of 2012.
2007-07-11 On Semi expands Philippine manufacturing plant
ON Semiconductor announced that it will expand its production facility in the Philippines with the construction of an additional building to adjoin the existing 68,250m?-facility later this year.
2008-07-15 Nokia Siemens wins China Mobile network deal
China Mobile Communications Corp. has entered into a frame agreement with Nokia Siemens Networks for its network expansion project.
2011-01-21 Multi-interface backplane increases design options
Amfeltec Corp. expands its line of expansion backplanes with a multi-interface device that supports 32-bit PCI interface, x16 PCIe (4 lanes), ExpressCard interface, MiniPCI interface, MiniPCI Express interface and a PMC interface
2007-08-15 Motorola wins $394M GSM contract with China Mobile
Motorola has secured a $394-million contract with China Mobile for GSM network expansion.
2011-04-01 Microchip ready to fill MCU supply gap
MCU-maker Microchip is confident it can pick up the slack in the supply chain, saying it has ramped up its fab, assembly and test facilities to churn out bigger quantities of its products.
2011-03-14 MediaTek expands operations in Singapore
To strengthen support for the growing Southeast Asian customer base, MediaTek has chosen to expand its operations in Singapore and make it its regional hub for RF design.
2010-05-31 Malaysia's Unisem sets sight on China market
Malaysia IC-packaging and test specialist Unisem plans to expand in China, develop an automotive expertise and look for acquisitions in the market.
2007-02-13 LG.Philips LCD to increase Korean fab capacity
To meet market demands and to strengthen its presence in the global LCD market, LG.Philips LCD will increase the design capacity of its seventh generation TFT-LCD plant (P7) located in Paju, Korea.
2007-03-29 ISSI puts up sales offices in Singapore, India
Integrated Silicon Solution Inc. has put up new sales offices in Singapore and Chennai, Indiabringing a total of 12 ISSI sales offices in Asia.
2010-05-10 Is UMC mulling new R&D partnership?
United Microelectronics Corp. is boosting its fab expansion efforts and is planning a private placement of no more than 10 percent of its total shares or about $400 million.
2011-06-22 Intel, Micron joint venture expands fab operations
IM Flash Technologies, the joint venture of Intel and Micron Technology, plans to add 200 more employees in 2012 while maintaining its current of more than 1400 employees.
2006-09-13 India's SPEL opens leadless molded package facility
IC assembly and tester SPEL Semiconductor Ltd has opened a $5 million leadless molded package facility as part of a $250 million expansion plan.
2010-06-15 IMEC expands cleanroom, lab in Belgium campus
IMEC has officially opened the extension of its cleanroom at its campus in Belgium and kicked off the construction of a new office building fitting in its plan for further expanding its high-tech ecosystem.
2005-07-28 IBM, QLogic collaborate on iSCSI blade server
QLogic Corp. will supply iSCSI expansion cards for IBM eServer BladeCenter servers, creating the industry's first iSCSI blade server platform. The iSCSI adapter, shipping today, is powered by a single-chip TCP/IP and iSCSI offload engine designed to deliver user-friendly, high-performance storage networking while preserving CPU resources, according to QLogic.
2007-09-26 Huawei expands HSPA contract with Japan's EMOBILE
Huawei Technologies has secured a network expansion contract with Japan's EMOBILE, following the commercial launch of the country's first IP-based HSDPA radio access network for the operator.
2007-11-28 Hoku, Solarfun ink 8-year polysilicon supply agreement
Hoku Scientific and Solarfun Power Hong Kong have signed a definitive contract for Hoku's sale and delivery of polysilicon to Solarfun over an eight-year period beginning in mid-2009.
2003-06-20 Hermetic Surface Mount Device (SMD), Its Advantages and Solutions to Assembly Integration.
This application note discusses the advantages of using hermetic surface mounted devices and presents several procedures for Assembly Integration.
2010-05-12 GlobalFoundries looks into more expansions
GlobalFoundries Inc. appears to be getting ready to announce further expansion plans to help it profit from strong demand for foundry manufacturing services.
2006-09-22 Freescale's new India center to focus on software R&D
Freescale Semiconductor India Pvt. Ltd has announced the expansion of its India operations with a 100,000-square-foot facility in Bangalore.
2011-06-07 Flextronics expands India, Turkey presence
Flextronics has expanded its markets in Mumbai and Istanbul in response to the growing customer demand for post-manufacturing supply chain services in the regions.
2008-11-05 Firm anticipates brake in TFT-LCD equipment spending
DisplaySearch reports that 2008 spending on TFT-LCD manufacturing equipment is still expected to reach historic highs but the rapidly dropping panel prices, low fab utilization and continued concerns will considerably push down 2009 spending by 21 percent to $10.6 billion.
2014-07-16 element14 rolls out Raspberry Pi B+
Offering a 40-pin extended GPIO, even more sensors, connectors and expansion boards can be added to the board, allowing users to increase the complexity of their Raspberry Pi projects.
1999-06-01 Designing a USB sub-system on chip
This paper examines an easy approach to create a USB sub-system on silicon. Microcontroler based products embed majority of the macro cells needed for USB, such as the 3.3V regulator, USB transceiver, USB software and hardware modules on chip, thus providing easy implementation for the user.
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