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2010-01-05 Grand challenges to to niggling nettles in 2010
EE Times editors list nettlesome issues they'd most like to see electronics engineers sort out next year ranging from grand challenges of engineering to niggling nettles of consumer gadgetry.
2009-03-04 Deconstructing source-mask optimization tech
The SPIE Advanced Lithography conference witnessed a war of words among vendors developing source mask optimization tools in hopes of extending 193nm immersion lithography to the 22nm node
2009-09-23 Canon litho dreams hit price roadblock
The end could be near for Canon Inc.'s lithography efforts, as the company is reportedly mulling plans to cease future, high-end scanner development, according to sources
2010-03-16 Canon litho dreams hinge on nanoimprint
An analyst believes that Canon's 'great white hope' in lithography rests with an undisclosed relationship with nanoimprint lithography vendor Molecular Imprints Inc
2012-04-03 ASML dominates litho market
ASML was responsible for 57 percent of the lithography tools shipped last year, with Nikon accounting for 28 percent and Canon 15 percent
2005-09-21 Applied says no plans to enter litho
For years, the fab-tool industry has speculated that Applied Materials Inc. would enter one of the few equipment markets it does not have an offering: lithography
2010-01-27 Analyst: Is Moore's Law slowing down?
An analyst cited that the 450mm fabs and extreme ultraviolet (EUV) lithography delays may be a possible sign that Moore's Law is in danger of slowing down
2012-06-13 20nm is a different playing field, says exec
According to Synopsys Inc.'s Saleem Haider, the requirement for lithography double patterning on many layers makes moving to the 20nm node a major undertaking that will require customers to invest in new design tool sets
2009-03-03 TSMC details litho roadmap, taps maskless
Taiwan Semiconductor Manufacturing Co. Ltd has detailed it lithography roadmap and said it is still backing maskless technology at the SPIE Advanced Lithography conference
2010-03-02 SPIE Litho wraps with delays, double-patterning
The themes of this year's SPIE Advanced Lithography event were clear: D and Ddelays and double-patterning. Indeed, EUV is delayed. So is maskless. And nanoimprint is still stuck in R&D
2009-03-02 Panelists skeptical on next-gen litho
Experts debated and sparred over the future of patterning during a panel discussion at the SPIE Advanced Lithography conference
2009-03-06 Litho woes: R&D gap, downturn
It was a triple-whammy for lithographers at the SPIE Advanced Lithography conference as the industry continues to be plagued by an R&D gap, technology delays, and, of course, the lousy economy
2010-03-22 Analyst offers peak into Intel 22nm litho roadmap
Arete Research analyst at Jagadish Iyer said Intel's 22nm node will require 45 "litho layers," of which 55 percent will need immersion.
2010-03-24 Execs weigh in on right path for litho
Was EUV the wrong bet for the industry? If so, what should it be working on instead? And who will benefit in the long run? Litho experts and executives give their opinions on these hot questions
2003-09-11 Modeling tools aid in immersion litho quest
A German company is fielding modeling tools that can help chip makers assess the promise of immersion lithography
2010-03-26 25nm MLC NAND breaks scaling barriers
While most pundits have speculated that NAND has hit the wall, IM Flash Technologies continued their aggressive path scaling with the 25nm 8Gbyte, 2bit/cell MLC NAND.
2010-01-06 Fearless IC forecasts for 2010
2010 is just beginning to unfold in the electronics industry and there is already uncertainty in the air. EE Times' Mark LaPedus offers his chip forecasts and other prediction for 2010.
2008-09-24 Albany NanoTech beefs up cleantech efforts
Eyeing to achieve its success in semiconductors, Albany NanoTech, together with its parent organization, is bringing its collaboration model over to clean technology.
2011-02-04 Fab firms' focus on 450mm could disrupt supply chain
Analysts fear there is not enough 300mm capacity today and 450mm plants under construction may not start mass production until 2017 or 2018, a scenario that could trigger disruptions in the IC supply chain.
2010-12-14 Chipmakers keep secrets at IEDM
Few papers provided clues on vendors' plans at the 2010 International Electron Device Meeting (IEDM). In place of clear presentations on plans for 22-/20nm plans, rumors abounded, with many believing the leading-edge foundries will extend bulk CMOS.
2004-07-19 Intel moves up debut of billion-transistor chip
Not only does Intel Corp., the world's largest chipmaker, believe Moore's Law is alive and well, it is aiming to deliver a billion-transistor chip in 2005, rather than the original target date of 2007.
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