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2006-11-02 Fujitsu-Advantest JV to offer LSI prototyping services
Fujitsu and Advantest entered an agreement to establish e-Shuttle Inc. to provide prototyping services for leading-edge LSI semiconductors.
2008-09-30 Asian start-ups to get hold of silicon shuttle services
HKSTP and e-Shuttle Inc. have signed an agreement to provide silicon shuttle services for start-up IC design houses in Asia.
2008-10-14 Trio collaborates to develop maskless ICs
Fujitsu Microelectronics Ltd and e-Shuttle Inc. have agreed to adopt D2S' advanced design for e-beam (DFEB) technology, starting with a 65nm low power (LP) library.
2008-06-03 Maskless tools to boost ASIC throughputs
E-Shuttle Inc. is set to improve its direct-write e-beam capabilities and explore the future use of next-generation maskless tools from Mapper Lithography NV and other startups in the arena, making e-beam tools a probative technology in mainstream production fabs.
2009-03-03 TSMC details litho roadmap, taps maskless
Taiwan Semiconductor Manufacturing Co. Ltd has detailed it lithography roadmap and said it is still backing maskless technology at the SPIE Advanced Lithography conference.
2008-08-06 eASIC jumps to 45nm, finds new foundry partner
Fabless vendor eASIC Corp. will skip the 65nm node and roll out what it calls a "zero mask charge" 45nm ASIC line.
2009-02-26 Chip vendors unite for e-beam initiative
The eBeam Initiative, a multi-company effort dedicated to the advancement of e-beam direct-write technology for semiconductor prototyping and low-volume manufacturing, was formally launched at the SPIE Advanced Lithography.
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