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2007-10-01 TI secures e-passport market with FRAM-based chips
Texas Instruments will embark on the secure government ID market with products built around ferroelectric RAM and MCU technologies.
2007-03-27 South Korea to implement e-passport system in '08
The government of South Korea will introduce a new electronic passport (e-passport) system with enhanced electronic security features on July 2008, according to a report from the Korea Herald.
2010-06-03 Secure MCU is FIME-certified for e-Passport apps
FIME has certified the Atmel Corp.'s AT90SC28880RCFV secure microcontroller to be compliant with ICAO RF specifications and ISO 14443 RF.
2006-09-07 NXP to supply e-passport ICs to U.S.
The U.S. State Department disclosed that it has selected NXP as one of its suppliers of secure semiconductor technology for an electronic passport program.
2012-08-17 Infineon to supply secure chip tech for e-passport program
The company revealed that the U.S. Government Printing Office awarded the company a new contract to supply security chip technology embedded in the U.S. electronic passport.
2003-11-25 Collaboration focus on E-passport solutions
STMicroelectronic, ArjoWiggins, and Gep SpA have collaborated to jointly develop jointly solutions for ICAO-compliant electronic passports.
2009-11-16 China taps Infineon MCUs for e-Passport
The China government has selected Infineon Technologies AG microcontrollers for the country's electronic passports.
2007-11-15 TI taps Certicom tech for e-passports
TI will use Certicom's Elliptic Curve Cryptography embedded technology to enhance security on new government-issued electronic identification such as e-passports.
2007-07-31 NXP, Collis hold ePassport training in Singapore
NXP has teamed up with Collis to provide training for the Singapore government's electronic passport program.
2004-10-29 Sharp begins shipping IC modules to Australia for e-passports
Responding to a fast-approaching deadline by the U.S. Dept. of Homeland Security for global deployment of electronically readable visas, Japan's Sharp Corp. has begun volume shipments of its large-capacity contactless IC module to the Australian government, which recently began an e-passport pilot program.
2010-03-15 Security threats push Asia Pacific biometrics market
Frost & Sullivan's The Asia Pacific Biometrics Market analysis finds that the market earned revenues of over $165 million in 2009 for hardware only and estimates to reach $700.7 million in 2015.
2007-06-11 Russia's Mikron teams with ST for 180nm process
JSC Mikron is pushing ahead with its partnership with STMicroelectronics for the 180nm CMOS foundry process.
2008-12-01 MCU helps secure e-Government services
STMicroelectronics offers the ST23YR80, a MCU for secure identity cards supporting the latest cryptography techniques and offering large memory for biometric data.
2010-06-25 IBM to produce Infineon secure ICs for gov't IDs
Infineon Technologies AG has tapped IBM Corp. to manufacture its highly secure ICs for secure identification applications, including electronic passports.
2010-01-28 Financial crisis drives innovation in chip market
Solomon Ng of STMicroelectronics takes stock of new applications enabled by semiconductor innovation. He says companies that drove innovation during the financial crisis will emerge winners.
2008-08-04 Electronic ID card to strengthen smart card market
The German federal government has said it will be introducing an electronic ID card similar to the widely used electronic passport.
2006-09-25 Dual-interface MCU features 66Kbyte EEPROM
STMicroelectronics unveiled a dual-interface secure microcontroller with 66Kbytes of embedded EEPROM and 224Kbytes of user ROM.
2004-08-16 Atmel MCU targets electronic identity market
With the introduction of its new AT90SC12872RCFT dual interface secure microcontroller, Atmel is targeting the electronic identity markets.
2013-04-26 APAC gesture, touchless sensing market gains momentum
MarketsandMarkets cut a forecast that the Asia-Pacific gesture recognition and touchless sensing market will reach $4.18 billion by 2018 growing at a CAGR of 42.33 per cent from 2013-2018.
2007-05-22 0.18?m embedded EEPROM process offers high reliability
Shanghai Hua Hong NEC Electronics Company Ltd has announced the availability of its 0.18?m embedded EEPROM process.
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