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2011-03-04 TSMC details 450mm fab plans
TSMC will install a 450mm pilot line in Fab 12 in Hsinchu then bring the line up in Taichung to process devices at the 14nm node. It aims to produce 14nm FinFETs at its Taichung fab by 2015 or 2016
2006-01-11 TSMC CEO takes shots at fab-tool makers
An executive from TSMC took some surprising and subtle pot shots at the IC-equipment industry, urging vendors to improve their overall costs, lead times and productivity levels.
2011-02-03 TSMC bares plan to build 450mm fab
TSMC's announcement that it will build a 450mm fab could push rivals Samsung and GlobalFoundries to follow suit and include 450mm into their plans immediately
2009-01-09 Tough '09 awaits fab-tool, materials sector
Based on the early returns, the fab-tool and electronic materials markets are off to a rough start in 2009. And don't expect the market to improve, prompting the possible acceleration of a shake-out in the sector.
2008-10-28 Toshiba seeks to lower fab operating costs
For years, market officials have urged the IC and chip-equipment segments to collaborate in minimizing fab costs and introduce new technologies to the market
2009-10-05 TI 300mm fab puts pressure on analog rivals
Texas Instruments Inc. is putting its analog rivals on notice with its latest a 300mm fab in the United States
2009-02-23 The lowdown on the fab tool market
2009 is off to a rough start for fab tool and materials vendors. But some technologiesand companiesare doing better than others.
2005-08-19 Soaring tool costs to delay 450mm fabs
Soaring IC-equipment development costs could push out the appearance of next-generation 450mm wafer fabs to between 2020 and 2025a delay of more than a decade from its current schedule, warned an analyst at VLSI Research Inc
2005-08-22 Soaring tool costs to delay 450mm fabs
Soaring IC-equipment development costs could push out the appearance of next-generation 450mm wafer fabs to between 2020 and 2025 ? a delay of more than a decade from its current schedule, warned an analyst at VLSI Research Inc
2008-11-24 Slowdown hits Japan fab-tool market, too
Japanese-based semiconductor equipment manufacturers posted a book-to-bill ratio of 0.81 in October, down from 0.95 in September, according to the Semiconductor Equipment Association of Japan.
2006-09-14 SEMI: China's fab-tool spending flat
China's semiconductor equipment capital expenditure is expected to jump this year, but tool spending is projected to be relatively flat in 2007, according to SEMI
2011-05-24 SEMI: April fab tool orders, book-to-bill ratio rose 1.1%
April semiconductor equipment orders from North American vendors hit almost $1.6 billion, up 1.1 percent from March, while April book-to-bill ratio rose to 0.98 from 0.95 the previous month.
2011-06-10 SEMI: 2011 fab tool spending to hit record $44B
This year, fab equipment spending will grow 31 percent due to companies' increased capex guidance, while spending on new fabs will drop 3 percent due to the historically low volume of new fab construction
2004-03-10 SEMI, U.S. at odds over tool export controls for China
After months of discussions and lobbying, the Semiconductor Equipment and Materials International (SEMI) trade group is still at odds with the U.S. government over export control policies for U.S.-made chip-equipment for China.
2011-03-09 SEMI sees stronger fab spending growth in SEA
SEMI has increased its fab tool capex forecast in South East Asia for 2011, predicting that spending on fab projects could reach $47.2 billion this year, above the estimated $38.6 billion spent in 2010.
2009-10-27 Sematech installs tools in 450mm prototype fab
International Sematech has moved into the "test wafer generation" stage and installed the first tools in its 450mm prototype clean room, including metrology and wet-clean systems.
2008-06-23 Reports point to bleak IC, fab-tool markets
The mid-year data from market research firms indicate gloomy IC and fab-tool industries for 2008.
2009-12-03 Report: Fab plans on hold in 2010
Capital spending is expected to rise by 65 percent in 2010, but plans for new fabs will remain on hold for next year, according to SEMI.
2011-03-17 Quake unlinks fab tool supply chain
The March 11 earthquake in Japan has affected semiconductor equipment companies, prompting supply chain worries in the industry.
2008-11-07 Order delays haunt LCD tool makers
It's a double-whammy for the equipment industry. First, fab-tool makers face a major IC downturn. Now, they see a big slowdown in LCD production.
2005-06-30 ON Semi to move site 2 wafer fab at Malaysia
As part of its ongoing strategy to consolidate manufacturing capabilities at key sites and improve operating efficiencies, ON Semiconductor plans to transfer wafer-fab operations from its site 2 facility in Seremban, Malaysia, to its facility in Phoenix, Arizona by the end of 2006 and also announced a reduction in force
2005-11-14 No growth spike seen for fab tools
Semiconductor equipment vendors continue to see signs of a gradual upturn in the marketplace, but don't look for a huge growth spike in the near term&mdash--if at all.
2009-05-29 Nikon plans 1,000 layoffs in fab tool unit
Nikon Corp. plans to slash 1,000 jobs within its chip-equipment unit due to the ongoing IC downturn.
2010-11-09 Nikon fab tool unit reports losses
Nikon has reported disappointing Q2 earnings and revised down its full year target for sales and operating profit.
2004-03-19 Lithography lead times to cause fab bottlenecks
Semiconductor capital spending is projected to be higher than expected in 2004, but extending lead times for lithography gear may cause a bottleneck in overall fab-tool order ramps, warned an analyst from Needham & Co. Inc.
2005-08-22 Japan's fab-tool book-to-bill stays above parity
Japanese semiconductor production equipment manufacturers posted a book-to-bill ratio of 1.08 for July according to the Semiconductor Equipment Association of Japan.
2006-07-24 Japan's fab-tool book-to-bill sees huge increase
In what could be a possible short-lived boom cycle, Japanese-based semiconductor-production equipment manufacturers experienced a huge jump in bookings for June.
2009-01-27 Japan fab-tool, materials markets plunge
Like semiconductor equipment suppliers in the United States and Europe, the fab-tool market has also crashed in Japan.
2009-06-25 Intel: Fab tool market savior?
Intel Corp. continues to fund technologies and procure fab-equipment, but behind the scenes, the company is investing in some companies and brokering deals for others, reportedly including ASM International NV and NuFlare Technology Inc., sources said
2009-05-06 Intel invests in fab tool supplier
Intel Capital has made an investment in fab tool provider ASM International N.V. (ASMI).
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