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What is a fab?
Informal term for a semiconductor fabrication facility or manufacturing plant.
total search2722 articles
2002-04-02 Zarlink to sell wafer fab to X-FAB Semiconductor
Zarlink Semiconductor has disclosed plans to sell its wafer fabrication facility in Plymouth, U.K., as well as IP and related foundry businesses to companies controlled by X-FAB Semiconductor Foundries AG for about $30 million.
2012-06-25 XP Power opens green fab in Vietnam
XP Power's power supply manufacturing facility in Ho Chi Minh City incorporates a solar PV array, eco-friendly glass to prevent solar heat gain, low energy lighting, and ultra-efficient air conditioning.
2004-11-12 X-Fab unveils BiCMOS PIN-diode module
X-Fab Semiconductor Foundries AG has announced the availability of a PIN-diode module for its 0.6?m BiCMOS technology.
2008-01-18 X-FAB turns Malaysia facility to analog/mixed-signal fab
X-FAB Silicon Foundries is transforming its Sarawak, Malaysia facility into an analog/mixed-signal foundry operation.
2006-09-08 X-Fab Semi, 1st Silicon complete merger
X-FAB Silicon Foundries announced completion of the merger of X-FAB Semiconductor Foundries AG with 1st Silicon Sdn. Bhd. effective on Sept. 1, 2006.
2008-09-05 X-Fab Sarawak all set to start 0.35?m process tech
X-Fab Silicon Foundries' Malaysian facility in Kuching, Sarawak, with its 200mm production line, now is fully qualified for volume production and second sourcing of the company's 0.35?m high-voltage process technology called XH035.
2010-01-19 X-FAB puts $1.5M into Semprius
Semprius' technology for "point-of-use electronics" enables a faster and less expensive manufacturing process.
2006-06-07 X-Fab provides foundry services for Akustica's microphone chips
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2015-11-19 X-Fab invests in Malaysian wafer fab
The More-than-Moore chipmaker will invest $114 million in its wafer fab in Kuching, Sarawak, Malaysia to meet demand for 0.18?m and 0.35?m manufacturing.
2012-11-07 X-Fab increases holding in MFI, expands offering
In a move to focus more on MEMS manufacturing services and technologies, X-Fab has increased its holding in MEMS Foundry Itzehoe GmbH and renamed the company as X-Fab MEMS Foundry Itzehoe.
2003-06-20 X-Fab expands line with micromachining technology
X-Fab Semiconductor Foundries AG has expanded its MEMS product line to include surface micromachining technology for absolute pressure sensors.
2012-09-14 X-Fab claims the first open platform MEMS 3D process
X-Fab's 3-D sensor process is suitable for applications ranging from mobile devices, consumer goods, games and toys, automotive, robotics, industrial and medical equipment.
2011-02-07 X-Fab buys stake in MEMS Foundry Itzehoe
X-Fab and MFI will combine their foundry activities in the MEMS market.
2016-02-11 X-FAB Award calls for new design concepts in semiconductors
X-FAB to look into integration of advanced design and functionality, awarding the winner with a free prototyping run to validate their ideas in the best-suited technology.
2002-01-21 X-FAB adds new mixed-signal technology to its CMOS process platform
X-FAB Semiconductor Foundries AG has added a new mixed-signal technology called XC06 high-voltage process to its 0.65m mixed-signal CMOS process platform.
2012-04-02 X-FAB adds high-temperature capability to micrometers
The module claims to include high temperature, high voltage and non-volatile memory features to the company's XH018 portfolio.
2006-09-11 Worldwide fab capacity rose 91.2% in Q2
Worldwide fab-capacity utilization rose above the 90 percent level in the Q2 of 2006, with leading-edge processes hovering around the 96 percent range, according to the SICAS organization.
2006-06-09 Work begins on SemIndia fab
The foundation stone for the $3 billion SemIndia wafer fab was laid at Shamshabad in southern Andhra Pradesh state.
2005-06-28 Work begins on Hyderabad fab, doubt cast on IBM role
A ground-breaking ceremony for Nano-Tech Silicon India Pvt. Ltd - the first major semiconductor fabrication facility to be launched in India - was held Sunday (June 26) on the outskirts of Hyderabad in southern India.
2007-03-26 Winbond sells 200mm fab for $251M
Winbond Electronics Corp. Board of Directors has approved the deal to sell the 200mm fab in Hsinchu Science Park to Vanguard International Semiconductor Corporation (VIS) for about $251 million.
2004-05-06 Winbond plans 300mm wafer fab in 2005
Looking to ride a recovery in the semiconductor market, Winbond Electronics Corp. is putting into motion plans for a long-awaited 300mm wafer fab that will come on line in late 2005.
2006-04-25 Winbond opens 12-inch fab
Winbond Electronics official opened its new 12-inch fab at the Central Taiwan Science Park.
2005-01-26 Winbond invests in 300mm wafer fab
Winbond Electronics Corp. said Monday (Jan. 24) it is taking out a $250 million loan to fund the early phase construction of its 300mm wafer fab in central Taiwan.
2005-10-27 Winbond borrows $440 million for fab expansion
Winbond Electronics Corp. has signed a five-year syndicated loan for NT$15 billion (about $440 million) to fund 300-mm wafer fab expansion at the Central Taiwan Science Park.
2005-08-25 Winbond 300mm fab equipped with Mattson production tools
Winbond Electronics Corp. has purchased advanced process equipment from Mattson Technology Inc.
2007-08-17 Will AMD push its New York fab plan?
AMD has until July 2009 to decide whether to proceed with its plan to build a 300mm fab in New York, after which the $1.2 billion in state incentives will expire.
2008-09-08 Will AMD finally detail fab-lite progress?
Advanced Micro Devices Inc. could detail later this month its long-touted fab-lite strategy that involves spinning out its Dresden, Germany fabs in a deal that includes an investment from a Middle-East group to form a new company.
2015-12-18 Why did Apple buy Maxim's fab?
Regardless of its speculative nature, news like Apple's acquisition of Maxim's fab creates a great window to look into the wants and needs of the Cupertino giant.
2010-01-26 Wai Chi opens new LED fab in Changzhou
Production at the plant is aimed at 2 billion SMD and high-power LEDs, 20,000 LED lighting products and 80 million LED backlights annually.
2011-11-22 Wafer packaging fab opens in Taiwan
STATS ChipPAC has increased production capacity with the completion of its 300mm wafer bump and WLCSP facility.
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