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2013-11-26 A*STAR works on 'smart window' to up solar energy efficiency
The researchers reported how hydration affects color-changing windows that optimize solar energy transmission, and can boost their efficiency and durability.
2013-06-25 A*STAR IME, IC firms team up to tackle industry issues
A*STAR Institute of Microelectronics launched the 2.5D Through-Silicon Interposer Consortium to speed market adoption of TSI tech, which is driven by demands in computer infrastructure and CEs.
2013-05-31 A*STAR claims optical modulator faster than Ethernet
A*STAR IME researchers have developed an affordable silicon-based optical modulator that would enable 50 per cent faster download speed than Ethernet.
2013-03-04 A primer on FRAM (Part 2)
Understand charge thresholds, bit line capacitance ratios, and why retention is a bigger problem than fatigue.
2014-03-06 A detailed look at Micron-Sony's 16Gb ReRAM
The ReRAM used CuTe as the active memory material where in a CbRAM cell the growth and removal of a Cu filament link through an adjacent thin insulator to a lower electrode yields two NV logic states.
2011-07-13 7.0 magnitude aftershock rocks Japan
The northeastern region of Japan experienced a 7.0 magnitude earthquake on July 10. The quake is believed to be an aftershock of the March 11 earthquake that devastated the region earlier this year.
2007-10-19 45nm challenges shake RTP tool arena
There have been many changes in the RTP tool arena in the 45nm node and beyond, not the least of which is that Axcelis Technologies Inc. has decided to cease future RTP tool product development.
2014-02-06 3D TSV Summit underscores cost-effective production
From a maker's perspective, 3D IC production will only ramp up if the added costs for implementing TSVs and all the ensuing steps can be largely compensated by the IC performance benefits.
2015-08-14 3D stackable non-volatile RRAM enables 20GB arrays
Rice University scientists produced an innovative RRAM that boasts competitive designs in both speed and bits-per-crossbar, and promises to deliver ultra-low leakage (sneak) currents.
2014-12-23 3D printing spins confusion at copyrights
No matter which market analysis firm you go to, it will paint rosy picture for 3D printer and consumables market. Here we look at the current and upcoming capabilities of 3D scanners that help you "copy" designs for your 3D printing needs.
2015-12-17 1608-sized LEDs claim 75% reduction in brightness variation
The SML-D15 series from ROHM makes it possible to provide a single rank of brightness, significantly lightening design load for applications such as industrial equipment and automotive systems.
2002-09-23 0-In Design: A preferred approach for verification
Companies designing complex multimillion gate ASICs recognize functional verification as one of the largest problems facing design teams.
2007-11-15 'Green' silicon ink prints cheaper RFID tags
Kovio claimed that RFID tags using its 'green' silicon ink will drop Kovio's price from 15 cents today to 5 cents by 2008, when Kovio begins volume production of its inkjet-printed RFID tags.
2009-04-28 'First' 22nm SRAM cells from EUV litho debut
IMEC has presented what it claims is to be the first functional 22nm CMOS SRAM cells made using extreme UV (EUV) lithography. The SRAM cells are made with FinFETs and have both the contact and metal-1 layer printed using a full-field EUV alpha demo tool from ASML.
2006-05-17 'First' 2-inch AlN substrates for high-power RF apps
Crystal IS announced the release of what it claims to be the first 2-inch AlN substrates for use in high power RF electronics, blue and UV optoelectronics.
2006-11-16 'DFM too complex,' experts say
Speakers told the Bacus Photomask Technology Symposium that DFM technology is too complex and suggested the use of standardized layout elements, library cells or an "integrated" DFM methodology.
2015-02-17 $1B analogue fab to rise in India
Cricket Semiconductor, a U.S.-based chip manufacturing company is set to build an analogue fab worth $1 billion in a state in Central India, according to IESA.
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