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2003-05-29 Tower Semi deploys KLA-Tencor solution at Israel fab
Tower Semiconductor Ltd has selected KLA-Tencor Corp.'s yield-analysis software to be installed at its Fab 2 facility in Israel.
2000-06-14 The Role of Silicon Germanium in Optimum Technology Matching
This technical note examines the process of Optimum Technology Matching (OTM), which is used to determine which of the available process technologies will maximize performance and minimize cost. This paper also discusses the role of SiGe within that framework
2002-12-27 Tegal to install "proteomics" analysis system in Zyomyx fab
Zyomyx Inc. has purchased a 903e plasma etch system from Tegal Corp.
2008-03-17 Succeed at 65nm design
A true DFM-aware environment accounts for process variability and lithographic effects in the context of timing, power, noise and yield at every stage of the flow. This begins with the characterization of the cell library, continues through implementation, analysis and optimization, and ends with sign-off verification
2007-04-02 Researchers pitch nanowires as litho replacement
HP Lab and a trio of academic labs have scored advances that will make it easier to use nanowires as a replacement for lithography in semiconductor manufacturing, potentially taking chipmaking to the angstrom scale.
2002-06-06 Researchers demo self-assembling nanowires
Researchers at Aarhus University here have demonstrated a nanometer-scale fabrication technique that self-assembles tiny wires atop substrates, with an eye toward interconnecting molecular electronic circuits in the future
2008-10-13 Panasonic, Renesas bring partnership to 32nm
Panasonic and Renesas are now collaborating on the development of elemental process technologies for SoCs of the next-generation 32nm node
2015-10-07 Explore new approaches to high speed signal design
The proliferation of high speed protocols, now increasingly implemented in a wide range of components, means PCB designers may need to seek out new solutions to emerging design challenges.
2013-05-28 Annular electrodes as PCM solution (Part 2)
Learn about the possible advantages and limitations offered by nanotechnology and self-assembly techniques.
2015-11-13 A9: Story of Apple's design ambitions
The A9 is really a story within a story. On a basic level it is a story of a sixth generation AP that is fabricated in a FinFET process. It is also a bigger story of Apple semiconductor design ambitions
2015-05-14 A closer look at Samsung's 14nm node
Samsung has lagged Intel in the release of its process nodes, especially with the 20nm node that was two years behind Intel. Remarkably, Samsung has shrunk the lag for its 14nm to about six months
2008-07-08 1Mbit serial EEPROM completes data transfer in 1sec
STMicroelectronics has launched 1MHz two-wire serial EEPROMs in 256Kbit, 512Kbit and 1Mbit densities, compatible with I?C Fast-Mode-Plus allowing data rates up to 2.5x faster than the I?C Fast-mode.
2007-06-05 TSMC eyes 2009 for 32nm jump
TSMC is looking to unveil the 32nm process technology in two years' time, according to a DigiTimes report
2003-07-11 Triquint, Agilent design kit to speed IC design
TriQuint Semiconductor and Agilent Technologies Inc. have introduced a next-gen design kit, which accelerates IC design and simulation.
2013-05-06 Transparent thin film metrology system for 28nm node
The latest member of the S3000 family uses focused beam ellipsometry and newly-designed small site measurement optics to measure the thickness of single layer and multi-layer films on product wafers.
2002-08-22 Tower Semiconductor adopts PDF Solution technology
PDF Solutions Inc. has partnered with Tower Semiconductor Ltd on a program to enhance the yield and performance of 0.185m CMOS process technology at Tower's Fab 2
2002-09-24 Toshiba proposes double-junction MRAM structure
Toshiba Corp. has developed a magnetic RAM with a double-tunnel-junction structure to boost its MRAM product density to the 1Gb.
2011-05-05 Telefunken buys Renesas Electronics's U.S. fab
Telefunken has bought the semiconductor wafer fab of Renesas Electronics America in Roseville, California and is planning to use the facility to further improve their production.
2011-12-08 Team-up focuses on photonic chips
A*STAR's IME is collaborating with Alcatel-Lucent and Globalfoundries to enhance and develop silicon photonic chips designed to support high speed, high bandwidth optical communications.
2004-07-20 Synopsys chief takes fab vendors to task
The chief executive of EDA industry leader Synopsys Inc. told a chip industry conference that the emerging design-for-manufacturing approach is a two-way street and that the two industry segments must find ways to collaborate.
2004-09-01 Synopsys CEO calls for DFM cooperation
Synopsys CEO called on the design and fab communities to develop
2008-04-22 Symposium reveals future of chip design
Advances in the design and fabrication of semiconductors were unveiled last week at the International Symposium on Physical Design (ISPD
2015-03-03 SMIC, start-up group manufacture CMOS image sensors
Shanghai-based start-up company Cista System teams up with Semiconductor Manufacturing International for mass production of two CMOS image sensors, which both sport back-side illumination.
2011-03-11 Singapore takes R&D initiatives to green its electronics
With increased awareness of climate change issues, green electronics will be the underlying theme for both manufacturers and consumers. Singapore is addressing these issues through R&D initiatives.
2011-06-16 Silterra, ProMOS partner for advanced HV tech
ProMos' fabs in Taiwan will soon be ready to manufacture small-panel LCD driver ICs for smartphones using Silterra Malaysia's advanced 0.13?m and 0.11?m high-voltage (HV) process technology
2002-10-25 Sharp, SEL integrate processor into system-on-glass device
Sharp Corp. and Semiconductor Energy Laboratory Co. Ltd have integrated an 8-bit Z80 processor onto a glass substrate with an LCD.
2003-07-16 Schlumberger, LSI announce joint development program
Schlumberger Verification Systems and LSI Logic have established a JDP in advanced metrology for the 65nm process node
2002-10-11 SanDisk, Toshiba collaborate to enhance NAND Flash
SanDisk Corp. and Toshiba Corp. have partnered to develop a 90nm process technology aimed at increasing overall supply and improved competitiveness of NAND Flash memory
2002-10-25 Samsung to construct logic fab in system LSI push
Samsung Electronics Co. Ltd expects to invest $3.6 billion in its system-LSI business by 2007, including a dedicated 300mm logic fabrication facility at Onyang, South Korea
2007-03-05 Samsung begins production of 1Gbit DRAM at 60nm
Capitalizing on the increasing demand for large density DRAMs, Samsung Electronics Co. Ltd has started mass production of the industry's 'first' 1Gbit DDR2 DRAM using 60nm process technology
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