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2011-05-09 Applied acquires Varian, makes ion implanter comeback
Analysts believe that Applied will be able to accelerate Varian's Solion penetration with new solar customers and at the same time expand its servable semiconductor market into ion implantation.
2013-09-04 AMS spends $33 million for analogue 3D IC production facility
AMS investment aims to increase production capacity in response to a surge in demand outlook for ICs fabricated with 3D IC integration technology.
2004-05-27 AMIS expands relationship with Intersil
Intersil Corp. has selected AMI Semiconductor (AMIS)'s mixed-signal process with electrically erasable (EE) memory and 20V capability
2002-11-12 AMD outlines restructuring plan
Advanced Micro Devices Inc. is working on a broad restructuring plan that will slash $100 million from its quarterly operating costs in 2003, cut $100 million from its capital expenditures both this year and next, and entail significant layoffs by June.
2003-01-10 AMD deal with IBM appears to end earlier alliances
Advanced Micro Devices Inc. has switched partners again, announcing that it will work with IBM Microelectronics to co-develop process technology at the 65nm and 45nm nodes
2009-06-16 Alternatives to the DS1991L multiKey iButton
This application note discusses three alternatives for upgrading existing DS1991L applications. Each alternative takes advantage of these newer products.
2012-12-04 Aerosol-based method utilised for growing nanowires
Lund University researchers experiment on how aerotaxy, an aerosol-based growth method, can be used to grow nanowires continuously with controlled nanoscale dimensions, a high degree of crystallinity and at a remarkable growth rate.
2009-03-03 22nm chips to be developed by trio
IBM Corp., Applied Materials Inc. and the College of Nanoscale Science and Engineering (CNSE) of the University at Albany have agreed to jointly develop process modeling technology for manufacturing 22nm logic and memory chips
2000-03-30 RF measurements on SIEGET bipolar transistors: Predicting performance straight from the wafer
Multistage measurements are intended to ensure unrestricted operation of RF transistors. Recently, RF properties could only be measured on packaged components, while DC measurements alone cannot provide reliable indication of RF performance. Not until on-wafer testing emerged did it become possible to evaluate the RF parameters of production batches right from the wafer fabrication stage. This application note cites the example of on-wafer RF testing of SIEGET transistors
2002-02-04 AMD taps UMC for joint 300mm wafer fab in Singapore
United Microelectronics Corp. and Advanced Micro Devices Inc. have entered into a comprehensive alliance to establish a joint venture to own and operate a 300mm wafer fab in Singapore.
2011-08-04 X-ray inspection system eases board failure detection
The Akila XR-3 X-ray inspection system claims accurate detection of defects such as excess solder, insufficient solder and voids in printed circuit fabrication
2009-04-09 Unlock Micron's 50nm DRAM technology
With their latest 50nm process technology, Micron Technology Inc. seems to have struck the right balance between investment in new technologies and conservative design decisions
2010-11-23 True single-chip motor controller integrates digital, analog and power
High-performing motor drives for equipment may now be realized more quickly, utilizing a complete motor-control system on a chip designed by STMicroelectronics. The 'digital SPIN', or dSPIN, integrates all the necessary digital control, analog measurement, and power electronic circuitry for controlling stepper motors using ST's advanced BCD fabrication process.
2016-05-09 Shadow mask eases graphene etching at room temp
University of Illinois (Urbana-Champaign) researchers came up with a one-step process for quickly patterning and transferring graphene circuits to flexible substrates using a simple shadow mask
2014-04-10 Self-cooling chips operate up to 300°C
A team at Fraunhofer IMS developed a type of high-temperature process that allows the fabrication of compact microchips that can keep their cool even at 300°C.
2008-04-16 Scale voltage to manage power consumption
As CMOS process technologies migrate from 90nm to 65nm and below and as chip densities increase, static and dynamic power consumption often rise above acceptable levels. Apply voltage-scaling techniques to manage both
2014-12-15 Renesas touts soft error-free, low-power SRAM devices
The RMLV08 adds five products in its line-up that boast a density of 8Mb and use a fine fabrication process technology with a circuit linewidth of 110nm.
2014-05-08 POET integrates electronic, optical elements in one chip
The Planar Opto Electronic Technology (POET) platform is semiconductor fabrication process that uses gallium arsenide technology to combine electronic and optical elements on a single integrated circuit.
2014-01-23 Optimise CMOS for MEMS-based frequency control
CMEMS fabrication process can be used to fabricate both micro-electromechanical and CMOS electronic devices on a single die.
2010-08-11 Nanoamps matter in extreme low-power design
The demand for extremely low-power technologies was born from necessity, starting with the fabrication process and moving all the way to the application areas.
2007-02-01 Logic chipmakers seek 32nm breakthroughs
Even as they put the finishing touches on their 45nm process technologies and tweak them for low power, leading-edge logic chipmakers are scrambling to find manufacturing breakthroughs for the 32nm node and beyond
2012-08-09 Improve SoC yields with diagnostic and repair tools for embedded memory
Learn about embedded memory test solutions, including fault detection in very deep submicron technologies, repair at the manufacturing level, as well as diagnosis for process improvement and field repair capabilities
2012-09-28 How to select PCB materials for high-frequency apps
Find out how to simplify that choice when striving for the best tradeoff between ease of fabrication and best electrical performance
2011-11-04 Ensure PCB reliability by building additional tolerances
Developers of high reliability PCBs tend to overlook key steps in their design, fabrication, and assembly in order to save time and money, and get a project out the door on time. Here's how to achieve those and without compromising high reliability
2007-08-27 DRM functions secure programmable connectivity platforms
QuickLogic's patented silicon fabrication technology make digital rights management (DRM) solutions effectively "reverse engineering proof
2013-04-02 Designing safer, more compact computer chips
Researchers from A*STAR IME developed a powerful modelling method that allows large-scale simulations and optimisation of the fabrication process geared for miniaturizing electronic devices.
2012-07-18 Achieve robust, secure NVM with anti-fuse technology
Anti-fuse technology begins to emerge as a desirable alternative, offering more secure storage while scaling with each new generation of process
2014-05-29 A primer on BAW gyroscopes for inertial sensing
Here is a look at bulk acoustic wave gyroscopes and how a company's MEMS manufacturing process can be utilised to produce inertial sensors these days
2002-08-22 Ziptronix develops new wafer bonding technique
Ziptronix has introduced a process that achieves permanent, covalent bonding of semiconductor materials at room temperature without adhesives
2002-04-02 Zarlink to sell wafer fab to X-FAB Semiconductor
Zarlink Semiconductor has disclosed plans to sell its wafer fabrication facility in Plymouth, U.K., as well as IP and related foundry businesses to companies controlled by X-FAB Semiconductor Foundries AG for about $30 million
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