Global Sources
EE Times-Asia
Stay in touch with EE Times Asia
EE Times-Asia > Advanced Search > fabrication process

fabrication process Search results

?
?
total search797 articles
2010-01-19 X-FAB puts $1.5M into Semprius
Semprius' technology for "point-of-use electronics" enables a faster and less expensive manufacturing process
2002-12-19 UMC, Xilinx ready for 90nm chip manufacturing in '03
United Microelectronics Corp. and Xilinx Inc. have announced that they are on track to produce Xilinx's latest family of programmable chips in 2H of 2003, utilizing UMC's 90nm chipmaking process technology
2010-03-25 Toshiba sets up NAND flash fab in Japan
Toshiba Corp. it set to start construction of new a fabrication facility on a site next to Yokkaichi Operations, its memory production facility in Mie Prefecture, in July
2004-02-24 Toshiba sets up 300mm wafer fab in Kyushu
Toshiba Corp. has completed the construction of a new 300mm-wafer fabrication facility at its Oita operations in Kyushu, Japan
2008-10-27 Toshiba readies 40nm node, but is Sony?
Toshiba is preparing to release its 45-/40nm logic process, but Sony, the company's initial technology customer, could be late to the party
2008-02-11 Toshiba develops 16Gbit NAND at 43nm CMOS tech
Toshiba has developed a 16Gbit NAND flash memory chip fabricated with 43nm process co-developed with SanDisk
2005-06-17 TI outlines further CMOS scaling
Texas Instruments Inc. (TI) is presenting papers that describe key accomplishments on advanced materials and manufacturing process development at the 2005 Symposium on VLSI Technology
2011-10-14 The move toward 3D chips
Semiconductor fabrication is moving toward 3D ICs and by next year, 3D chips will be available for commercialization
2006-12-18 Test tool optimizes data for IC yield
LogicVision Inc. touts its solution Yield Insight to provide "yield learning," a process in which test failure data can pinpoint potential yield problems
2012-07-26 Techniques, procedures for die bonding
Here's a look at various techniques for die bonding, a process of connecting die to the package for communication to the outside world
2008-02-18 Take a holistic approach to power management for mobile devices
Power management no longer remains a hardware-only problem; rather it has become a system problem that is being addressed by all engineers involved in the system design process. Power management decisions are being taken at both hardware and software level. Increasing focus towards system aspects of cellular phones compels designers to take a holistic and dynamic approach to power management to effectively decrease power consumption without degrading performance
2006-01-01 Taiwan's ITRI innovates in emerging memory research
As process technologies move into deep-submicron arena, Taiwan makers realize that they have to develop their proprietary technologies in a bid to keep competitiveness
2002-10-04 Syncron: Web-based environment in PCB design
In the last 10 years, Taiwan has enjoyed steady growth in the semiconductor industry. Even with the current economic downturn, Taiwan continues to see the emergence of numerous (and diverse) fab-less semiconductor design companies. The IC designs coming from these businesses are taking advantage of the landmark achievements in semiconductor fabrication technology
2003-04-24 Sony to begin advanced IC production for Playstation
Sony Computer Entertainment Inc. has announced that it will start advanced semiconductor production with 90nm embedded DRAM process in fiscal year 2003
2006-10-05 Sipex closes Milpitas fab, moves prod to China and Taiwan
Sipex has closed its Milpitas wafer fabrication operations and the products formerly manufactured in it will now be manufactured in China and Taiwan
2005-09-08 Sipex announces Chinese strategic alliance
Sipex Corp. has signed a strategic relationship agreement with Hangzhou Silan Integrated Circuit Co. Ltd (Silan-IC). As part of the planned relationship, Sipex will close its Milpitas wafer fabrication operations
2004-12-03 Silterra demonstrates 0.13?m 8Mbit SRAM
A joint development project between Silterra Malaysia Sdn. Bhd. and Europe's IMEC research center, has produced an 8Mbit SRAM fabricated in an all-copper, foundry-compatible 0.13?m CMOS manufacturing process
2004-12-02 Silterra demonstrates 0.13?m 8Mb SRAM
A joint project between Silterra and IMEC research center has produced an 8Mb SRAM fabricated in an all-copper, foundry-compatible 0.13?m CMOS manufacturing process
2007-04-12 Service kicks off at Fujitsu's new 300mm fab
Fujitsu Ltd. has begun operating its second 300mm wafer fab for 65nm chip fabrication. Volume shipments will begin in July
2005-06-27 Semiconductor technologies for power management (Part 3)
Understand better why ICs and discrete transistors require very different methods of fabrication
2005-06-13 Semiconductor technologies for power management (Part 1)
Understand better why ICs and discrete transistors require very different methods of fabrication
2014-01-23 Semiconductor industry feels ripple effect of Intel's troubles
The need for Intel to cut costs in many areas, even investment in future process technology will impact the semiconductor market significantly
2007-05-02 Semicon equipment supplier taps Singapore as global HQ
Semiconductor process equipment provider Novellus Systems Inc. has chosen Singapore to be its international headquarters for its operations outside the U.S
2015-06-24 Scalable production of low-temperature 2D MoS2 films
Researchers at the University of Southampton's Zepler Institute characterised large-area 2D films of molybdenum disulphide at room temperature using a process that is scalable to any size wafer
2005-05-31 Samsung produces 4Gb NAND flash memory using 70nm technology
Samsung Electronics Co. Ltd has begun mass producing what it claims to be the highest density NAND flash device yet to take advantage of advanced 70nm process technology -- 4Gb NAND flash memory
2010-06-14 Samsung dips $3.6B for U.S. fab expansion
Samsung Austin Semiconductor LLC plans to expand the capacity of its 12-inch semiconductor fabrication plant in Austin with a $3.6 billion investment
2006-05-16 Running start helps clear 90nm hurdles
Back in 2004, fabless IC maker Sandbridge Technologies couldn't get the performance it needed at the 0.13?m process node. The wireless-telecom player took a risk and became one of the first companies to try the relatively untested 90nm node
2013-07-18 Researchers raise dye-sensitised solar cell efficiency to 15%
EPFL scientists developed a state solid version of the DSSC that is fabricated by a two-step process raising their efficiency up to a record 15 per cent without sacrificing stability
2002-02-19 Researchers close to delivering molecular circuits
Although it's a little like watching a chess match in slow motion, molecular electronics researchers are converging on viable circuit-fabrication methods
2006-07-14 Production scheduling tool rolls for 300mm fabs
Ilog has unveiled the Fab PowerOps, touted to be the first software package to address production scheduling for front-end process areas within a 300mm semiconductor fabrication plant.
Bloggers Say

Bloggers Say

See what engineers like you are posting on our pages.

?
?
Back to Top