Global Sources
EE Times-Asia
Stay in touch with EE Times Asia
EE Times-Asia > Advanced Search > fabrication process

fabrication process Search results

?
?
total search797 articles
2005-02-21 TriQuint switches combine low insertion loss, robust harmonic performance
TriQuint announced the addition of two new GSM-EDGE switch products to complement its existing CDMA handset switch product line.
2004-12-02 TriQuint modifies optoelectronics business strategy
TriQuint Semiconductor Inc. has disclosed the repositioning of its optoelectronics business strategy to become a supplier of components and chips for optical networking applications.
2010-02-04 TowerJazz, Soitec join hands on backside illumination
TowerJazz and Soitec Group will develop turn-key solution for high-end backside-illuminated CMOS image sensors for industrial, medical and automotive applications.
2007-07-16 Touchscreens, 3D, OLEDs drive new displays
The Society for Information Display (SID) conference played host to the upcoming technologies driving the display market.
2003-06-12 Toshiba transistor made from HfSiON
Toshiba Corp. has developed a CMOS transistor that reduces gate leakage current to 1/1,000 that of conventional CMOS devices.
2011-06-24 Tilera unveils 64bit cloud processor
Tilera has unveiled a new processor family, the TILE-Gx 3000 that is designed for cloud computing applications.
2003-01-27 TI enhances DLP technology through Amkor facility
Texas Instruments Inc. has selected Amkor Technology Inc. to provide the company with subcontractor assembly facilities that will give TI additional manufacturing capacity for its DLP technology.
2014-07-07 The cost of overlooking design-for-test
To prevent costly printed circuit board rework, it is important to have an effective DFT strategy based on a close partnership and working relationship between PCB design and test engineering.
2012-10-23 TCAD eases FinFET design and variability analysis
FinFET is the first fundamental change in transistor architecture since the time MOSFET replaced bipolar transistor as the transistor of choice for logic applications.
2010-10-21 Switch increases solar cell efficiency
The integrated low-loss power switch and precision controller from STMicroelectronics replaces bypass diodes, thus protecting the energy that would have been lost in each diode.
2012-03-22 Supercapacitors to answer energy issues in portable electronics
An EC that combines the power performance of capacitors with the high energy density of batteries would represent a significant advance in energy storage technology.
2016-02-15 Super-thin acoustic metasurface seamlessly absorbs sound
Researchers from CNRS and the University of Lorraine developed a design for a coiled-up acoustic metasurface that can achieve total acoustic absorption in very low-frequency ranges.
2008-03-26 Structured ASIC aims at military, aerospace sectors
ON Semiconductor has announced that XPressArray-II, a structured ASIC technology formerly offered by AMI Semiconductor, is now available for military specification operating temperatures.
2005-10-20 ST offers eight new supervisor circuits with short lead times
ST introduced a family of dual/triple microprocessor supervisor circuits that offers a wide range of voltage combinations, a compact 5/6-pin SOT23 package, and a new manufacturing flow that ensures short lead times.
2009-07-10 SRAMs designed for next-gen comms network
Renesas Technology Corp. has announced the 72Mbit Quad Data Rate II+ (QDR II+) and DDRII+ high-speed SRAM product family for use in high-end routers and switches in next-generation communication networks.
2014-06-26 Sputtering method reduces GaN LED prod'n cost
University of Tokyo researchers developed a technology for creating GaN LEDs on glass substrate that could not only reduce manufacturing costs but also help to develop OLED light panels.
2003-01-16 SoCs no panacea for comms infrastructure
Unlike battery-powered handsets, the room-size cellular basestations and telecom switching stations that make up the real comms infrastructure have scant need for highly integrated, small-form-factor, low-power ICs.
2011-06-23 Single-chip MCU targets automotive apps
Freescale Semiconductor introduces the S12VR64, a single-chip, mixed-signal MCU designed for use in DC motors for automotive window lift and sunroof applications.
2013-08-15 Sensor takes signatures to new 'lights'
Researchers at the Georgia Tech used thousands of nanometre-scale wires to create a sensor that converts mechanical pressure such as a signature or a fingerprint directly into light signals.
2003-07-16 Selco CdS photocells suit light sensing apps
Selco Products Co. has expanded its product range of thermal and electronic control products with the introduction of the Cadmium Sulfide photocell series.
2002-06-19 SEI develops low-dislocation single-crystal GaN substrate
SEI has developed a single-crystal GaN substrate that may be used in violet lasers for its next-generation Blu-ray Disc optical video recording technology.
2001-04-15 Same-die tactic eases DDR transition
The industry consensus is clear: DDR's time has come. Now what design issues must engineers consider, and what can DRAM suppliers do to make this memory transition happen smoothly and seamlessly?
2002-08-19 RF integrates with DSP in 4G apps
This article discusses a direct-conversion RF architecture that uses CMOS technology to design a DSP suitable for 4G apps.
2005-08-01 RF IC tools still seeking paths to silicon
Complicated by multiple modulation schemes, RF tools have become proficient at simulating behavior on an architectural level.
2014-11-05 Rethinking memory design for IoT and wearables
The space, power and application requirements of wearables and other mobile connected devices that collectively make up the growing IoT ecosystem require a fresh approach to system design.
2007-04-03 Researchers tout cheaper technique to 65nm
Researchers at the Georgia Institute of Technology and Focal Point Microsystems announced 3D multiphoton lithography, a technique that claims to enable a cheaper, easier way to pattern at the 65nm node.
2004-03-30 Researchers seek bricks to build nanoscale structures
A systems strategy to make nanoscale devices as reproducible and controllable as silicon systems-on-chip is being urged by a pioneer in this growing world of shrinking sizes.
2010-07-19 Researchers reduce battery recharge time to 10 minutes
Government and Princeton University researchers developed graphene-based electrodes that could reduce recharge time of Li-ion batteries from two hours to 10 minutes.
2014-02-10 Researchers highlight graphene's ballistic transport property
The study reveals that graphene nanoribbons act more like optical waveguides or quantum dots, allowing electrons to flow smoothly along the edges of the material to spawn innovative electronic devices.
2011-03-30 Researcher crafts rotary-linear piezoelectric actuator
Tomoaki Mashino of Toyohashi University has created a microactuator with a single cubic stator capable of both rotary and linear motion.
Bloggers Say

Bloggers Say

See what engineers like you are posting on our pages.

?
?
Back to Top