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2002-05-22 Researchers seek 'green' chip-fabrication techniques
A research team at the University of Arizona is working to develop environmentally friendly chip-fabrication chemistries that consume fewer resources and produce fewer hazardous byproducts than conventional techniques.
2011-11-30 Research reveals novel MEMS device fabrication
A research team studied the piezoelectric material lead magnesium niobate-lead titanate for application in nanoelectromechanical systems.
2012-07-26 Techniques, procedures for die bonding
Here's a look at various techniques for die bonding, a process of connecting die to the package for communication to the outside world
2010-02-03 New method enables pure graphene fabrication
Penn State researchers claim to have perfected a method of fabricating pure sheets of carbon semiconductor, called graphene, on 100mm (4-inch) wafers.
2013-07-10 Hypres commercially debuts new chip fabrication process
The six-layer planarized chip fabrication process increases the integration level of superconducting ICs and critical current density of Josephson junctions
2014-03-04 DSA technique pushes chip fabrication below 20nm
The MIT researchers' directed self-assembly technique utilises block copolymer self-assembly that facilitates the reduction of pattern sizes in photolithography and electron-beam photolithography.
2015-08-24 Agile techniques for hardware design (Part 1
In the first of a three-part series, two University of California at Berkeley professors suggest it is time to apply Agile design techniques to hardware
2010-09-23 UCLA uses nanowires as self-aligning gates on graphene transistors
UCLA researchers how that using nanowires as self-aligning gates overcomes the difficulties of fabricating graphene transistors.
2011-12-08 Team-up focuses on photonic chips
A*STAR's IME is collaborating with Alcatel-Lucent and Globalfoundries to enhance and develop silicon photonic chips designed to support high speed, high bandwidth optical communications.
2007-05-16 Foundries face obstacle course in 45nm race
The starting gun sounded on the 45nm foundry race when the world's largest foundry service provider announced in April it is accelerating ramp of its 45nm process.
2013-09-04 AMS spends $33 million for analogue 3D IC production facility
AMS investment aims to increase production capacity in response to a surge in demand outlook for ICs fabricated with 3D IC integration technology.
2004-09-01 Synopsys CEO calls for DFM cooperation
Synopsys CEO called on the design and fab communities to develop
2011-03-11 Singapore takes R&D initiatives to green its electronics
With increased awareness of climate change issues, green electronics will be the underlying theme for both manufacturers and consumers. Singapore is addressing these issues through R&D initiatives.
2008-04-16 Scale voltage to manage power consumption
As CMOS process technologies migrate from 90nm to 65nm and below and as chip densities increase, static and dynamic power consumption often rise above acceptable levels. Apply voltage-scaling techniques to manage both
2007-04-02 Researchers pitch nanowires as litho replacement
HP Lab and a trio of academic labs have scored advances that will make it easier to use nanowires as a replacement for lithography in semiconductor manufacturing, potentially taking chipmaking to the angstrom scale.
2002-06-06 Researchers demo self-assembling nanowires
Researchers at Aarhus University here have demonstrated a nanometer-scale fabrication technique that self-assembles tiny wires atop substrates, with an eye toward interconnecting molecular electronic circuits in the future
2012-05-14 Rensselaer opens manufacturing learning lab
Rensselaer Polytechnic Institute has revealed its new Manufacturing Innovation Learning Lab (MILL), which will be focused on educating the next generation of manufacturing leaders and pioneers.
2015-10-07 Explore new approaches to high speed signal design
The proliferation of high speed protocols, now increasingly implemented in a wide range of components, means PCB designers may need to seek out new solutions to emerging design challenges.
2002-09-24 Dolphin Integration: Taiwan foundries acquiring design capabilities
Outsourcing fab responsibilities to Taiwan was adopted by many companies to deverticalize the chip industry. But design changes are slowly creeping in.
2011-08-31 Carbon nanotube reliability questionable
NIST researchers are questioning the reliability of carbon nanotubes as tests have revealed that the nanotubes performance slowly deteriorates under constant current.
2013-05-28 Annular electrodes as PCM solution (Part 2)
Learn about the possible advantages and limitations offered by nanotechnology and self-assembly techniques
2014-01-23 Optimise CMOS for MEMS-based frequency control
CMEMS fabrication process can be used to fabricate both micro-electromechanical and CMOS electronic devices on a single die
2007-04-16 Making MEMS the new 'mouse'
This article features ST's MEMS Product Division General Manager Benedetto Vigna, who views MEMS as the new 'mouse.' ST first ventured into developing MEMS in 2001. Last year, the company inaugurated a 200mm semiconductor wafer fabrication line dedicated to MEMS devices
2002-04-24 ANI demonstrates 14-inch diagonal nanotube display
Applied Nanotech Inc. (ANI), a subsidiary of SI Diamond Technology, has demonstrated a 14-inch diagonal carbon nanotube display made with low-cost fabrication techniques on inexpensive glass substrates that did not require any photolithographic steps.
2002-02-08 TI unveils 90nm process technology
Texas Instruments Inc. has unveiled its 0.095m process technology, which will support transistor densities that allow chip-level multiprocessing, and require several techniques to manage power consumption
2011-10-14 The move toward 3D chips
Semiconductor fabrication is moving toward 3D ICs and by next year, 3D chips will be available for commercialization
2015-06-15 The MCU guy's guide to FPGAs: Configuration
Embedded design engineers usually come from MCU background, so they often have only a vague idea as to what an FPGA is. In this article, we are going to look into configuration techniques and technologies
2003-07-29 STMicro announces new RF technology
STMicroelectronics has released details of a technology that uses MEMS techniques to integrate high performance RF switches into circuits
2004-12-09 Plastic Logic, E Ink, team for large area flexible display
Plastic Logic Ltd and E Ink Corp. have reached a nonexclusive agreement to cooperate on the design and fabrication of flexible all-plastic electronic displays, Plastic Logic said Monday (Dec. 6
2012-03-15 PCM progress report no. 6: Recent advances in phase change memory (Part 2)
The second installment of this two-part series tackles other recent developments in PCM, including fabrication of a 1 Gb PCM array with a 4F2 cell size
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