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2003-12-10 UMC becomes member of X Initiative
Semiconductor foundry United Microelectronics Corp. (UMC) has joined the X Initiative, a semiconductor supply-chain consortium. This makes UMC the first pure-play foundry to become a member of the consortium.
2011-08-25 Ultracapacitor geared for mission-critical UPS
The 56V ultracapacitors offer capacitance up to 130F and are designed for UPS in data centers and industrial facilities.
2013-01-29 Ultra-low cost flexible display in dev't at UNIST
Polymer-based electronic circuits being developed at the Ulsan National Institute of Science and Technology are expected to open up possibilities for ubiquitous electronics such as flexible displays.
2007-09-03 ULP Bluetooth spawns lower-power apps
The Bluetooth specification is probably the most successful short-range wireless technology in use today, as ULP Bluetooth connectivity has opened up.
2005-02-09 UK group readies tuned optical amp for 40Gb networks
The Center for Integrated Photonics has begun sampling a semiconductor optical amplifier that is targeted at optical networks operating at 40Gbps.
2007-01-31 UCSB researchers tout blue laser diode breakthrough
A team of University of California-Santa Barbara researchers have created a new type of blue-violet laser diode that they say could replace the c-plane violet laser diodes used for next-gen DVD formats.
2013-09-25 UCLA team unrolls stretchable transparent OLED display
The transparent, elastic organic light-emitting device (OLED) could usher in new classes of smartphones and other CE devices, electronics-integrated clothing and new minimally invasive medical tools.
2006-07-20 U.S. seeks to change rules on China exports
The U.S. Department of Commerce is seeking to change the rules regarding high-tech exports to China, some of which are intended to make it easier to sell semiconductor equipment into its growing IC market.
2002-09-11 U.S. Air Force assigns Aculight for semiconductor R&D
Aculight Corp. has received an 18-month contract worth $2.3 million from the U.S. Air Force Research Laboratory to investigate its new semiconductor and fiber laser technologies.
2014-03-14 Tunable laser expands system capacity in advanced optical networks
A*STAR IME and NTU claimed the smallest wavelength-tunable laser fabricated by MEMS technology and can generate light from 1531.2-1579.5nm of the near-infrared region.
2002-04-16 TSMC to offer SoC design-to-manufacturing services
Taiwan Semiconductor Manufacturing Co. Ltd is moving to better coordinate the design and manufacturing flow for SoC customers with the introduction of a development architecture called Nexsys.
2015-04-17 TSMC slashes $1B to 2015 capex
TSMC, which in January weighed in with the chip industry's largest planned layout for expansion this year, said that its revised 2015 capex will fall within a range of $10.5 billion and $11 billion.
2007-06-05 TSMC eyes 2009 for 32nm jump
TSMC is looking to unveil the 32nm process technology in two years' time, according to a DigiTimes report.
2005-06-09 TSMC 90nm builds Raza XLR processor
Taiwan Semiconductor Mfg Co. Ltd (TSMC) and Raza Microelectronics Inc. (RMI), a silicon solutions provider, have collaborated in creating RMI's XLR processor
2007-11-30 TSMC 55nm process tips knowledge-based processors
TSMC and NetLogic Microsystems have collaborated on using 55nm process technology for fabricating low-power knowledge-based processors.
2005-02-21 TriQuint switches combine low insertion loss, robust harmonic performance
TriQuint announced the addition of two new GSM-EDGE switch products to complement its existing CDMA handset switch product line.
2004-12-02 TriQuint modifies optoelectronics business strategy
TriQuint Semiconductor Inc. has disclosed the repositioning of its optoelectronics business strategy to become a supplier of components and chips for optical networking applications.
2008-10-14 Trio collaborates to develop maskless ICs
Fujitsu Microelectronics Ltd and e-Shuttle Inc. have agreed to adopt D2S' advanced design for e-beam (DFEB) technology, starting with a 65nm low power (LP) library.
2005-01-04 Transition begets opportunity to diversify
For the surviving IDMs, it is necessary to improve the capital efficiency of current and future investments.
2012-10-03 Transient electronics designed to dissolve in water
These electronics have potential applications in medicine, pharmaceuticals, environmental monitors and the military, among other uses
2010-02-04 TowerJazz, Soitec join hands on backside illumination
TowerJazz and Soitec Group will develop turn-key solution for high-end backside-illuminated CMOS image sensors for industrial, medical and automotive applications.
2011-04-06 TowerJazz to double production with Micron fab acquisition
TowerJazz has announced that it has signed a term-sheet contemplating it's purchase of Micron's fab in Nishiwaki City, Japan.
2015-12-01 TowerJazz inks deal to buy Maxim's wafer fab
The agreement is expected to boost TowerJazz's global wafer manufacturing capacity, cost-effectively increasing production by nearly 28,000 wafers per month.
2005-01-27 Tower Semiconductor strengthens design center program
Tower Semiconductor Ltd announced a major expansion of the Tower Authorized Design Center (TADC) program, naming Cadence Design Systems Inc., QThink, QualCore Logic and SliceX as design center partners.
2002-08-22 Tower Semiconductor adopts PDF Solution technology
PDF Solutions Inc. has partnered with Tower Semiconductor Ltd on a program to enhance the yield and performance of 0.185m CMOS process technology at Tower's Fab 2.
2003-05-29 Tower Semi deploys KLA-Tencor solution at Israel fab
Tower Semiconductor Ltd has selected KLA-Tencor Corp.'s yield-analysis software to be installed at its Fab 2 facility in Israel.
2007-06-15 Tower bags fresh funds for fab expansion
Tower Semiconductor announced it has received orders for approximately $40 million of long term bonds with an average duration of 5.6 years, from Israeli institutions.
2007-07-16 Touchscreens, 3D, OLEDs drive new displays
The Society for Information Display (SID) conference played host to the upcoming technologies driving the display market.
2015-10-29 Toshiba, Sony confirm transfer of image sensor facilities
Sony and Toshiba aim to execute legally binding definitive agreements by the end of 2015. Afterward, the two Japanese companies will complete the transfer by March 31, 2016.
2003-12-05 Toshiba, SanDisk to expand NAND flash memory production
Toshiba Corp. and SanDisk Corp. have agreed to cooperate in the construction of a new 300mm wafer fab facility at Toshiba's Yokkaichi operations.
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