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2003-07-11 Triquint, Agilent design kit to speed IC design
TriQuint Semiconductor and Agilent Technologies Inc. have introduced a next-gen design kit, which accelerates IC design and simulation.
2013-05-06 Transparent thin film metrology system for 28nm node
The latest member of the S3000 family uses focused beam ellipsometry and newly-designed small site measurement optics to measure the thickness of single layer and multi-layer films on product wafers.
2002-09-24 Toshiba proposes double-junction MRAM structure
Toshiba Corp. has developed a magnetic RAM with a double-tunnel-junction structure to boost its MRAM product density to the 1Gb.
2009-04-07 TI's Philippine building bags LEED certification
Texas Instruments Inc.'s newest building in the Philippines is now Leadership in Energy and Environmental Design (LEED)-certified. This makes TI's new Phase V building, located in Baguio City, the first LEED-certified building in the country.
2013-06-11 TI sets up assembly/test facility in Chengdu, China
The firm's investments in these operations could total up to $1.69 billion over the next 15 years and potentially include facilities, manufacturing equipment and land.
2000-06-14 The Role of Silicon Germanium in Optimum Technology Matching
This technical note examines the process of Optimum Technology Matching (OTM), which is used to determine which of the available process technologies will maximize performance and minimize cost. This paper also discusses the role of SiGe within that framework.
2011-05-05 Telefunken buys Renesas Electronics's U.S. fab
Telefunken has bought the semiconductor wafer fab of Renesas Electronics America in Roseville, California and is planning to use the facility to further improve their production.
2002-12-27 Tegal to install "proteomics" analysis system in Zyomyx fab
Zyomyx Inc. has purchased a 903e plasma etch system from Tegal Corp.
2011-12-08 Team-up focuses on photonic chips
A*STAR's IME is collaborating with Alcatel-Lucent and Globalfoundries to enhance and develop silicon photonic chips designed to support high speed, high bandwidth optical communications.
2004-07-20 Synopsys chief takes fab vendors to task
The chief executive of EDA industry leader Synopsys Inc. told a chip industry conference that the emerging design-for-manufacturing approach is a two-way street and that the two industry segments must find ways to collaborate.
2004-09-01 Synopsys CEO calls for DFM cooperation
Synopsys CEO called on the design and fab communities to develop
2008-04-22 Symposium reveals future of chip design
Advances in the design and fabrication of semiconductors were unveiled last week at the International Symposium on Physical Design (ISPD).
2006-05-18 Sony to establish fab line for organic EL panels
Sony disclosed its plan to establish a pilot fabrication line that will develop and produce large-sized organic electroluminescent panels early next year.
2003-04-23 Sony to deploy new fab line for 65nm process technology
Sony Computer Entertainment Inc. (SCEI) and Sony Corp. have decided to invest a total of about 200 billion yen over three fiscal years from 2003 to 2005 in the installation of a semiconductor fabrication line to build chips with 65nm process on 300mm wafers.
2015-03-03 SMIC, start-up group manufacture CMOS image sensors
Shanghai-based start-up company Cista System teams up with Semiconductor Manufacturing International for mass production of two CMOS image sensors, which both sport back-side illumination.
2012-05-16 SMIC gets government support in Beijing expansion
Semiconductor Manufacturing International Corp. has announced the signing of a cooperation framework document between its subsidiary SMIC Beijing and the Beijing municipal government.
2007-05-07 Singapore's wafer fab training program gets $5M funding
The Economic Development Board of Singapore will allocate more than $5 million over the next three years into a program designed to groom more wafer fabrication experts at local universities.
2011-03-11 Singapore takes R&D initiatives to green its electronics
With increased awareness of climate change issues, green electronics will be the underlying theme for both manufacturers and consumers. Singapore is addressing these issues through R&D initiatives.
2002-05-31 Singapore fabs serve as EE training ground
Chen Shu Bian, an electrical engineering graduate from China's Chengchi University, is a senior equipment engineer in the Silicon-On-System Mfg Co. wafer fabrication facility in Singapore.
2010-11-02 RPI shows vapor tunes graphene bandgap
Rensselaer Polytechnic Institute claims to have discovered a simple method that uses water vapor to control the opening of the bandgap in graphene, pushing closer to the use of the carbon sheets for semiconductors.
2007-12-26 RFMD acquires Filtronic Semi for $24.8M
RFMD and has signed a definite agreement to acquire Filtronic Compound Semiconductors for approximately $24.8 million in cash.
2007-04-02 Researchers pitch nanowires as litho replacement
HP Lab and a trio of academic labs have scored advances that will make it easier to use nanowires as a replacement for lithography in semiconductor manufacturing, potentially taking chipmaking to the angstrom scale.
2002-06-06 Researchers demo self-assembling nanowires
Researchers at Aarhus University here have demonstrated a nanometer-scale fabrication technique that self-assembles tiny wires atop substrates, with an eye toward interconnecting molecular electronic circuits in the future.
2014-01-30 Renesas to transfer wafer fab line to Sony
Renesas Electronics signed a definitive agreement to transfer the 12-inch front-end wafer fabrication line at its Tsuroka facility to Sony Semiconductor.
2008-05-07 Qualcomm, Foxlink to build mirasol fab in Taiwan
Qualcomm and Foxlink have partnered to build a dedicated fabrication plant at Lungtan's Science Park in Taoyuan, Taiwan to manufacture next generation mirasol displays.
2007-03-12 Qualcomm invests in Shanghai-based IC equipment developer
Advanced Micro-Fabrication Equipment Inc. announced that it has raised $8 million from Qualcomm Inc. and other investors in its latest round of financing.
2013-02-07 Project plans to bring flexible OLEDs to market by 2019
The Flex-o-Fab project will project will create a pilot-scale manufacturing chain for flexible OLEDs and use it to develop reliable fabrication and production processes.
2000-03-22 PADS-DFT Audit
This application note describes the PADS-DFT Audit. The Audit is an embedded design for test auditing tool that allows users to perform DFT analysis and verification before releasing the PCB for fabrication.
2006-05-29 ON Semi, Nantero to jointly develop carbon nanotube tech
ON Semiconductor and Nantero announced they have teamed up to develop innovative semiconductor process technology to effectively integrate carbon nanotubes in CMOS fabrication.
2004-04-06 Newport semiconductor EFEM features wafer handling robot
Newport has disclosed that its Performix semiconductor fabrication EFEM is the industry's first EFEM featuring an Automated Self Teach wafer handling robot.
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