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2008-05-21 SunPower to build Fab 3 in Malaysia
SunPower Corp. will establish its next solar cell fabrication plant in Malaysia, which is expected to have a nameplate rating in excess of 1GW of annual production capacity.
2007-07-31 SunPower opens 330mW Philippine solar cell fab
SunPower has inaugurated its second solar cell fabrication facility, known as cell Fab 2, in the Philippines.
2003-04-11 StockerYale CMS fiber targets usage in FBGs
StockerYale Inc.'s CMS-1550-R3 low-loss cladding mode suppression fiber is suitable for high-quality fiber Bragg gratings fabrication.
2005-04-20 ST produces 90m silicon of MIPHY disk-drive physical layer IP
STMicroelectronics has revealed the fabrication of MIPHY (Multi-Interface PHY) physical layer interface IP using 90nm technology.
2014-11-07 ST begins novel prod'n process for MEMS sensors
The company started production of MEMS sensors using its proprietary THELMA60 (60um thick epi-poly layer for micro-gyroscopes and accelerometers) surface-micromachining fabrication process.
2003-12-29 SMIC, Elpida sign deal for DRAM production in China
Semiconductor Mfg Int. Corp. (SMIC) and Elpida Corp. have signed a five-year foundry agreement under which SMIC will produce Elpida's 0.10?m DRAM products at its 300mm fabrication facility in China.
2006-10-05 Sipex closes Milpitas fab, moves prod to China and Taiwan
Sipex has closed its Milpitas wafer fabrication operations and the products formerly manufactured in it will now be manufactured in China and Taiwan.
2005-09-08 Sipex announces Chinese strategic alliance
Sipex Corp. has signed a strategic relationship agreement with Hangzhou Silan Integrated Circuit Co. Ltd (Silan-IC). As part of the planned relationship, Sipex will close its Milpitas wafer fabrication operations.
2003-02-20 Silicon Metrics appoints NewPlus as distributor in China
NewPlus Systems & Technologies Ltd of Shanghai, China has been selected to represent Silicon Metrics Corp. in China's semiconductor design and fabrication industry.
2002-04-29 Sharp to build second fab for system-on-LCD panels
Sharp Corp. has decided to build the second fabrication facility dedicated to making continuous grain silicon LCDs, anticipating that its initial CGS LCD fab in Tenri, Japan, scheduled to begin production in October, will not satisfy market demand. Both fabs will make small and mid-sized panels for mobile products.
2002-09-02 Sharp seeks LCD TV edge with seventh-generation fab
Sharp Corp.expects to increase its LCD TV share in the world market by leveraging the output of its seventh-generation fabrication facility in Kameyama, Japan.
2003-01-14 Sharp accelerates ramp of LCD TV production facility
Sharp Corp. is accelerating its plans to bring a fabrication facility for LCD TV receivers online and said the plant will be able to make systems with displays larger than 40-inches.
2007-04-12 Service kicks off at Fujitsu's new 300mm fab
Fujitsu Ltd. has begun operating its second 300mm wafer fab for 65nm chip fabrication. Volume shipments will begin in July.
2005-06-27 Semiconductor technologies for power management (Part 3)
Understand better why ICs and discrete transistors require very different methods of fabrication.
2005-06-20 Semiconductor technologies for power management (Part 2)
Understand better why ICs and discrete transistors require very different methods of fabrication.
2005-06-13 Semiconductor technologies for power management (Part 1)
Understand better why ICs and discrete transistors require very different methods of fabrication.
2014-04-10 Self-cooling chips operate up to 300°C
A team at Fraunhofer IMS developed a type of high-temperature process that allows the fabrication of compact microchips that can keep their cool even at 300°C.
2007-05-04 Secret's out: Maxim is buyer of Atmel's Texas fab
Maxim Integrated Products has bought Atmel's wafer fabrication facility in Irving, Texas for about $38 million.
2006-11-07 Samsung-Sony JV's 8G LCD fab line nears completion
S-LCD Corp., a joint venture of Samsung Electronics and Sony, held a "topping out" ceremony to celebrate the construction of the 8G LCD fabrication line.
2002-10-25 Samsung to construct logic fab in system LSI push
Samsung Electronics Co. Ltd expects to invest $3.6 billion in its system-LSI business by 2007, including a dedicated 300mm logic fabrication facility at Onyang, South Korea.
2004-12-30 Samsung to begin construction on new LCD plant
Samsung Electronics Co. Ltd on Monday (Dec. 27) said that it would begin construction of a new 7G flat-panel display fabrication facility in Tanjeong, South Korea.
2014-09-03 Samsung funds research for 7nm
The South Korean tech giant is financing Pennsyvania State University's work on III-V, which explores FinFET fabrication using the combination of silicon and indium gallium arsenide.
2010-06-14 Samsung dips $3.6B for U.S. fab expansion
Samsung Austin Semiconductor LLC plans to expand the capacity of its 12-inch semiconductor fabrication plant in Austin with a $3.6 billion investment.
2005-05-23 Rhines: Innovations will decrease cost-per-function post-Moore's Law
The cost-per-function of ICs will continue to decline long after Moore's Law is obsolete, thanks to various future design and fabrication innovations, Mentor Graphics Corp. Chairman and CEO Walden Rhines said.
2002-01-07 RF Micro starts production in second GaAs HBT facility
RF Micro Devices Inc. has started production at its second GaAs HBT fabrication facility, located in Greensboro, North Carolina.
2000-03-30 RF measurements on SIEGET bipolar transistors: Predicting performance straight from the wafer
Multistage measurements are intended to ensure unrestricted operation of RF transistors. Recently, RF properties could only be measured on packaged components, while DC measurements alone cannot provide reliable indication of RF performance. Not until on-wafer testing emerged did it become possible to evaluate the RF parameters of production batches right from the wafer fabrication stage. This application note cites the example of on-wafer RF testing of SIEGET transistors.
2002-02-19 Researchers close to delivering molecular circuits
Although it's a little like watching a chess match in slow motion, molecular electronics researchers are converging on viable circuit-fabrication methods.
2014-12-15 Renesas touts soft error-free, low-power SRAM devices
The RMLV08 adds five products in its line-up that boast a density of 8Mb and use a fine fabrication process technology with a circuit linewidth of 110nm.
2006-07-14 Production scheduling tool rolls for 300mm fabs
Ilog has unveiled the Fab PowerOps, touted to be the first software package to address production scheduling for front-end process areas within a 300mm semiconductor fabrication plant.
2002-05-16 Powerchip opens 300mm DRAM fab
Amid sinking prices in the DRAM market, Powerchip Semiconductor Corp. flipped the switch on its first 300mm wafer fabrication facility on May 14.
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