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2007-10-30 Power Integrations, Epson ink foundry deal
Power Integrations and Seiko Epson have entered a foundry partnership and are currently ramping high-voltage power-conversion ICs at Epson's wafer-fabrication facilities in Japan.
2014-05-08 POET integrates electronic, optical elements in one chip
The Planar Opto Electronic Technology (POET) platform is semiconductor fabrication process that uses gallium arsenide technology to combine electronic and optical elements on a single integrated circuit.
2004-12-09 Plastic Logic, E Ink, team for large area flexible display
Plastic Logic Ltd and E Ink Corp. have reached a nonexclusive agreement to cooperate on the design and fabrication of flexible all-plastic electronic displays, Plastic Logic said Monday (Dec. 6).
2005-03-24 Photronics constructs FPD facility in Taiwan
Photronics Inc. has disclosed plans to expand its flat panel display (FPD) mask capacity through the construction of an FPD mask fabrication facility in Taichung, Taiwan.
2002-11-12 Philips announces plans for Albuquerque facility shutdown
Royal Philips Electronics has announced its plans for the phased closure of its semiconductor fabrication operation in Albuquerque, New Mexico at the end of 2003.
2009-09-01 Peridynamic equations spot chip flaws during design
A new method that harnesses an electronics failure simulation technique claims to enable engineers to detect design flaws resulting in cracks, fractures and interface faults before chip fabrication.
2015-07-08 Peregrine, GlobalFoundries unveil RF SOI 300mm platform
The UltraCMOS 11 uses a custom fabrication flow from GlobalFoundries' Fab 7 facility, and will be the foundation for Peregrine's high volume mobile products and SOI products for other applications.
2012-03-15 PCM progress report no. 6: Recent advances in phase change memory (Part 2)
The second installment of this two-part series tackles other recent developments in PCM, including fabrication of a 1 Gb PCM array with a 4F2 cell size.
2013-02-20 OSA unveils ODB++ intelligent data format
The next-generation data format from ODB++ Solutions Alliance claims to be an intelligent, single-data structure for transferring PCB designs into fabrication, assembly and test.
2014-01-23 Optimise CMOS for MEMS-based frequency control
CMEMS fabrication process can be used to fabricate both micro-electromechanical and CMOS electronic devices on a single die.
2004-02-09 NTT nanofabrication uses electron beam lithography
NTT's electron beam lithography system enables the fabrication of small three-dimensional structures.
2004-02-06 NTT develops three-dimensional nanofabrication
Nippon Telegraph and Telephone Corp. (NTT) has created an electron beam lithography system that enables the fabrication of 3D nanometer structures.
2009-01-29 NIL, IMS collaborate on nanoimprint litho
NIL Technology and IMS Chips announced that they have started a collaboration on the fabrication of stamps for nanoimprint lithography by combining their electron beam lithography expertise.
2001-04-15 New thinking needed amid runaway test costs
There is a need to achieve test-cost reductions that rival the reductions in wafer fabrication costs to ensure continued growth of semiconductor markets. ATE should not wait for someone else to do it.
2008-01-23 National streamlines manufacturing efforts
National Semiconductor Corp. is disposing certain manufacturing equipment at its wafer fabrication facilities and cutting around 200 personnel from its payroll as the company continues to take steps to modernize facilities and rationalize its capacity.
2010-08-11 Nanoamps matter in extreme low-power design
The demand for extremely low-power technologies was born from necessity, starting with the fabrication process and moving all the way to the application areas.
2002-12-10 Multek to streamline PCB operations
Multek has announced that they will close its PCB fabrication facilities in Irvine, California and Kumla, Sweden.
2009-06-08 Mirasol display fab rises in Taiwan
Qualcomm MEMS Technologies Inc. has announced that a dedicated mirasol display fabrication plant in the Longtan's Science Park in Taoyuan, Taiwan has commenced operations.
2007-04-16 Making MEMS the new 'mouse'
This article features ST's MEMS Product Division General Manager Benedetto Vigna, who views MEMS as the new 'mouse.' ST first ventured into developing MEMS in 2001. Last year, the company inaugurated a 200mm semiconductor wafer fabrication line dedicated to MEMS devices.
2002-06-05 Lumenon forges fab deal with MTBSolutions
Lumenon Innovative Lightwave Technology Inc., a photonic materials science and process technology company, has signed up MTBSolutions to aid in the design and fabrication of Lumenon's next-generation packaged optical components.
2003-03-27 LG.Philips LCD ramps up second 5G fab
LG.Philips LCD Co. Ltd has announced that its new "P5" facility, a fifth-generation (5G) TFT-LCD fabrication plant, has commenced volume production, following the successful ramping at its "P4".
2009-12-22 LFoundry to buy Atmel France fab
LFoundry GmbH has entered into an exclusivity agreement with Atmel Corp. for the purchase of the latter's wafer fabrication operation in Rousset, France.
2008-08-28 Lam Research puts up training center Taiwan
Wafer fabrication equipment supplier Lam Research Corp. has built a global product training center in Hsinchu, Taiwan with the support of the Taiwan Government.
2004-11-19 Korean firm plans Indian fab
India's first major fabrication facility is set to be established in the southern city of Hyderabad.
2005-12-05 Intel to build 300mm wafer fab in Israel
Intel announced plans to build a new 300mm wafer fabrication facility at its site in Kiryat Gat, Israel.
2004-04-27 Intel converts Arizon facility to 300mm
Intel Corp. has begun a $2 billion construction project to convert a 200mm wafer fabrication facility to a 300mm facility in Chandler, Arizona.
2007-09-11 Intel breaks ground on 300mm fab in China
Intel broke ground on its first 300mm wafer fabrication facility in Asia, Fab 68, the $2.5 billion project set to be operational in 2010.
2004-06-17 Intel begins 300mm production in Ireland
Intel Corp.'s newest high-volume wafer fabrication facility in Ireland has commenced production. Fab 24, a $2 billion facility, features 300mm wafer manufacturing based on Intel's 90nm process technology.
2005-03-15 Intel about to decide locating fab in India, says report
Intel Corp. is about to make a decision on setting up a fabrication facility in India, said Dayanidhi Maran, the country's minister for information technology and communications.
2003-10-23 Indian fab to pursue smart-card, MEMS manufacturing
Finding no takers because of a small domestic market, India's only major VLSI fabrication facility is set to manufacture smart cards and MEMS devices.
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