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2012-07-11 Advanced flip chip packaging tech unveiled
STATS ChipPAC's fcCuBE technology features copper column bumps, bond-on-lead (BOL) interconnection and enhanced assembly processes for high volume production.
2011-03-10 Flip chip packaging boasts 40% lower cost
STATS ChipPAC releases a flip chip packaging technology, fcCUBE, that boasts high input/output density, high performance and reliability in advanced silicon nodes.
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