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2002-05-14 Video feedthrough: El Toro 68C/69B microwave synthesizers
This application note discusses the definition of video feedthrough, how it can be measured, and what effect it has on devices being tested.
2005-07-13 Filters survive high temp processes
Syfer Technology offers a wide range of solder-mount feedthrough EMI filters that are fully compliant to the European Union's RoHS Directive and will withstand the higher soldering temperatures of lead-replacement materials.
2011-04-12 Chip filters offered in smaller package
Syfer Technology has announced that its E01 and E07 ranges of feedthrough 3 terminal 'C' chip filters are now available in smaller packages, as small as 0603.
2008-05-15 Unwrap Robot Guitar's autotuning secret
On the heels of its Ethernet Out guitar, Gibson Guitar has released the Robot Guitar, which automatically tunes to a range of standard and alternative tunings at the touch of a button.
2015-06-29 Understanding ultra-low phase noise oscillators
Here is a tutorial on phase noise and jitter. We will also tackle the impact of ultra-low phase noise oscillators on system performance.
2003-09-17 u?t Photonics photoreceivers use Inphi amps
u?t Photonics AG has developed with Inphi Corp. two differential pin-TIA photoreceivers for SONET OC-768/SDH STM-256 fiber optic networks.
2003-05-07 TI DAC supports four WCDMA carriers at half the power
The DAC5686 programmable dual DAC of Texas Instruments supports up to four WCDMA carriers, while consuming half the power of comparable solutions.
2011-08-01 Signal chain basics: Using the digital features of high-speed DACs
Here's a look at the function and value of each of the digital features in today's high-speed digital-to-analog converters.
2013-08-22 RF switch improves broadband cable systems
Optimised for high linearity and isolation performance, the PE42720 from Peregrine supports increasing data rates as required by the industry transition to DOCSIS 3.1.
2006-08-22 New dice interconnects support up to 100Gbps
NEC Electronics has a wafer-level packaging technology that it says permits more than 1,000 3D interconnections between the logic and memory dice used in an image-processing system.
2007-05-08 Measuring phase, delay errors accurately in I/Q modulators
This Application Note describes a method to accurately measure internal and external phase and timing errors for a high performance direct I/Q modulator.
2005-07-29 Harting's new push/pull power connector suits high-current apps
A Harting Push/Pull Power interface has been specifically designed for high-current industrial, transport or telecommunications applications where IP65/67 protection is required in a small connector format.
2012-06-20 Handling behemoth designs
Learn about some strategies and tool requirements for physical implementation of large and complex semiconductors.
2005-06-23 Handheld spectrum analyzer gets cdma2000 1xEV-DO options
Anritsu is debuting three cdma2000 1xEV-DO options for its Cell Master MT8212B handheld communications analyzer. These options expand the handheld's analysis capability to include RF, demodulation, and OTA measurements on cdma2000 1xEV-DO signals.
2014-05-23 Enable accelerated SoC physical design at RTL
In this article, we provide a review of the essential points to consider in order to ensure a smooth transition between the logical and physical worlds.
2003-01-09 Direct digital synthesizers cut power by 90 percent
ADI has released a DDS family that cuts power consumption by 90 percent over previous versions through the application of patent-pending algorithms.
2007-08-17 Data-converter advances enable SDR designs
Advances in DSP technologies have accelerated SDR�s development but, paradoxically, the catalyst that enables SDR is in the analog domain of high-speed data-converter technologies.
2007-07-19 Cellphone conquers elements
The Casio GizOne Type-V is a ruggedized clamshell-style cellphone that is said to have passed military specification tests for shock and moisture resistance.
2014-06-05 Analog expands RF platform with modulator, demodulator
The devices are designed for 3G/4G communication, microwave PtP radios, military/aerospace and instrumentation applications.
2006-10-02 3D interconnects transmit at 100Gbps
NEC Electronics has launched a wafer-level packaging technology that allows more than 1,000 3D interconnections between the logic and memory dice used in an image-processing system.
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