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2002-10-10 Murata ceramic capacitors replace film capacitors
The company's GRM21 and GRM31 series of chip ceramic capacitors are available with capacitance values ranging from 0.015F to 0.15F
2002-07-31 Matsuo chip capacitor offers 15-gigaohm insulation resistance
The Type892 unencapsulated film chip capacitor from Matsuo Electric Co. Ltd is rated at 100Vdc and provides a minimum insulation resistance of 15 gigaohms.
2012-01-17 Film chip capacitors tout 0.1-22uF capacitance
The NSPH series is rated for operating temperatures from -55C to 125C with typical capacitance change within 5 percent of 25C capacitance value.
2005-01-19 Film caps deliver stable performance in the most demanding apps
NIC Components Europe has introduced a range of film chip capacitors
2006-07-11 Resistor-capacitor chip network saves PCB space
BI Technologies' new series of resistor-capacitor chip networks promises to replace up to 16 discrete components, saving 50 percent of PCB space
2002-06-19 Linear Tech capacitor charger has higher efficiency
Designed to charge photoflash capacitors in digital and film cameras, the LT3420 capacitor charger from Linear Technology Corp. uses a flyback topology to achieve efficiencies up to four times better than competing flash modules
2006-05-22 Fused capacitor beefs up protection from short circuits
AVX Corp. has developed the TBW series tantalum-fused capacitor to provide increased protection against short circuit failure modes in military and aerospace circuitry
2007-01-12 China's film capacitor industry on track for 10% growth
Over the past few years, China's film capacitor output has achieved steady annual growth rates of 10 percent, with 26.4 billion units in 2006
2014-12-30 AVX reveals high CV tantalum SMD chip capacitors
Featuring undertab terminations, the F98-AS1 series targets automotive, commercial, industrial and medical applications, as well as input/output lines of small power supply circuits and smartphones.
2003-10-13 Vishay rolls out film caps, optocoupler, transformers
Vishay Intertechnology Inc. has released its new line of products that include thin-film chip and wire capacitors, optocoupler, and current-sensing transformers
2003-09-10 Renesas halves memory chip size by merging SRAM and DRAM
Renesas Technology has developed a new SRAM memory cell combining SRAM and DRAM technologies.
1999-06-29 Chip scale integrated passive devices for wireless applications
This paper deals with the integration of multiple channels of high-performance filters and ESD protection in a very small footprint that provides enhanced performance.
2007-07-09 ST touch sensors use ATLabs capacitive technology
STMicroelectronics unveils a new family of ultralow-power touch-sensor chips, following the signing of a technology-licensing agreement with the Korea's ATLab Inc.
2009-02-16 Silicon resonator consumes 1,000x less power
By adding a piezoelectric thin-film atop its silicon resonator and using a switched capacitor method for performing temperature compensation, the Swiss Center for Electronics (CSEM) is claiming a 1,000-fold decrease in power consumption in a paper presented during the ISSCC
2003-03-25 Sanmina-SCI licenses capacitance technology to Oak-Mitsui
Sanmina-SCI Corp. has announced that Oak-Mitsui Technologies has signed a licensing agreement to manufacture and market thin, film-based substrates using the company's patented Buried Capacitance technology
2010-03-24 Quantum films to displace CMOS sensors in digicams?
Quantum films can image scenes with more pixel resolution, offering 4x better sensitivity for ultrahigh-resolution sensors that are cheaper to manufacture, according to InVisage Inc.
2008-04-01 Organic RFID tags to zap bar codes
Researchers from the European Holst Center said their 64bit, inductively coupled, passive RFID tag achieved a record 780bit/s data readout.
2002-04-17 Murata capacitors target HRF power apps
Murata Electronics North America has launched a High Performance RF Power (HPP) capacitor series in response to demand from the capital equipment market for the processing of semiconductor wafers that use HRF power electronics
2002-12-23 Hitachi improves performance of wireless comm ICs
Hitachi Ltd has announced that its Central Research Laboratory has developed a technology that more than triples the capacitance density of metal-insulator-metal (MIM) capacitors in wireless communications ICs.
2015-03-19 Grasping capacitors, ripple and self-heating
Ripple can be a necessary design function, and the considerations can be quite straightforward. In this article, we will take a look at ripple ratingsor how to cook a capacitor
2005-12-14 Toshiba builds 128Mb capacitorless DRAM
Toshiba has fabricated a 128Mb capacitorless DRAM on an SOI wafer and verified operation of the chip
2000-02-01 The future of mixed-signal design
I hear two contradictory things regarding mixed-signal IC design. One set of voices says the systems-on-chip (SoC) of the future will be large mixed-signal systems, and the proportion of these being built will double from about 33 percent currently to 66 percent by 2005. The other set of voices says everything will be big digital chips constructed in ever-deeper submicron CMOS, in that the ASICs of the future will use as many 15 million logic gates, but that the analog and mixed-signal circuitry will be left off-chip
2008-10-21 Affordable silicon ink speeds up RFID tagging
Printing thin-film circuits on flexible substrates may be available in the market with the release of what is believed as silicon ink's first commercial integration
2010-04-16 When will memristors be ready for prime time?
While memristors represent a potential revolution in electronic-circuit theory akin to the invention of the transistor, it will take a killer application to get it off the ground.
2006-07-04 Touchscreen has noncontact sensing, fingerprint reading
Motion Computing's LS800 is a slate PC built around a central design teneta pen-input screen. This article examines how this technology works.
2011-09-26 Specialized foundry processing yields high-performance analog IC
Learn about the impact of foundry process on achievable specifications.
2005-06-20 Sony, Toshiba co-develop 45nm embedded DRAM
Sony Corp. and Toshiba Corp. have reported they developed the first 45nm embedded DRAM cell by scaling embedded DRAM cells down to 0.069 square microns.
2005-03-18 Nam Tai boosts production capacity of SMT lines
Nam Tai Electronics Inc. has raised the production capacity of its surface mount technology (SMT) production lines to accommodate increasing customer orders and demand for new products, including digital audio broadcast (DAB) modules and RF motherboards for cellular phones.
2007-09-27 Moto Fone packs a punch of simple, elegant features
Quietly launched in rural India initially, the F3 Fone is aimed mostly at first-time cell users in markets offering low-cost prepaid or monthly service.
2004-09-30 Mixed-signal IC ready for cordless pens
Wacom Technology will introduce a mixed-signal IC designed for the company's inductive-pen sensing system.
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