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2009-01-30 Shark fin antenna fits automobiles
Laird Technologies Inc. has launched its new "Shark Fin" style modular antenna assembly for automotive vehicles.
2003-05-12 Bi-Sonic CPU cooler features new fin blade structure
Bi-Sonic Technology has announced the release of a CPU cooler that features a fan that uses ventral fin blades.
2005-04-18 Efficiently extract heat from heat sinks
Find out how much heat can be extracted from a heat sink to examine parameters that impact thermal performance
2002-09-16 AMD develops technology for transistor enhancement
AMD said that they have fabricated the smallest double-gate transistors reported to date using industry standard technology.
2008-12-19 Trio develops 'world's smallest' FinFET SRAM cell
Toshiba, IBM and AMD have jointly developed an SRAM cell that has an area of only 0.128?m?, the world's smallest functional SRAM cell that makes use of fin-shaped Field Effect Transistors (FinFETs).
2013-10-07 Richardson reveals extrusion profiles from Wakefield-Vette
The portfolio features more than 35 extrusion profiles along with various thermal management products such as bonded fin heat sinks and liquid cold plates, as well as thermal management accessories.
2013-12-16 Imec unveils strained germanium FinFETs
The device, fabricated with a Si Fin replacement process on 300mm Si wafers, shows a possible evolution of the FinFET/trigate architecture for 7nm and 5nm CMOS technologies.
2005-09-13 Heatsink delivers optimal cooling
Cool Innovations said a first of its kind UltraCool P line of splayed pin fin heatsink produces a cooling premium of 20 to 30 percent compared to standard pin fin heatsinks when operating in low air-speed environments.
2003-07-23 Fischer heatsinks have >220W/mK thermal conductivity
The ICKS series of pin-fin heatsinks from Fischer Elektronik are fabricated with a large number of specially arranged pins designed for high air throughput.
2014-12-18 What's hot at IEDM 2014?
The 2014 International Electron Devices Meeting proved that Moore's Law is still alive. The event was a victory lap for Intel, which gave more details on the 14nm finFET process.
2012-10-01 Using LM5018 isolated evaluation board
Learn about the LM5018 regulator which integrates both the high and low side power switches needed for creating isolated buck converter.
2011-06-23 Upcoming technologies push power revolution
Several electronic technologies are playing high-profile roles in power revolution, among them 3D transistors, solid-state lighting, energy harvesting, superconducting cable and silicon carbide components.
2012-07-03 UMC looks to catch up with competitors with IBM deal
UMC looks to drastically improve its position with 20nm low power process with FinFET development license from IBM.
2013-09-10 TSMC certifies Synopsis' design solution for 16nm FinFETs
Synopsys' Laker custom design solution provides users with access to a wide range of TSMC process technologies, from 180nm to 16nm.
2013-06-04 TSMC certifies Mentor EDA tools for 16nm FinFET
Mentor Graphics design and verification tools get certified for TSMC's 16nm FinFET process node. The companies also detailed their continued collaboration on 20nm physical verification kit optimisations.
2002-07-05 Tsinghua Huatian CPU cooler suits AMD Athlon XP 2100+
The AE-085+ CPU cooler is designed for AMD Athlon XP processors (up to 2100+ model), and is likewise suitable for Pentium 3 Coppermine CPUs operating up to 1.13GHz, Penitum Tualatin processors up to 2.2GHz, and AMD Duron units up to 1.7GHz.
2003-01-22 TITI notebook CPU cooler delivers 37.54cfm
The TI-M707L notebook CPU cooler delivers an airflow of 37.54cfm and is designed for use in Pentium 4 processors.
2010-09-06 Tiny car antenna claims best noise performance
The FM antenna IC integrates an automatic gain control, supply voltage regulator with overvoltage protection and antenna sensor in a 3mm x 3mm footprint.
2002-10-03 THTD CPU cooler suits 2.4GHz Pentium 4
The AE-P406 CPU cooler from Tsinghua Huatian Technology Dev. Co. Ltd is designed for use with Intel's Williamette Pentium 4 processors operating up to 2GHz.
2008-05-09 Thermal management kit offers 100 heat sink options
ATS has introduced the Thermal Management Design Kit that contains 96 of its maxiFLOW heat sinks and maxiGRIP sink attachment systems.
2012-07-04 The CMOS-mobile apps connection
The two biggest markets for logic chips are, of course, mobile (smartphone and tablet) and PC devices. These markets are now steering the technology direction and defining the winners and losers.
2008-12-17 Tech firms detail high-k developments
IBM, Intel, TSMC and the NEC-Toshiba duo are expected to present papers on 32nm processes with high-k and metal gates at this week's International Electron Devices Meeting (IEDM).
2012-10-23 TCAD eases FinFET design and variability analysis
FinFET is the first fundamental change in transistor architecture since the time MOSFET replaced bipolar transistor as the transistor of choice for logic applications.
2011-07-07 TAITRA: TSMC, Intel to battle over 3D chips
TSMC is challenging Intel in the 3D arena as it plans to release 3D chips by the end of 2011.
2013-10-17 Synopsys, TSMC team up to offer 16nm design solution
Synopsys collaborated with TSMC to provide support for voltage-dependent design rules in TSMC's 16nm Custom Design Reference Flow.
2005-01-05 Soitec, ADF to develop MuGFETs for 45nm technology
In an effort to accelerate the development of new-generation transistors, Soitec Group has disclosed its participation as the SOI substrate supplier in a development program led by Advanced Technology Development Facility (ATDF), the new independent subsidiary of Sematech for advanced semiconductor R&D.
2010-12-07 Smart grid standard falls short of interoperability
Standards for a co-existence mechanism for powerline home area networks in the United States have been agreed upon, but the government-led group declined to require interoperability of a number of competing approaches.
2002-09-02 Single 7-by-7-inch board packs an integrated DSP
BittWare Inc. describes its Tiburon as a complete DSP system that packs a host PC and peripherals, general-purpose DSPs, and real-time I/O on a 7-by-7-inch board.
2012-07-31 Simulation reveals double battery life thru FinFETs-on-SOI
Gold Standard Simulations performed TCAD simulations where fully depleted FinFET style transistors made on SOI wafers allowed between half and one-third the leakage current of FinFETs made on bulk silicon.
2014-09-03 Samsung funds research for 7nm
The South Korean tech giant is financing Pennsyvania State University's work on III-V, which explores FinFET fabrication using the combination of silicon and indium gallium arsenide.
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