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2012-12-17	Panel: No single approach in future of ICs A group of experts at IEDM debated about the various technologies in semiconductor miniaturisation, with FinFETs being just one of many approaches.
2015-05-25	Nothing left to be invented in embedded control (Part 2) In this instalment, we learn that the power of the core independent peripherals is multiplied when we connect them together, relieving the CPU from potentially large computational loads and real-time constraints.
2007-02-01	Next-gen memory market up for grabs The frantic search for a next-generation memory technology took center stage at the IEEE International Electron Devices Meeting in December, amid growing concerns that DRAM and flash parts will no longer scale in the near future.
2005-10-10	New memory modules improve thermal management With nearly 15 years experience in the stacked, high-capacity memory market, Staktek realized that it needed to come up with a process that would improve thermal and electrical issues. At the same time, it strived to sustain its manufacturing processes so that when other companies are manufacturing its devices, they don't have to invest a huge amount of capital equipment to license its technology.
2007-08-03	NEC, Hitachi develop liquid cooling system for desktops NEC Corp., NEC Personal Products Ltd and Hitachi Ltd have jointly developed a new liquid cooling system for desktop PCs, which reduces PC operating noise from 30db to 25db.
2010-06-04	Nanowire transistors key to planar challenges IBM T.J. Watson Research Center researchers have developed a series of functional 25-stage ring oscillators using silicon nanowire transistors with diameters down to 2.6nm.
2015-07-09	Manage thermal optimisation during PCB design Learn about the development in computational fluid dynamics technology, which allows modifications to the thermal model, and thus frees up valuable engineering time for higher value activities.
2005-08-01	Little time, big decisions for 45nm node Technologists face some tough decisions as they ponder which knobs to turn for the 45nm node.
2015-04-16	Leading technologists talk about Moore's law It has been 50 years since Moore's law came to light, and now three top technologists share their thoughts pertaining to Moore's law as well as their take on its proponent, Gordon E. Moore.
2002-08-29	JMC CPU cooler features dual airflow design The SkyJet 60 CPU Cooler features the company's patented Dual-Pass Airflow architecture, drawing cool air through both the top and sides of the heatsink.
2002-10-04	JMC CPU cooler addresses Xeon-based servers JMC Products' Phoenix 70 CPU cooler is designed to cool Intel's Xeon 3GHz processors.
2015-07-03	Is a FinFET + FD-SOI marriage possible? A number of companies have committed to FD-SOI and others to FinFET, but for fabless and semi-fabless chipmakers, the foundries offer both choices, so why not mix and match or even combine the two?
2011-05-09	Intel transistor uses 3D structure Intel has released a 3D transistor design called Tri-Gate into high-volume manufacturing at the 22nm node in an Intel chip codenamed 'Ivy Bridge.'
2012-06-08	Intel finFETs show variability, need SOI for scaling GSS has concluded that Intel may need to turn to SOI wafers to scale its FinFETs below 22nm, which may have implications for foundries that are yet to introduce FinFET technology into their chip manufacturing processes.
2014-08-12	Intel delivers 14nm process technology Intel 14nm process will enable a new class of x86-based 2-in-1 tablet/notebooks less than 9mm thick that will be on store shelves before the end of the year.
2008-08-26	Intel CTO offers a glimpse of the tech future Intel CTO Justin Rattner devoted his keynote address at the Intel Developer Forum last week to "what the next 40 years of technology might look like."
2013-11-07	Imec demos III-V FinFET devices on 300mm Si wafers The devices enable continual CMOS scaling down to 7nm and below, and also enable new heterogeneous system opportunities in hybrid CMOS-RF and CMOS-optoelectronics.
2011-04-25	IMEC bares new bulk FinFET fabrication process IMEC introduces a new process flow to fabricate bulk finFETs using a plasma-free dry oxide removal process that shows good morphological and electrical characteristics.
2011-05-12	IHS: Intel's tri-gates impede ARM's dominance A market research report by IHS cites low-power consumption of Intel's 22nm tri-gate transistor as an advantage of the company over other competitors.
2015-07-13	IBM surpasses Intel with 7nm node tech IBM Research claims to have perfected the extreme ultra-violet (EUV) lithography and using silicon-germanium channels for its finned field-effect transistors (FinFETs).
2015-06-23	IBM highlights III-V FinFETs on silicon substrate A method similar to Imec's, IBM's process begins vertically then coaxes the InGaAs to turn horizontal and inward, eliminating lattice mismatch defects it was making in the vertical column growth pattern.
2010-10-05	Horizontally grown nanowires create "nano-LEDs" Researchers use novel approach to growing nanowires and stumble into nanoscale LEDs
2006-02-08	Heatsinks cool BGAs in low air flow Advanced Thermal Solutions has introduced maxiFLOW heatsinks for cooling BGAs and other hot components in restricted air-flow conditions.
2007-01-17	Heat sinks cool high-output LEDs ATS has introduced three heat sinks that mitigate the intensity of heat generated by high-output LEDs, thereby reducing temperature and extending product life.
2015-06-16	Grasping parasitic extraction of FinFETs Memory chips must meet strict specifications for fast data transfer, reliability, and power consumption, so accurate characterisation is necessary at every stage of design.
2012-09-24	Globalfoundries to offer 14nm process tech Globalfoundries unexpectedly announced its plans to offer 14-nm process technology featuring FinFET 3-D transistors in 2014 in a bid to leapfrog rival foundries.
2008-07-18	Fan/heat sink mix chills low-profile ICs Jaro Thermal has introduced a 52mm x 52mm x 12mm Neon series fan/heat sink combination that delivers high performance with a low profile.
2016-02-03	Exploring Samsung's 14 nm LPE FinFET Samsung has been gearing up for the launch of its 14 nm Low Power Plus (LPP) process used in the Exynos 8 SoC. In this article, we look into the changes we should expect.
2014-03-07	Exploring circuit design in FinFET technology Know some of the things that could affect the learning and cost curve with regard to the use of FinFET.
2014-08-28	Examining Intel's embedded DRAM With its astronomical manufacturing costs, SRAM's viability is being questioned and the industry is looking for alternatives. This article examines an intriguing option in the form of embedded DRAM.