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2008-03-20 Scalable 8bit MCUs aim at automotives
Freescale Semiconductor has expanded its 8bit S08SG MCU family to provide more scalable performance and memory options for cost-sensitive automotive body and chassis applications
2005-07-20 Samsung, Staktek expand IP license agreement
Samsung Electronics Co. Ltd and Staktek Holdings Inc., a provider of intellectual property and services for the next generation of 3D high-speed and high-capacity thermal management systems, have extended their license agreement in July 2000 for stacking packaged DRAMs using Staktek's stacking technology.
2007-05-11 Real-time clocks feature nonvolatile FRAM
Dallas Semiconductor adds nonvolatile FRAM to its real-time clock product line with the DS32B35 and DS32C35, said to be the industry's most accurate RTCs.
2007-03-26 RadioPulse intros 2.4GHz Zigbee RF module
RadioPulse announced MANGO MG2400, a Zigbee-ready solution that integrates 2.4GHz RF transceiver, PHY, modem, MAC and 8bit MCU in a single chip.
2008-07-04 Power Architecture MCUs gear up for automotive
Freescale Semiconductor has expanded its portfolio of Power Architecture MCUs to address a broad range of cost-sensitive automotive applications requiring 32bit performance.
2008-08-07 PISMO Advisory Council welcomes new members
Agilent Technologies, Samtec and Mentor Graphics have joined the PISMO Advisory Council, which is the industry's first organization focused on streamlining system-level flash memory validation and test
2006-08-01 OTP firmware enhances processor flexibility
Flash memory is costly for many consumer applications. Accessing firmware stored on external flash is power-intensive compared with storing the firmware on-chip. A better solution is to embed one-time programmable non-volatile memory on the processing chip
2014-12-10 OPF eyes more Power innovations, partners
IBM's OPF assists in building U.S. DOE's Coral next-generation supercomputers. It also helps in processing big data and developing flash memory applications that support its CAPI interconnect
2015-05-25 Nothing left to be invented in embedded control (Part 2)
In this instalment, we learn that the power of the core independent peripherals is multiplied when we connect them together, relieving the CPU from potentially large computational loads and real-time constraints.
2007-05-22 Module for IC card gets approved for FIPS 140-2
Sharp Electronics Corp. claims that its IC module for IC cards is the first high-capacity product of its kind to be approved for level 2 of the U.S. Federal Information Processing Standards Publication 140-2 standard.
2008-05-01 MLC adds muscle to NAND
As solid-state drives change the way data is stored, several major memory chip vendors are applying their multilevel-cell technology prowess to this burgeoning market, helping to bring the NAND-based storage architecture forward, particularly for mobile electronics
2015-06-29 Miniature single-chip module targets IoT apps
The i.MX 6Dual SCM from Freescale enables hundreds of components such as processors, memory, power management and RF parts to be integrated in a single platform for the Internet of Things
2009-05-26 Micron seeks funds to enter LED, solar markets
DRAM manufacturer Micron Technology Inc. is reportedly seeking funds to help it move into LED manufacture and is considering solar panel work, an article at IdahoStatesman.com stated.
2002-08-15 MEN PC-MIP mezzanine card delivers FRAM
MEN Micro Inc.'s mezzanine card for the new PCI-based PC-MIP mezzanine standard can provide up to 512KB of NVFRAM without needing a battery.
2006-02-03 MCU includes 32KB of SRAM
ST announced the availability of larger SRAM versions of the 8051-based uPSD3400 Turbo Plus MCU series, which integrate 32KB of SRAM, 256KB of flash memory and USB 2.0
2007-02-16 LIN node SiP rolls for automotive actuator apps
Atmel's new multichip modules combine an MCU and a LIN SBC in a single SiP designed for automotive actuator applications typically found in comfort electronics as well as in powertrain applications
2005-02-10 Kingmax to commence production in Shenzhen
Chip maker Kingmax Semiconductor Inc. announced that it has recently completed its new facility in Shenzhen, Guangdong, and would be ready for production next quarter.
2002-05-23 ISSI ships MCPs in Fujitsu's FBGA technology
Integrated Silicon Solution Inc. has announced the shipment of a family of stacked multichip packaged (MCP) modules that uses Fujitsu Ltd's FBGA packaging technology
2015-12-14 How to securely update FPGA-based embedded systems
This article explains the requirements for a safe, secure and reliable remote update facility, and how a flash-embedded FPGA can provide the key functions needed to satisfy such needs
2008-01-30 High-power RF module handles ZigBee
Radiocrafts has expanded its product line with a compact high-power RF module design for ZigBee.
2009-10-14 GPS processor eases location integration
CSR's SiRFstarIV GSD4e GPS location processor has a built-in CPU and SiRFGeoRecov technology optimized to ensure continuous location awareness without loading the host processor.
2012-04-04 Functional safety features in modern MCUs
Understand the key functional safety features present in modern semiconductor devices, allowing customers to run safety relevant tasks in their applications.
2013-11-27 Fujitsu Semi welcomes changes under Spansion management
Spansion's acquisition of Fujitsu Semiconductor's microcontroller and analogue businesses last summer was 'a bolt from the blue,' according to VP Takeshi Fuse.
2002-10-24 Fujitsu MCUs provide two FULL-CAN interfaces
Fujitsu Microelectronics' MB90340 series of 16-bit MCUs provide up to two FULL-CAN interfaces and up to 384KB of Flash ROM for automotive apps
2007-12-04 Freescale expands 8bit S08 MCU line
Freescale has added 30 highly integrated MCUs to its 8bit S08 portfolio for embedded industrial control, consumer appliance and in-vehicle applications.
2013-01-10 Everspin exhibits ST-MRAM viability for SSD
The reduced switching current and simplified circuitry of ST-MRAM enables it to support the write bandwidth required for DDR3 performance, according to Everspin Technologies.
2008-09-01 EcoRAM cuts data center power use
Seeking to solve a major power problem in computing, NOR flash vendor Spansion Inc. has rolled out a new class of memory that is said to have the potential to replace DRAM in the data center
2006-06-15 Driving away Intel's blues
Intel, the world's largest semiconductor company, is plagued with problems in its many businesses. We've put together ways how Intel can start chipping away its problems.
2007-05-30 CSR takes Bluetooth experience to new wireless fronts
Over the years, CSR established itself as a Bluetooth silicon specialist. Now, it wants to take its Bluetooth success story and apply it to GPS and Wi-Fi.
2014-03-13 Consortium releases HMC specification update
HMCC's update acknowledges existing industry nomenclature by migrating the associated channel model from SR to VSR, while the USR definition also increases performance from 10Gb/s up to 15Gb/s.
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