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2009-11-26 Terepac, IMEC unite for flexible packaging
Terepac's patented photochemical printing process places thinned silicon dies and passive components on flexible substrates
2012-07-16 Smart packaging electronics to be available by 2014
Thin Film and Bemis aim to produce a time-temperature sensor to be used by consumer goods by 2014.
2006-04-10 IMEC presents 'bendy' packaging for ICs
Leading European research institute IMEC and the Intec laboratory at the University of Ghent have developed a process to produce ultra-thin flexible packaging for ICs.
2014-11-17 Samsung tops printed, flexible and organic electronics space
Samsung has an estimated PFOE R&D spending of $1.2 billion, as well as high open innovation scores due to its extensive outside partnerships and investments, stated Lux Research.
2015-02-05 Rudolph sends JetStep for fan-out packaging apps
The JetStep Advanced Packaging Lithography System handles both warped wafers and flexible substrates. It offers 52mm x 66mm field view and 30-reticle library.
2013-04-01 RFID, sensor IC combined in flexible food tag
The CATRENE-Pasteur project combines RFID with multiple sensors on a tag which will be attached to transportation containers. The tag will estimate of how long the food they contain will stay fresh.
2013-01-14 Reprogrammable memory arrays on flexible substrate
The MOMA consortium has recently announced the development of the largest reprogrammable non-volatile memory arrays which will be made on flexible substrates
2013-02-07 Project plans to bring flexible OLEDs to market by 2019
The Flex-o-Fab project will project will create a pilot-scale manufacturing chain for flexible OLEDs and use it to develop reliable fabrication and production processes
2013-08-06 Printed electronics enables flexible sensor design
Discover how printed electronics is opening up large flexible sensor design opportunities
2014-03-27 Printable flexible timer set to enrich packaging
A demonstrator product for a flexible multi-functional timer is on its way to changing the landscape of packaging and other practical consumer applications.
2011-04-28 Packaging tool offers advanced miniaturization
Cadence has unveiled the Allegro 16.5 PCB and IC packaging technology, offering capabilities that increase both productivity and predictability across silicon, SoC and system development
2010-10-26 P3T makes flexible ICs sustainable
The Fraunhofer Institute for Surface Engineering and Thin Films presents a process for making thin film circuits and biosensors that cuts energy and materials used.
2002-04-29 Maxwell IC packaging protects against nuclear radiation
Maxwell Technologies Inc. has announced the availability of the Xray-Pak packaging solution that is intended to shield ICs that process and store data in military satellites from the radiation effects of nuclear blasts
2011-12-21 Low-cost technique targets flexible electronics
Solution-based processing technology pushes for smart applications with stretchable and plastic backplanes.
2005-07-18 For flexible future, think organic
'One day, we'll download books and use electronic paper to read them,' says a pioneer in the field of organic electronics.
2009-07-20 Flexible slide switches tailored for mobile apps
C&K Components has unveiled the OS series of compact two-position slide switches that feature flexible design for easy integration into standard and custom mobile communication devices
2007-04-16 Flexible 350W supply suits telecom, datacom apps
XP Power's MFA350 is a flexible 350W AC/DC power supply targeting telecom and datacom applications
2011-06-17 FCI, Fujikura team up for IC packaging tech
FlipChip International and Fujikura Ltd are collaborating in innovating advanced semiconductor packaging technology
2005-05-19 Discrete devices sport new packaging platform
Diodes launched its DFN packaging platform with a new line of discrete devices
2007-09-10 ASE, Mitsui collaborate on HMT packaging tech
ASE and Mitsui have entered into a cross-licensing agreement and technical collaboration for Mitsui's Hybrid Manufacturing Technologies (HMT) packaging technology
2014-04-10 Advances in power converter packaging
Find out how packaging advances are matching semiconductor progress in power converter miniaturisation
2009-06-25 3M, SUSS MicroTec advance 3D packaging
3M and SUSS MicroTec have teamed up to expand access to 3M Wafer Support System (WSS) equipment for temporary wafer bonding of ultrathin wafers required for 3D packaging
2006-05-01 3D flexible circuits ease packaging
When it comes to designing flexible circuits, there is no better teacher than your fabrication house, says Andy Buja. He shares a few more design tips
2012-12-05 POL converters tout ultra-miniature packaging
Renesas' RAA20770X series is geared for personal computers, servers, industrial, office automation and networking equipment.
2007-05-10 Modular connectors allow flexible PCB stacking
ERNI Electronics has released a portfolio of new MicroSpeed connectors which offer different height options.
2008-08-01 Enhanced adapter renders flexible assembly solutions
The latest SMC board-to-board-adapter from ERNI Electronics offers flexibility in its board-to-board heights ranging from 20mm to 40mm in 2mm increments.
2013-10-03 Spray-based carbon nanotubes used to create low cost sensors
A team of researchers from the Technische Universit?t Mnchen recently fabricated a gas detection sensor on a flexible polymer substrate
2002-04-16 SPI tactile sensor measures 0.1psi to 9,000psi
The Xsensor electronic tactile force and pressure indicating sensor allows engineers real-time monitoring of 0.1psi to 9,000psi of force produced between any two contacting, impacting or mating surfaces.
2012-12-24 Rudolph buys Azores, enters back-end litho market
Rudolph has entered the back-end advanced packaging lithography market with the new JetStep Lithography System, a disruptive innovation featuring a 2X reduction stepper
2011-10-19 Recent developments in 3D integration
Here's a discussion on through-silicon via and mechanically flexible interconnect, and how these are being currently developed
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