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2013-12-13 OE-A roadmap hints at next-gen technologies
The latest edition of the OE-A Roadmap for Organic and Printed Electronics reveals the possibility of OLEDs in small-scale design-projects and large scale lighting projects made entirely with OLEDs.
2012-01-05 New 28nm platforms: Transforming Asia from world's factory to global R&D hub
The convergence of several long-term economic, market and technological trends are driving demand for a new class of devices that combine the capacity and customizability of ASICs, flexibility of FPGAs and cost effectiveness of ASSPs.
2015-10-07 Manufacturing space enters era of change
The world of manufacturing is in the verge of transformation, and recent developments point to a change that may be considered drastic, yet nonetheless certain.
2008-04-07 I/O expander adds more ports for handsets
TAEC's TC35892XBG flexible I/O expander provides additional I/O ports, allowing devices such as keypads, LEDs and rotator wheels to interface with a mobile handset
2011-11-16 Embedded die tech-based 3D package unveiled
ChipletT and ChipsetT enable packaging in the sub-250?m range, up to 50 percent less than alternative embedded die solutions, the companies claimed
2014-03-06 Cluster FLEET drives encapsulation tech into market
Cluster FLEET pools the expertise of different institutions in order to accelerate the translation of encapsulation technologies into industrial and serial production flexible electronic applications
2008-04-10 VI bricks feature advanced modular power platform
The VI BRICK, from Vicor's brick business unit, touts an advanced modular power platform incorporating the technical attributes of the company's V?I Chip technology and robust packaging that facilitates enhanced thermal management and through-hole assembly
2006-10-27 Tiny Flash chips offer 16/32Mbit densities
Winbond Electronics' new Flash memory chips offer 16Mbit and 32Mbit densities that fit into space-saving and cost-effective 8-pin 5.28mm SO8 packaging
2005-10-20 RFICs invoke a paradigm shift
New manufacturing techniques and packaging technologies result in higher performance RFICs
2011-01-26 Nanotape may soon replace solder pads
The new nanotape could replace solder pads with a thin lightweight material that improves thermal energy management. Its foam-like flexible compliance could form the basis for new IC packaging techniques.
2010-02-10 LNB controllers eliminate false switching
Diodes' new LNB controllers offer more accurate and flexible control and internal filtering that completely eliminate false switching and support a wider range of STB designs and specifications
2003-02-12 Java accelerator blends with memories to fit into cellphone
NanoAmp Solutions Inc. claims it has Flash and packaging partners who will make as early as May the combo chips for <$4 premium over the existing memory devices
2008-08-25 High-power WiMAX base stations fit multiGbit links
Axis Network has launched a family of MIMO Remote Radio Heads (RRHs) for OEM deployment of WiMAX networks globally. The RRHs present flexible multiGbit base station connections
2013-12-16 FlexTech forms wearable, disposable electronics users groups
To speed adoption of flexible and printed electronics into various industries, FlexTech Alliance introduced Users Groups focused on wearable electronics and disposable electronics
2006-03-01 Epoxy resin compound adheres to plastics and metals
Master Bond has developed a highly flexible two-component epoxy resin compound specifically for bonding, sealing and casting to engineering plastics and metals
2005-06-08 Embedded controllers simplify migration for cost-sensitive apps
Freescale says its two new ColdFire device families ease the migration to 32bit performance for applications that require low power consumption and flexible integration at an affordable price point
2008-01-21 25A step-down regulator fits in 8mm x 8mm TQFN
Maxim has introduced the MAX8655, claimed to be the first switching, step-down regulator to incorporate the MOSFETs and to shrink regulator packaging into the industry's smallest footprintan 8mm x 8mm x 0.8mm (height) TQFN
2012-03-19 Production system yields ultrathin monocrystalline wafers
The Hyperion from Twin Creeks uses the Proton Induced Exfoliation technology that claims to create monocrystalline wafers that are less than 1/10th the thickness of conventional wafers.
2002-08-30 Ziptronix technology simplifies MEMS processing
Ziptronix has introduced a room temperature, foundry-based, wafer-scale method of hermetically encapsulating surface sensitive devices using industry-standard tooling, materials, and process chemicals.
2002-09-10 Zarlink, Agilent partner to create transceiver standard
Zarlink Semiconductor and Agilent Technologies Inc. have entered into an MSA aimed to create a common standard for pluggable 4-channel parallel optic transceiver modules that offer an aggregate bandwidth of up to 10Gbps.
2007-03-01 Winbond unrolls parallel, serial flash devices
Winbond has announced three new parallel flash memory devices in its W19B product family and two new serial flash memory devices in its SpiFlash W25X family.
2004-01-06 Winbond codec chip targets mobile voice apps
Winbond Electronics Corp. America has expanded its family of voice codec chip solutions with the release of the W681310 voiceband chip.
2014-12-18 What's hot at IEDM 2014?
The 2014 International Electron Devices Meeting proved that Moore's Law is still alive. The event was a victory lap for Intel, which gave more details on the 14nm finFET process.
2005-08-16 Water-filled wafers streamline chip cooling
Researchers develop a chip-cooling process that hopes to replace bulky, bolt-on metal towers used in microprocessors.
2015-02-09 Utilising LEDs for LCD backlighting (Part 1)
Learn about the types of LED LCD backlight units, the market trends and technological developments, the advantages of LED LCD televisions, and the key points in the optical design of LED backlights.
2012-05-03 Use FPGAs to harness potential of flash for enterprise apps
The design challenges associated with flash are readily addressed via deployment of FPGA-based PSM for memory management and I/O.
2011-09-20 U.S. gov't backs printed electronics
Fuel efficiency, cost reduction and advanced electronics performance drive the ever-increasing government support for printed electronics.
2016-03-21 TSMC unveils silicon plans
TSMC will enable silicon interposers larger than 1,200mm21.5x the reticle sizeat 7nm to enable giant 2.5-D stacks of logic and memory for the next gen of Cowos- chip on wafer on substrate.
2014-04-09 Troubleshoot, fix problems on the go
Know how particular oscilloscopes can be used to capture and isolate waveform anomalies to identify source of the problems.
2007-03-29 Triplexer transceiver platform rolls for FTTH apps
ColorChip unveiled its new Meteor III Triplexer Transceiver Platform for FTTH ONT applications.
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