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2004-12-28 Translators enable communication between incompatible IOs
Texas Instruments introduced four new dual-supply voltage level translators that enable communication between incompatible IOs.
2015-06-03 Touchscreen controllers support displays up to 10.1in
The latest Atmel maXTouch U series products claim to deliver remarkable touch performance and ultra-low power for devices that include smartphones and tablets.
2015-03-24 Top 5 problems with programmable logic controllers
PLC's duties are crucial for complex processes. However, like most things in life, they can be both advantageous and disadvantageous. Read this article to discover what can possibly go wrong.
2007-08-01 Tiny MEMS mic increases handset options
Akustica Inc. has unveiled a microphone that measures 1mm? and uses a MEMS diaphragm and on-chip complementary CMOS analog circuitry.
2009-08-18 Tiny Ethernet switches simplify home networking
SMSC's new Ethernet switches offer three ports for integrating multiple networking technologies inside the house.
2004-12-27 TI op amp provides high dynamic range
Texas Instruments unveiled a dual, high-output current, high-gain bandwidth operational amplifier from its Burr-Brown product line.
2005-03-01 TI DA microsystems offer 'best performance, value'
TI introduced a pair of low-noise, low-cost data acquisition microsystems in tiny 6-by-6mm QFN packages from its Burr-Brown product line.
2008-04-16 The redefinition of automotive HMI
Human machine interfaces (HMIs) traditionally consist of multiple systems which allow drivers to interact with their vehicle. In today's automotive designs, the HMI also displays any feedback from the vehicle to the driver.
2009-02-23 The lowdown on the fab tool market
2009 is off to a rough start for fab tool and materials vendors. But some technologiesand companiesare doing better than others.
2015-11-20 Test active optical cables during design, production
Testing and analysis done at critical junctures during the design process can further reduce costs by optimising the design for high yield given specified manufacturing tolerances.
2011-06-22 Tecate customizes ultracapacitors for automatic metering
Tecate Group has made available custom and standard ultracapacitor cells and modules for automatic meter reading (AMR) and smart grid applications.
2007-07-16 Taiwan shows to dish out new design solutions
If you're hungry for the latest embedded development tools, EDA solutions and test technologies, you may want to feast at the 7th Embedded Systems Conference-Taiwan and 15th EDA & Test-Taiwan Conference & Exhibition, which will gather the world's top vendors, and showcase a smorgasbord of fresh design and test solutions on August 23-24 at the Taipei International Convention Center.
2013-10-11 Switch takes computers to light-speed performance
The device developed at A*STAR can switch a light signal on or off extremely quickly, enabling all-optical computing and simplifying the interface between electronic and optical networks.
2012-03-22 Supercapacitors to answer energy issues in portable electronics
An EC that combines the power performance of capacitors with the high energy density of batteries would represent a significant advance in energy storage technology.
2004-09-16 Start thinking out of known 'design box'
Package is not simple anymore: IC and package have become a whole and must be treated as such.
2007-07-05 ST fields capacitive sensor to simplify user interfaces
Making room for itself in the already maturing capacitive sensing market, STMicroelectronics launched the QST108, its first device under its QST portfolio of touch sensors.
2010-01-11 Solving the Rubik's Cube of mobile broadband
Huawei's Robert Fox urges the exploration of new business models and the adoption of intelligent systems and future technologies to help telecom operators to translate the growth of mobile broadband traffic into a proportionate increase in revenue.
2006-08-18 Solution enables high-speed 25m backside wafer coating
DEK announced it has developed a next-generation equipment and tooling package that enables the coating of wafers with ultrathin die attach materials down to 25m in thickness.
2011-03-24 Solid-state lighting poised to take off
While experts believe LEDs will remain the dominant SSL technology until 2020, they insist the rate of SSL adoption will still depend on how soon the cost of ownership can be reduced.
2009-07-16 Soitec, IBM pioneer 22nm for 3D ICs
Soitec Group and IBM Corp. have teamed up to pioneer 22nm node silicon wafer substrate and bonding techniques that will enable wafer-level, 3D integration technology for next-generation ICs.
2010-02-12 Smart sensor eases integration in notebook PCs
AuthenTec has unveiled its newest smart sensor specifically tailored for convenient security, personalization and touch-based functionality in today's PCs and peripherals.
2010-07-07 Singapore aims to boost high-tech presence
Singapore EDB director for electronics Damian Chan talks about the nation's future directions for the electronics industry and competition with other countries for attracting tech investment.
2013-03-14 Sensor makers need scalable product lines to compete globally
Honeywell's James McKenna talks about several technology trends in the medical device market and how those affect sensor manufacturers.
2015-07-21 Semicon West highlights 10 chip trends
During the recent Semicon West, executives from a number of chip companies discussed the ongoing developments on semiconductors technology.
2004-12-16 Samsung boosts output on 3Mpixel image sensor
Samsung is gearing up for the next wave in camera phone technology by increasing production of a 3Mpixel CMOS image sensor.
2014-06-23 Robots actuate industrial automation
Technology and artificial intelligence have entrenched on the industrial territory, where automation is no longer an option but a need, recording 179,000 robots sold worldwide in 2013.
2002-11-26 Risks of customer-owned tooling send designers to ASICs
Like do-it-yourselfers who wished they had called the plumber or electrician instead of botching a home repair, chip makers seem to be having second thoughts about customer-owned tooling.
2008-10-01 Reap the rewards of package-aware design
Chip designers must consider package routability, power delivery and I/O behavior during the initial I/O planning process. To do so, they should combine package-aware I/O planning with automated floor-plan synthesis, which can be very cost-effective for the chip floor plan and the package layout.
2005-10-10 Radio processor provides comprehensive feature-set as standard
The CMX7031 two-way radio processor is touted by CML Microcircuits to enable a revolutionary new platform approach to radio design.
2005-07-08 Quarter-brick IBCs extend to 450W
Georgia Institute of Technology researchers have developed a chip-cooling process that they hope will replace the bulky, bolt-on metal towers used with microprocessors like the G5.
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