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2007-11-09 Future shines for OLED market, says NanoMarkets
The OLED sector will grow to $619 million in 2010, up from this year's $135.8 million, said NanoMarkets in its report "Emerging Markets for OLED and Printed Lighting."
2002-03-14 Fujitsu shrinks fingerprint sensor for portable apps
Fujitsu Microelectronics America said it has developed a tiny fingerprint sensor that is about one-tenth the size and less than half the cost of conventional fingerprint sensors.
2005-10-10 FSA keynoter eyes 'ambient intelligence'
Rudy Lauwereins, vice president for design technology at the Belgian IMEC research institute, came to the Fabless Semiconductor Association (FSA) Expo here Thursday with a
2007-05-31 FPGA kits streamline DDR2 SDRAM devt
Xilinx Inc. rolls its low cost Spartan-3A FPGA development kit for DDR2 SDRAM interfaces, the Virtex-5 FPGA development platform (ML-561) for multiple high-performance memory interfaces (I/Fs) and the memory interface generator (MIG) software version 1.7.
2015-03-11 Flash memory devices cut erase times to 18ms
The SST26VF from Microchip is available in 16Mb, 32Mb or 64Mb configurations and features an SQI interface that enables low-latency execute-in-place capability with minimal processor buffer memory.
2015-01-22 Flash memory devices complete full chip erase in 35ms
Microchip provides two solutions for high-speed flash memory. The SST26WF080B and SST26WF040B are suitable for battery-powered gadgets including IoT applications.
2009-02-12 Firms demo organic RFID breakthroughs
A pair of papers was presented at the IEEE's International Solid State Circuits Conference describing breakthroughs in the field of organic electronics for RFID applications.
2004-03-12 Exar clocks offer improved skew performance
Exar has developed a series of clock and timing devices targeted at wireless basestations, network switches, and routers.
2003-02-25 Europe quietly forms polymer electronics project
Perhaps the best-kept secret in the electronics industry at the moment is the upcoming deadline for non-European companies to join the biggest polymer electronics R&D program ever.
2005-02-11 ERNI expands M12 line of connectors
ERNI expanded its range of M12 automation connectors to include a 4-pin version with D-coding.
2007-01-04 Epoxy resin features 'exceptional' flexibility
Master Bond's EP21TDC-2AN exhibits 31 percent elongation, said to be exceptional for a thermal conductive epoxy where the conductivity is 2.6W/m?K.
2011-02-24 Electronics to move healthcare from hospital to home
New medical electronic devices, aided by new processor, radio, battery and data mining techniques, could help reduce medical costs and improve patients' quality of life.
2012-02-09 Efficient power electronics is key to widespread HEV adoption
Learn about the factors that contribute to the achievement of maximum power density in automotive power electronics.
2007-05-01 Edge technologies keep up with demand
The Edge technology has matured in terms of worldwide coverage, stable infrastructure and the variety of handsets supporting Edge features. Low-cost infrastructure upgrades and the availability of Edge features in majority of mid- to high-end handsets provide a compelling price-performance argument for Edge deployment.
2002-03-05 DuPont buys 16.6 percent stake in Merrimac
DuPont Electronic Technologies has purchased from Merrimac Ind. Inc. a 16.6 percent equity stake worth $5.3 million.
2005-01-24 DT expands its USB data-acq module family
Data acquisition equipment vendor Data Translation announced a new version of its DT9834 series of USB modules.
2016-03-08 Developments in MEMS integration
Learn about the advances in MEMS industry aimed at tackling the integration challenges head on at the package, wafer and die levels.
2011-12-08 Designing 3D-ICs (Part 2)
Here's the second instalment of this series that tackles the tools that can be used to handle a complete backend flow, and enable true 3D design partitioning, synthesis, placement, and routing.
2007-02-26 Design low-power multiprocessor chips
The demand for higher performance and more features has only served to increase total system power consumption.
2011-11-18 DC/DC regulators aimed at 3.3V, 5V apps
The devices enable boast ultra-fast transient response while cutting power dissipation in enterprise applications.
2007-04-11 DC/DC modules feature floating dual outputs
Ericsson Power Modules has extended its MacroDens portfolio with three PKR open-frame DC/DC modules aimed primarily at powering telecom and datacom transmission systems that require floating dual outputs.
2011-01-03 Cortex A8-based development board supports open source
Mistral Solutions launched its Craneboard, which the maker is boldly positioning against TI's AM35x Sitara ARM Cortex-8 MPU evaluation modules.
2013-10-14 Congatec rolls 22nm Atom powered Qseven modules
Armed with Intel's 22nm Atom E3845 processor,the conga-QA3 Qseven modules are fitted with ceramic capacitors, preparing them for industrial mobile applications in harsh environments.
2008-07-21 Chip industry preps for 'More than Moore' era
Chip and semiconductor equipment makers are at a crossroads as they face an era that might be called "More than Moore."
2003-05-22 CDT grants manufacturing license to DNP
Cambridge Display Technology has given Dai Nippon Printing Co. Ltd a manufacturing license for the use of its LEP technology.
2006-08-29 Capacitive sensor takes buttons off camera phone
In Samsung's SPH-V6800 Wi-Fi-enabled GSM camera phone, Synaptics has replaced a set of mechanical buttons with a capacitive sensor that controls the functions.
2004-11-18 Camera phone modules get clearer
Samsung Electro-Mechanics Co. Ltd, the components arm of the South Korean electronics giant, is gearing up for the next wave in camera phone technology by increasing production of a 3-Mpixel CMOS image sensor that will form the heart of a hinge-mounted module in new-generation camera phones.
2005-03-02 Camera module with low power consumption in small package
STMicroelectronics introduced its latest single-chip VGA camera module for entry-level mobile phones and other portable devices.
2004-10-25 Cadence releases next-gen HW-based verification system
Cadence Design Systems Inc. released its Palladium II system, an integral part of the company's Incisive functional verification platform.
2005-03-16 CAD tools shrink small world of MEMS design
Manufacturers are leveraging microdesign technologies to develop MEMS and small devices to satisfy market demand for miniaturization.
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