Global Sources
EE Times-Asia
Stay in touch with EE Times Asia
EE Times-Asia > Advanced Search > flexible packaging

flexible packaging Search results

total search198 articles
2013-11-28 Building better barriers through flawless moisture detection
Developed by the Energy Department's National Renewable Energy Laboratory, the NREL Electric Calcium Test (e-Ca) uses unique design elements to measure corrosion from water using calcium.
2007-10-02 Buck controller touts fast transient response
Intersil Corp. has released the ISL6228 dual-output buck controller with fast transient response that is designed for notebook peripheral computing applications.
2015-03-25 Benefits of power blocks for high-current POLs
A power block is essentially a non-isolated buck converter without the PWM controller. In this article, we pinpoint its advantages for high-current POL applications.
2008-02-01 Awaiting the bountiful organic chip harvest
According to research firm NanoMarkets, revenues from products based on organic thin-film transistors (OTFTs) and organic memories will reach $21.6 billion by 2015.
2003-11-24 AVX SAW filters measure 1.6-by-1.4-by-0.6mm
AVX Corp. has introduced a series of SAW filters that are designed for use in PCS, cellular, and GPS band receptions.
2004-06-16 austriamicro rotary encoder IC measures 5.3-by-6.2mm
austriamicrosystems disclosed that it has unveiled the world's smallest 10-bit multiple output magnetic rotary encoder IC.
2006-10-30 ARM-based SoCs shorten product development time
Winbond's highly integrated general-purpose SoCs promise to shorten the time required for system vendors to develop products and help them reduce time-to-market.
2008-07-08 Applied funding arm to build more Indian IC firms
The investment arm of IC tool vendor Applied Materials Inc. has invested in two Indian companies and is considering two additional investments this year.
2007-06-18 AMD predicts multicore future
Dave Orton, ATI's former CEO and now AMD's executive VP for Visual and Media Business, talked with EE Times about some of the company's targets and technical hurdles with getting Fusion devices ready for market. He also elaborated on AMD's vision and its progress toward the multicore future.
2012-02-03 Advances in 3D-IC testing
Read about the design-for-3D-test architecture and implementation flow developed by researchers at Industrial Technology Research Institute based on the Synopsys test solution.
2015-02-27 ADI touts user-programmable voltage output DAC
The AD5761R integrates a 16bit data converter, 2ppm/C 2.5V reference, output buffer and gain scaling function on-chip, allowing for faster and simpler system design.
2003-10-31 Actel FPGAs suit military apps
Actel Corp. has announced that its non-volatile Axcelerator family of FPGA devices has been qualified to military specifications.
2002-07-09 Actel FPGA family delivers >500MHz operation
Actel Corp. has launched its Axcelerator family of FPGAs that range from 125,000 to 2 million system gates, delivering >500MHz operation and up to 100 percent resource utilization.
2008-06-27 A complete discussion of the S?Cwire (Simple Serial Control) single-wire interface with TLAT specification
This application note has discussed the details of the S?Cwire (Simple Serial Control) single-wire interface and possible approaches to software integration. With this knowledge designers can effectively take advantage of the features and benefits offered by AnalogicTech's digitally programmable, high performance power IC devices.
2015-09-10 60 start-up companies to watch in 2015
EE Times has selected 30 start-up companies to come on to version 16.1 of its list of 60 firms that are worth keeping an eye on. Readers are welcome to nominate their own emerging companies.
2007-11-01 45nm designs demand efficient floorplans
With the migration to 45nm cores, optimized I/O planning and placement will become even more critical. These challenges beg the question: Who should take charge of a chip's I/O plan along with the considerations for the package and the rest of the system?
2014-05-08 3D chip-making technique utilises metallisation layers
The technique fabricates active devices interleaved between the metallisation layers atop a standard CMOS die, eliminating the expense of vertically stacked transistors or of stacking dies with TSVs.
2008-09-17 18bit DAC transforms system performance, designs
TI introduces what it touts as the industry's highest accuracy DAC, which features 18bit monotonic performance, 2 LSB INL and 1 LSB differential nonlinearity.
Bloggers Say

Bloggers Say

See what engineers like you are posting on our pages.

Back to Top