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2003-08-27 TriQuint, Amkor partner on flip-chip process
TriQuint Semiconductor Inc. has teamed with Amkor Technology Inc. to commercialize a low-cost flip-chip assembly process for GaAs semiconductors.
2005-09-02 Singapore packager to expand flip-chip capacity
Assembly and test company STATS ChipPAC Ltd is expanding its capacity for flip-chip assembly.
2000-06-01 Novel ACF for flip-chip attach
This paper focuses on determining the advantages achieved with the new 'ordered' ACF on actual flip-chip assemblies. In particular, the distribution of conductive particles are determined on the flip-chip bumps and results are compared to theoretical predictions
2008-11-28 LCOS driver chip zoom in on mobile projectors
Aurora Systems introduced a new integrated LCOS driver ASIC designed for mobile projection applications.
2005-02-25 Kyocera expands flip-chip assembly
Kyocera America Inc. has expanded its flip-chip assembly operations to include 12-inch (300mm) wafer dicing.
2005-01-03 Jetting of flux for flip chips
In flip chip assembly, the jetting of liquid flux material onto the substrate has advantages over the dipping of the attached balls into flux.
2007-01-03 Encapsulant suits image sensor assembly
Henkel has announced the commercial availability of a new non-conductive paste (NCP) underfill encapsulant for flip-chip image sensor applications
2006-07-31 AC process streamlines Pb-free flip-chip assembly
Henkel's NCP materials provide an alternative to traditional, mechanical soldering by bonding bumps to the substrate through a Pb-free compatible thermal compression process.
2003-04-23 TSMC will expand test, assembly services to spur demand
In an effort to remove barriers to chip production, Taiwan Semiconductor Mfg Co. will announce an expansion of its test and assembly services and additional guidance for chipmakers on how to prevent manufacturing delays
2010-07-09 TI turns to pillar flip-chip for 45-/40nm node
Texas Instruments Inc. is embracing an emerging technology called fine-pitch copper pillar flip-chip packages for devices at the 45-/40nm node and below
2010-11-01 Single-chip controller enables slimmer multi-touch phone form factors
New multi-touch controller eliminates ground shielding layer, unlimited simultaneous touches
2008-04-30 Singapore inventor gets patent for flip-chip IC assembly tech
Teck Kheng Lee of Singapore has been granted U.S. patent for his development of a method for assembling a flip chip semiconductor device
2011-04-15 New flip-chip techs, apps loom ahead
Factors such as the rising cost of gold used for wire bonding, need for low-thickness devices and continued CMOS downscaling have triggered interest in flip-chip technologies
2004-10-07 NEC reorganizes semiconductor assembly, testing operations
NEC Electronics Corp. has launched NEC Semicon Package Solutions Ltd, a back-end production company specializing in assembly and testing
2005-02-24 Kyocera America assembly division gets DSCC certification
Kyocera America Inc. has received DSCC (Defense Supply Center, Columbus) level Q transitional certification for assembly and test, per MIL-PRF-38535, FSC 5962 allowing Kyocera America to perform assembly and test services for defense applications
2005-09-29 IDT's flip-chip packaged monolithic NSEs now RoHS-compliant
IDT disclosed that it has begun volume production of its RoHS-compliant flip-chip packaged monolithic 512Kx36 (18Mb) and 256Kx36 (9Mb) network search engines with dual Network Processor Forum Look Aside interfaces
2005-09-21 IDT offers network engines in RoHS-compliant flip-chip packaging
Integrated Device Technology Inc. (IDT) has begun volume production of its RoHS (Restriction on Hazardous Substances)-compliant flip-chip packaged monolithic 512Kx36 (18Mbit) and 256Kx36 (9Mbit) network search engines (NSEs) with dual Network Processor Forum (NPF) Look Aside (LA-1) interfaces
2009-06-16 Flip-Chip 300?m recommendations for audio power amplifier
This application note describes the Flip-Chip CSP features and species how ST's customers can use them
2011-03-10 Flip chip packaging boasts 40% lower cost
STATS ChipPAC releases a flip chip packaging technology, fcCUBE, that boasts high input/output density, high performance and reliability in advanced silicon nodes
2008-09-12 Chip materials market outshines IC equipment sector
The semiconductor materials segment will be $12.6 billion larger than the semiconductor equipment market this year, according to a report from Electronics.ca Publications.
2014-05-26 Assembly handling, thermal mgmt for lidless FC-PBGA
Here are recommendations on the assembly handling and application of thermal management solutions for lidless Flip Chip Plastic Ball Grid Array components.
2006-06-02 Assembling high-Pb DS2761 flip-chips in a Pb-Free assembly flow
This application note details the Pb-free assembly process used for DS2761 flip-chip die, and the reliability stresses encountered after the assembly.
2003-08-11 ASAT SiP includes flip-chip, wirebond processes
ASAT Holdings Ltd has developed a system-in-package that integrates multiple components into a single high performance module.
2002-07-19 Amkor, IBM partner on flip-chip technology offerings
Amkor Technology Inc. and IBM have agreed to collaborate on the design and production of flip-chip substrates and packaging
2012-07-11 Advanced flip chip packaging tech unveiled
STATS ChipPAC's fcCuBE technology features copper column bumps, bond-on-lead (BOL) interconnection and enhanced assembly processes for high volume production
2005-06-08 Assembling high-lead (Pb) DS2502 flip-chips in a Pb-free assembly flow
This app note details the Pb-free assembly process used, and the reliability stresses encountered after the assembly
2011-11-22 Wafer packaging fab opens in Taiwan
STATS ChipPAC has increased production capacity with the completion of its 300mm wafer bump and WLCSP facility.
2004-05-21 IBM jettisons IC-packaging units, sells plants to Amkor
IBM Corp. has moved to jettison its chip assembly and packaging operations, announcing a major deal with Amkor Technology Inc
2008-06-06 Will 3D through-silicon vias break into mainstream?
The 3D technology based on through-silicon vias technology took center stage at the IEEE 2008 International Interconnect Technology Conference but there is still no consensus just how the industry will bring the long-awaited technology into the mainstream.
2009-04-23 TI ramps production in Philippine test plant
Texas Instruments Inc.'s new assembly/test facility within the Clark Freeport Zone in the Philippines is now fully operational and ramping production with the latest packaging technologies
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