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2006-08-03 Freescale cuts die area, thickness with new chip packaging tech
Freescale's proprietary redistributed chip packaging technique delivers about a 30 percent reduction in packaged-die area and thickness
2008-09-12 Chip materials market outshines IC equipment sector
The semiconductor materials segment will be $12.6 billion larger than the semiconductor equipment market this year, according to a report from Electronics.ca Publications.
2014-02-13 Ball grid array replaces standard IC packaging
One of the disadvantages of flip-chip BGA packaging is the dissipation of power and data rates on the enclosed product
2004-10-07 NEC reorganizes semiconductor assembly, testing operations
NEC Electronics Corp. has launched NEC Semicon Package Solutions Ltd, a back-end production company specializing in assembly and testing.
2015-05-12 Impact of piling on package manufacturing
To accomplish various performance enhancements, packaging engineers should consider intriguing combinations being constructed at the chip to package level
2004-07-29 Cypress NSE IC gets a bead on IPv6 problems
Cypress' latest family of NSE chips address the larger lookup and classification requirements of emerging IPv6-enabled networking designs.
2014-05-26 Assembly handling, thermal mgmt for lidless FC-PBGA
Here are recommendations on the assembly handling and application of thermal management solutions for lidless Flip Chip Plastic Ball Grid Array components.
2010-09-15 RCP technology manufactured in 300mm format
Nepes to manufacture Freescale technology that replaces deployed ball grid array packaging
2014-11-12 GQFN package shrinks devices by up to 60%
Aside from reducing package size, the grid array flat no-lead package also enables improved electrical performance through lower inductance and capacitance
1999-10-01 Facing the challenges of advanced IC packages
This article chalks up the guidelines needed by IC, package, and board designers and engineers to bridge the gap between IC design, package design, package analysis, and board-level issues.
1999-09-01 Facing the challenges of advanced IC packages
This article chalks up the guidelines needed by IC, package, and board designers and engineers to bridge the gap between IC design, package design, package analysis, and board-level issues.
2014-04-22 Altera adopts fine-pitch copper packaging for Arria FPGAs
TSMC's flip chip ball grid array package technology utilises fine-pitch copper bumps measuring less than 150?m, providing excellent bump joint fatigue life, improved performance in electro-migration current and low stress on the ELK layers.
2005-10-20 STATS ChipPAC wants to be 3D king
Nearly two years after the big merger, Singapore's STATS ChipPAC Ltd is treading slightly above stormy waters in the competitive chip packaging and test market
2005-05-17 STATS ChipPAC to offer 300mm electroplated wafer bumping services
STATS ChipPAC Ltd announced it will offer 300mm electroplated wafer bumping services in the third quarter of 2005 to complete its full turnkey service offering for advanced flip chip applications
2015-01-12 Testing libraries target Intel Bay Trail processors
The VarioTAP libraries from Goepel enable flexible execution of processor emulation tests using the native debug port and allows users to use the processor for hardware design validation of prototypes.
2014-04-02 SRAM boasts transaction rate of 2132 million per second
Cypress' QDR-IV SRAM delivers the random transaction rate required for performing several functions stored in the memory, enabling higher bandwidth and higher quality video streams.
2005-08-19 Multicore CPU handles computational needs of HD video codec
The new multicore Telairity-1 processor from Telairity Semiconductor has been specifically designed to handle the demanding computational requirements of the H.264 (MPEG-4 Part 10) HD codec.
2013-03-28 Car SoCs aimed at multimedia, navigation systems
Renesas' R-Car Series can deliver more than 25,000 DMIPS and is powered by the ARM CortexA-15 quad-core configuration running an additional ARM CortexA-7 quad-core.
2011-10-21 ARM-based SoC targets car navigation
The R-Car H1 features quick-boot, backup camera support and media processing using an MME based on Renesas' SH4A core.
2006-02-10 Amitec sets up subsidiary in China
Prior-Tech and an unidentified Chinese company have agreed to establish a plant in Shanghai that will manufacture substrates designed by Amitec.
2008-09-12 TI OMAP: ARMed and ready
After nearly two years Texas Instruments Inc. has introduced the OMAP3530, the next evolution of its OMAP family of mobile application processors, which includes the OMAP2420, used in a number of mobile consumer applications including the Nokia N93 and N95.
2009-09-02 Silicon circuit board trumps ASICs
Startup siXis Inc. has selected foundry SVTC Technologies to fabricate its embedded silicon board computing modules, which claims to bridge the gap between PCB prototypes and ASIC-based designs.
2013-07-17 Saving embedded PCB design with forensic tech
Find out how forensics inspections can alleviate OEM concerns over maintaining high reliability for their systems and sub-systems.
2006-07-11 Nokia ramps 'fashion phone'
The Nokia 7280 appeared on the market as part of a series of "fashion phones" from the Finnish manufacturer. Given the phone's lack of an alphanumeric keypad and its slide-open-to-answer stick design, some might mistake the slender Nokia 7280 for a spy widget.
2003-05-14 Darpa takes on optical interconnects challenges
Darpa is overseeing development of optical interconnects that will be able to achieve 1,000 times the speed per power and volume of electronic interconnects.
2013-03-22 Readers' top product picks of 2012
The top ten most read product announcements of EE Times Asia's engineering community.
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