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2002-03-22 SUSS flip-chip bonder has up to 200kgf handling force
The FC259 flip-chip bonder features a handling force of 10gf, which is suitable for handling brittle substrates used for optoelectronic devices, but can be configured up to 200kgf for thermocompression processes.
2006-07-31 AC process streamlines Pb-free flip-chip assembly
Henkel's NCP materials provide an alternative to traditional, mechanical soldering by bonding bumps to the substrate through a Pb-free compatible thermal compression process.
2006-08-07 Automatic die bonder offers increased precision, accuracy
Designed for fully automatic, high accuracy precision microelectronics assembly, Palomar's new die bonder performs adhesive dispense, component placement, die attach and flip chip operations over a 720inch2 work area.
2008-10-01 Stacked microprocessor system promises better performance
Take a different approach to chill. A group of researchers just did, resulting in what may be the most efficient heat dissipation possible for stacked microprocessors.
2000-07-01 Deciding how much automation is needed in die bonding
In order to make the appropriate equipment decision, OEM engineers need to take a hard look at the advantages and disadvantages of installing either a semi-automatic or automatic die bonder when process development and follow-on low volume production runs are involved
2002-11-11 K&S opens alternatives for non-core business units
Kulicke & Soffa Ind. Inc. has announced that it is exploring options for some of its non-core business units.
2014-01-22 Besi, Imec partner on thermocompression for 3D IC bonding
Imec and Besi have announced that they are collaborating to develop a thermocompression bonding solution for narrow-pitch die-to-die and die-to-wafer bonding with high accuracy and high throughput.
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