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2005-08-16 Water-filled wafers streamline chip cooling
Researchers develop a chip-cooling process that hopes to replace bulky, bolt-on metal towers used in microprocessors
2003-07-07 TSMC, Amkor partner on flip-chip packaging
Amkor Technology has developed and qualified wirebond and flip-chip packaging for devices manufactured on TSMC's advanced low-k process technologies.
2010-07-09 TI turns to pillar flip-chip for 45-/40nm node
Texas Instruments Inc. is embracing an emerging technology called fine-pitch copper pillar flip-chip packages for devices at the 45-/40nm node and below
2010-12-15 STATS ChipPac flip chip biz grows over 50
Semicon test and packaging provider STATS ChipPAC announced its flip chip business grew more than 50 percent in 2010. The company shipped more than 250 million flip chip packaging units.
2005-09-02 Singapore packager to expand flip-chip capacity
Assembly and test company STATS ChipPAC Ltd is expanding its capacity for flip-chip assembly
2006-01-30 Pillars replace balls in Intel processor packaging
Intel's Presler and Yonah processors make use of copper pillar bumping as an alternative to lead-tin solder balls, according to Chipworks.
2002-10-24 LSI Logic extends reach of wirebond packaging
LSI Logic Corp. has developed a form of wirebond packaging that places bonding pads directly on top of a chip's active I/O circuitry
2007-10-18 Industrial affiliation program tackles 32nm IC packaging
Two research centers are inviting industry partners to participate in an advanced research program on next-generation flip-chip and substrate technologies
2005-09-29 IDT's flip-chip packaged monolithic NSEs now RoHS-compliant
IDT disclosed that it has begun volume production of its RoHS-compliant flip-chip packaged monolithic 512Kx36 (18Mb) and 256Kx36 (9Mb) network search engines with dual Network Processor Forum Look Aside interfaces
2005-09-21 IDT offers network engines in RoHS-compliant flip-chip packaging
Integrated Device Technology Inc. (IDT) has begun volume production of its RoHS (Restriction on Hazardous Substances)-compliant flip-chip packaged monolithic 512Kx36 (18Mbit) and 256Kx36 (9Mbit) network search engines (NSEs) with dual Network Processor Forum (NPF) Look Aside (LA-1) interfaces
2011-03-10 Flip chip packaging boasts 40% lower cost
STATS ChipPAC releases a flip chip packaging technology, fcCUBE, that boasts high input/output density, high performance and reliability in advanced silicon nodes.
2008-09-12 Chip materials market outshines IC equipment sector
The semiconductor materials segment will be $12.6 billion larger than the semiconductor equipment market this year, according to a report from Electronics.ca Publications.
2014-02-13 Ball grid array replaces standard IC packaging
One of the disadvantages of flip-chip BGA packaging is the dissipation of power and data rates on the enclosed product.
2005-05-03 ASE, FCI ink wafer level packaging deal
Advanced Semiconductor Engineering Inc. (ASE) and FlipChip International LLC (FCI) have signed an expanded technology licensing agreement.
2002-11-05 ASE launches 300mm flip-chip bumping volume production
Advanced Semiconductor Engineering Inc. has announced that its 300mm wafer flip-chip bumping line is ready for volume production
2002-08-30 Amkor, PMC-Sierra begin 2G flip-chip production
Amkor Technology Inc. and PMC-Sierra have released for production its jointly developed second generation flip-chip packaging solutions.
2002-07-19 Amkor, IBM partner on flip-chip technology offerings
Amkor Technology Inc. and IBM have agreed to collaborate on the design and production of flip-chip substrates and packaging.
2012-07-11 Advanced flip chip packaging tech unveiled
STATS ChipPAC's fcCuBE technology features copper column bumps, bond-on-lead (BOL) interconnection and enhanced assembly processes for high volume production.
2006-07-06 X-ray analyzer eases advanced chip packaging
Xradia said the MicroXCT is suited for the engineering and failure analysis of next-generation semiconductor packages, including multistacked die and flip-chip architectures
2014-09-01 White-chip scale packages offer up to 80% cost reduction
Rated for input power up to 3W, the the ReadyMount Enhanced CSP from SemiLEDs is a fully packaged white emitter SMD component, ready for surface mounting on any board level module or COB application.
2011-11-22 Wafer packaging fab opens in Taiwan
STATS ChipPAC has increased production capacity with the completion of its 300mm wafer bump and WLCSP facility.
2004-05-26 Unitive boosts chip performance with latest tech app
Unitive Inc. has developed a novel process of applying a new spun-on polymer coating technology that permits further reductions in the size of ICs while improving performance and enables dramatic increases in WLCSP reliability.
2007-07-10 Understanding flip-chip and chip-scale package technologies and their applications
This article first defines the terms "flip chip" and "chip-scale package" and explains the technical development of wafer-level packaging (WLP) technology.
2000-07-01 Trends in multi-chip package integration
Wafer level packaging (WLP) technologies have recently attracted much development activity, innovation and investment. Here are some of the opportunities and obstacles for WLP and multi-chip package integration approaches
2007-10-11 Thermal pillar copper tech helps cool flip-chips
Nextreme claims to have solved the overheating problem with modern flip-chips with its thermal copper pillar bumps, which can either help cool chips, or can be used in reverse to generate energy from waste heat
2010-02-23 Tessera, Nanium ink packaging license deal
Tessera Inc. has signed a technology licensing agreement with Nanium, S.A, formerly known as Qimonda Portugal.
2002-12-24 Semiconductor packaging market to experience growth in '03
The worldwide semiconductor packaging and assembly segment is poised for growth in 2003, according to Dataquest Inc., a unit of Gartner Inc
2004-03-16 SEMI: Semiconductor packaging materials market to reach $11.7B
The market for semiconductor packaging materials is expected to grow from $7.9 billion in 2003 to $11.7 billion by 2008, according to SEMI and TechSearch International's latest report entitled
2013-09-05 QFN-type packages to boost flatpack/chip carrier category
IC Insights noted that with its low cost, small size and excellent thermal performance characteristics, QFN quickly became the mainstream package of choice for many low-to-medium I/O count ICs.
2004-04-01 Optical switch benefits from off-chip drive
As more electrostatic MEMS-based optical-switch products penetrate the market, scalability, reliability and tilt precision take on increased significance.
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