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flip chip What is flip chip? Search results

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What is flip chip?
A type of semiconductor mounting technique that does not require any wire bonds. The final wafer processing step deposits solder bumps on the chip pads, which are used to connect directly to the associated external circuitry.
total search495 articles
2006-07-06 X-ray analyzer eases advanced chip packaging
Xradia said the MicroXCT is suited for the engineering and failure analysis of next-generation semiconductor packages, including multistacked die and flip-chip architectures.
2014-09-01 White-chip scale packages offer up to 80% cost reduction
Rated for input power up to 3W, the the ReadyMount Enhanced CSP from SemiLEDs is a fully packaged white emitter SMD component, ready for surface mounting on any board level module or COB application.
2005-08-16 Water-filled wafers streamline chip cooling
Researchers develop a chip-cooling process that hopes to replace bulky, bolt-on metal towers used in microprocessors
2013-07-29 Vishay Precision Group debuts foil resistor flip-chip
VPG's FRFC 0805 ultra-high-precision Z1-Foil flip-chip resistor noise-free and provides ESD protection of 25kV or more for increased reliability.
2004-05-26 Unitive boosts chip performance with latest tech app
Unitive Inc. has developed a novel process of applying a new spun-on polymer coating technology that permits further reductions in the size of ICs while improving performance and enables dramatic increases in WLCSP reliability.
2007-07-10 Understanding flip-chip and chip-scale package technologies and their applications
This article first defines the terms "flip chip" and "chip-scale package" and explains the technical development of wafer-level packaging (WLP) technology.
2003-07-07 TSMC, Amkor partner on flip-chip packaging
Amkor Technology has developed and qualified wirebond and flip-chip packaging for devices manufactured on TSMC's advanced low-k process technologies.
2003-08-27 TriQuint, Amkor partner on flip-chip process
TriQuint Semiconductor Inc. has teamed with Amkor Technology Inc. to commercialize a low-cost flip-chip assembly process for GaAs semiconductors.
2000-07-01 Trends in multi-chip package integration
Wafer level packaging (WLP) technologies have recently attracted much development activity, innovation and investment. Here are some of the opportunities and obstacles for WLP and multi-chip package integration approaches
2010-07-09 TI turns to pillar flip-chip for 45-/40nm node
Texas Instruments Inc. is embracing an emerging technology called fine-pitch copper pillar flip-chip packages for devices at the 45-/40nm node and below.
2007-10-11 Thermal pillar copper tech helps cool flip-chips
Nextreme claims to have solved the overheating problem with modern flip-chips with its thermal copper pillar bumps, which can either help cool chips, or can be used in reverse to generate energy from waste heat
2001-02-01 Testing dimensional limits of high I/O flip-chip design
The study characterizes underfill materials, examining some large package geometries and design manufacturing processes to avoid defects for I/O counts.
2002-03-22 SUSS flip-chip bonder has up to 200kgf handling force
The FC259 flip-chip bonder features a handling force of 10gf, which is suitable for handling brittle substrates used for optoelectronic devices, but can be configured up to 200kgf for thermocompression processes.
2010-12-15 STATS ChipPac flip chip biz grows over 50%
Semicon test and packaging provider STATS ChipPAC announced its flip chip business grew more than 50 percent in 2010. The company shipped more than 250 million flip chip packaging units.
2010-11-01 Single-chip controller enables slimmer multi-touch phone form factors
New multi-touch controller eliminates ground shielding layer, unlimited simultaneous touches
2005-09-02 Singapore packager to expand flip-chip capacity
Assembly and test company STATS ChipPAC Ltd is expanding its capacity for flip-chip assembly.
2008-04-30 Singapore inventor gets patent for flip-chip IC assembly tech
Teck Kheng Lee of Singapore has been granted U.S. patent for his development of a method for assembling a flip chip semiconductor device.
2004-10-29 SDK blue LED features flip chip structure
Showa Denko K.K. announced that it has developed a blue LED based on gallium nitride.
2007-06-19 RF switch packs four switches in flip-chip housing
Peregrine Semiconductor Corp. has unveiled the UltraCMOS PE42110 multiple switch IC for advanced multi-band WCDMA handsets.
2001-07-16 Reworking CSPs, ?BGAs and flip-chips
Rework of CSPs and flip-chip is required to achieve systems that are reliable, repeatable and cost effective.
2014-03-13 RDA intros WiFi combo chip for mobile devices
The RDA5991 has WLAN, Bluetooth and FM capabilities that work simultaneously or independently with RDA's proprietary WiFi/Bluetooth Coexistence technology.
2013-09-05 QFN-type packages to boost flatpack/chip carrier category
IC Insights noted that with its low cost, small size and excellent thermal performance characteristics, QFN quickly became the mainstream package of choice for many low-to-medium I/O count ICs.
2001-08-01 Preventing flip-chip solder joint failures
Learn about the degradation of solder joints in FCOBs as a result of thermal cycling. The article also seeks to answer how solder joint cracks are initiated and propagated.
2004-04-01 Optical switch benefits from off-chip drive
As more electrostatic MEMS-based optical-switch products penetrate the market, scalability, reliability and tilt precision take on increased significance.
2000-06-01 Novel ACF for flip-chip attach
This paper focuses on determining the advantages achieved with the new 'ordered' ACF on actual flip-chip assemblies. In particular, the distribution of conductive particles are determined on the flip-chip bumps and results are compared to theoretical predictions.
2011-04-15 New flip-chip techs, apps loom ahead
Factors such as the rising cost of gold used for wire bonding, need for low-thickness devices and continued CMOS downscaling have triggered interest in flip-chip technologies.
2008-11-28 LCOS driver chip zoom in on mobile projectors
Aurora Systems introduced a new integrated LCOS driver ASIC designed for mobile projection applications.
2005-02-25 Kyocera expands flip-chip assembly
Kyocera America Inc. has expanded its flip-chip assembly operations to include 12-inch (300mm) wafer dicing.
2004-02-12 Kulicke & Soffa sells flip-chip business
Kulicke & Soffa Ind. Inc. has sold all the assets associated with its advanced packaging technology segment.
2005-01-03 Jetting of flux for flip chips
In flip chip assembly, the jetting of liquid flux material onto the substrate has advantages over the dipping of the attached balls into flux.
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