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What is flip chip?
A type of semiconductor mounting technique that does not require any wire bonds. The final wafer processing step deposits solder bumps on the chip pads, which are used to connect directly to the associated external circuitry.
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2007-09-19 PLX, Mellanox field Express Gen2 chips
PLX Technology debuted its first family of Express 2.0 switches, and Mellanox Technologies announced Infiniband and 10GbE adapter cards using the interconnect onSept. 17.
2007-09-18 PLX unveils PCIe 2.0 switch portfolio
PLX Technology today is introducing a new line of PCIe switches that conform to the recently introduced PCIe 2.0 specification.
2008-01-23 PLX ships samples of Gen 2 PCIe switch family
PLX Technology has announced it began to sample in December its Gen 2 PCIe switches to a broad base of key customers across North America, Asia and Europe.
2006-01-30 Pillars replace balls in Intel processor packaging
Intel's Presler and Yonah processors make use of copper pillar bumping as an alternative to lead-tin solder balls, according to Chipworks.
2015-08-14 Peek inside the first high bandwidth memory
In this teardown article, we reveal the innards of SK Hynix's high bandwidth memory, in AMD's Radeon 390X Fury X graphics card.
2008-01-29 PCIe switches tailored for communications apps
IDT has announced a PCIe switching family claimed to be the first to meet the high-performance data and control plane interconnect requirements for communications applications.
2005-02-21 PCB makers expect surge in profits from flexible PCBs this year
Majority of PCB makers in Taiwan expects higher profit margins this year based on their revenues last year.
2008-05-01 Partition and package to miniaturize handsets
Designers are turning to system-in-package, 3D IC stacking and wafer-level packaging to enable the acute miniaturization found in handsets, particularly for RF functions.
2005-01-04 Parlex, Infineon team on substrates for electronic ID products
Parlex Corp., a supplier of flexible interconnects, has formed a joint venture with Infineon Technologies AG to manufacture and sell advanced technology substrates for secure mobile electronic identification products.
2004-12-30 Parlex, Infineon team on substrates for electronic ID products
Parlex Corp., a supplier of flexible interconnects, has formed a joint venture with Infineon Technologies AG to manufacture and sell advanced technology substrates for secure mobile electronic identification products.
2005-02-23 PAM offers small form factor with high efficiency
The new GSM850/GSM900/DCS/PCS PAM from TriQuint is touted to represent a breakthrough in size reduction while maintaining fully-matched, specification-compliant, high-efficiency performance.
2003-06-16 OSE, Winstek collaborate for high-end IC testing
Orient Semiconductor Electronics, an IC packaging and testing firm, has partnered with IC testing firm Winstek, to increase its testing capabilities.
2004-06-23 Opto Tech to expand LED and OLED capacity
Opto Tech Corp. plans to expand monthly capacity of LEDs and OLEDs this year.
2012-08-15 Optimize dynamic power signature of digital ICs to reduce power noise
At advanced process nodes, the biggest hurdle to achieving power noise integrity lies in handling high frequency power demand.
2007-05-16 Optical transceiver moves data at speed of light
IBM scientists have announced a prototype optical-transceiver chipset that transfers data at a rate eight times faster than currently available components.
2004-02-26 Olympus forms optical foundry services
Olympus has established Olympus Partnership Development Group (PDG)'s Optical Foundry Services.
2002-11-19 Nvidia rolls high-end graphics processor
Nvidia Corp. rolled out its long awaited GeForce FX graphics processor at the Comdex Fall 2002 trade show.
2006-07-11 Nokia ramps 'fashion phone'
The Nokia 7280 appeared on the market as part of a series of "fashion phones" from the Finnish manufacturer. Given the phone's lack of an alphanumeric keypad and its slide-open-to-answer stick design, some might mistake the slender Nokia 7280 for a spy widget.
2009-11-19 NEC Electronics consolidates manufacturing lines
To realize a manufacturing structure with strong cost competitiveness, NEC Electronics has been reorganizing its operations.
2005-08-19 Multicore CPU handles computational needs of HD video codec
The new multicore Telairity-1 processor from Telairity Semiconductor has been specifically designed to handle the demanding computational requirements of the H.264 (MPEG-4 Part 10) HD codec.
2008-02-15 Mobile TV ICs tout high integration, energy efficiency
Infineon Technologies has added two highly integrated and power-efficient devices to its mobile TV IC family, the OMNIVIA TUS 9090 and OMNITUNE TUA 9001.
2002-02-28 Mitsubishi Electric unveils optical devices for 40Gbps transmission
Mitsubishi Electric has announced the release of a tunable dispersion equalizer, optical modulator, and an MEMS optical switch for long-distance, high-capacity 40Gbps optical transmission.
2006-09-06 MicroStencil signs up DEK as sole distributor in Asia, Americas
DEK has been named as the sole distributor for the MicroStencil product range in Asia and the Americas. Under the terms of the agreement, DEK's new Platinum offering will incorporate the entire MicroStencil product portfolio to deliver "pioneering" stencil technology for ultra fine pitch printing to customers in these regions.
2004-08-06 Microsemi photodiode eyes 1,550nm optical nets
Microsemi released a coplanar waveguide photodiode for high-bandwidth single-mode-fiber optical networking apps.
2011-03-23 Microsemi GaN FETs suit up for outer space
Microsemi's Gallium Nitride FETs designed for satellites are built on a wideband gap material which increases performance over current radiation-hardened silicon MOSFETs.
2002-07-29 Microsemi CPW photodiodes feature impedance of 50 ohms
Two families of CPW photodiode ICs from Microsemi Corp. are designed for use in 1/10 GbE, Fibre Channel, Infiniband, VCSEL, and OC-48 and OC-192 SONET/SDH systems.
2003-08-08 MergeOptics photodiode suits 10Gbps operations
MergeOptics GmbH has released its OptoPack product family of 10Gb PIN photodiode that is suitable for 10Gbps operations.
2010-12-02 MEMS resonator eliminates need for quartz
MEMS resonators from SiTime can be integrated inside a semiconductor device's plastic package, cutting the need for an external quartz crystal for real-time clocks.
2008-03-17 MEMS face quartz-crystal giants
MEMS represent the final frontier in microminiaturization-downsizing this necessary mechanical reference signal from the millimeter scale of quartz-crystals to the nanoscale of ICs.
2008-03-03 Maximize multiband handset performance
Cellphones have moved rapidly from dual-band to tri-band to even quad-band. Also, cellphones need to handle various signals for peripheral radios such as Bluetooth, Wi-Fi and GPS. Ultimately, it is the RF switch that must be capable of switching up to nine paths of high-power RF signals with low insertion loss, high isolation and exceptional linearity to realize the necessary multiband performance.
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