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What is flip chip?
A type of semiconductor mounting technique that does not require any wire bonds. The final wafer processing step deposits solder bumps on the chip pads, which are used to connect directly to the associated external circuitry.
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2010-05-31 Malaysia's Unisem sets sight on China market
Malaysia IC-packaging and test specialist Unisem plans to expand in China, develop an automotive expertise and look for acquisitions in the market.
2003-05-30 LSI PHY core offers 12.8GBps bandwidth
LSI Logic Corp. has released HyperTransport physical interface (PHY) core that offers an aggregate bandwidth of 12.8GBps.
2004-05-03 LSI Logic ASIC offers one of the highest logic, memory content
LSI Logic has disclosed that its RC11Si250 slice offers the highest logic and memory content of all 0.11m Platform ASICs.
2008-01-07 Low-power IC tuner rolls for ATSC, NTSC apps
Maxim Integrated Products has released the MAX3540, a highly integrated, single-conversion TV tuner for ATSC and NTSC applications.
2007-07-02 Low-cost FPGAs prop up GbE, PCIe, RapidIO
Altera Corp. has officially rolled out a line of entry-level FPGAs built to support Gigabit Ethernet, PCI Express and serial RapidIO transceivers at the lowest possible price for a programmable part.
2006-07-03 LED drivers with 0.6mm profile suits portable apps
ON Semiconductor has introduced three new white LED drivers with 0.6mm profile designed for backlighting in portable apps.
2005-09-22 Lead-free rules hit yields, European packagers, says analyst
European requirements for lead-free wafer bumping and packaging are hitting manufacturing yields and also hitting assembly companies in Europe as the far-east copes better with changes, according to research company Frost & Sullivan.
2005-06-28 LDO regulator with voltage detector
ON Semi's new LDO regulator is capable of supplying 150mA with a dropout of 160mV at 100mA, and offers an ultra-low quiescent current of 50?A (typ) at full load and 0.25?A (typ) when the device is disabled.
2003-06-30 Lattice serdes transceiver suits SONET, 10GbE apps
Lattice Semiconductor Corp. has released what it claims is the industry's lowest power SERDES transceiver that is based on the 0.13?m CMOS technology.
2010-09-23 Lattice goes green with CPLD packaging
Semiconductor manufacturer removes lead, halogens from packaging
2013-12-13 Latest developments in 3D IC technologies
Here's a look at the various forms of 3D IC technology, starting with the simpler incarnations and culminating in today's start-of-the-art implementations.
2010-06-18 Laser driver array pair suits 10/40/100G apps
Ensphere Solutions has released a pair of 10G laser diode driver arrays provides high performance and low cost in four-port, and 12-port 10G, 40G and 100G long haul optical modules.
2010-02-01 JEDEC-compatible memory enables LRDIMMs
Inphi Corp. has introduced what it claims to be the first JEDEC-compatible memory buffer delivering more than 4x the memory capacity and nearly double the bandwidth, while reducing power consumption.
2002-01-07 Intevac photodiodes fit OC-192, OC-768 systems
The company's high-speed PIN photodiodes are intended for integration into the receivers and transceivers of optical communication systems operating at OC-192 and OC-768 rates.
2010-06-03 Intel to increase Chengdu headcount to 3,000
Intel Corp. plans to increase the headcount in its IC-packaging facility in Chengdu from 2,500 employees right now to 3,000.
2014-09-12 Intel plans to extend Moore's Law to 7nm
Chipmakers generally don't expect the much-delayed extreme ultraviolet lithography in time for 10nm chips, but many still hold out hopes it could be ready for a 7nm generation.
2005-04-18 Integrating high-speed transceivers in FPGAs
The benefits of less board space and increased flexibility make FPGAs with embedded transceivers an attractive solution to board designers.
2008-02-27 Integrated hybrid TV tuner saves space, cost
Maxim's MAX3541 single-conversion, hybrid TV tuner requires only one external SAW filter, a crystal and a few discrete components in order to complete the solution, thus providing a cost-competitive alternative to canned tuners.
2009-02-09 Integrated equalizer IC simplifies 10G SFP+ design
Phyworks has released the PHY1066 equalizer, driver and retimer IC that the enables host board designers to create 10Gbit/s Ethernet SFP+ receive and transmit interfaces for 'direct attach' passive twin-ax copper cables and 10GBASE-SR optical modules.
2002-05-24 Infineon MAC implements SRP for ring-based networks
Infineon Technologies AG has unveiled the Rhea Resilient Packet Ring MAC that implements the Spatial Reuse Protocol (SRP) for ring-based fiber-optic networks.
2004-02-06 Indium releases Pb-free soldering products
Indium Corp. has developed several Pb-free soldering products.
2012-11-12 IMI upbeat about EMS industry future
EMS firm IMI reported more than doubled its net income for most of 2012 attributing its growth to its ability to adapt to emerging trends.
2005-02-23 IMI acquires assets of U.S. EMS firm
Philippines-based Integrated Microelectronics Inc. (IMI) has completed the acquisition of the EMS and ODM assets of U.S. Company Saturn Electronics and Engineering (Tustin) Inc. and its subsidiary Saturn Electronics Philippines Inc. (Tustin).
2005-08-17 ICI offers Pb-free service
IC Interconnect, a wafer bumping service company, announced its Pb-free bumping capabilities, available now as a standard service offering.
2003-03-28 IC, package co-design proving elusive, techies say
IC package design has become a huge bottleneck for getting chips out the door, but there are few automated tools that can help, according to panelists at the International Symposium on the Quality of Electronic Design.
2005-07-08 IC packaging and testing companies expect high revenues in Q3
Most IC packaging and testing companies in Taiwan are anticipating significantly higher revenues in the second half of the year, as increasing demand has shown signs of market potential in June.
2011-05-04 IC industry recovers from recession
The year 2010 was a banner year for the semiconductor industry pulling out of the great recession of late 2008 to early 2009 much faster than other industries.
2015-12-01 HMC, HBM gain wider appeal for computing networking apps
An expert said that while HMC and HBM products are rolling out along with DDR4, it's clear there's room for all three technologies to find market share as standards take time to settle into place.
2007-04-26 Handset tunes in to One-Seg DTV
Sanyo makes extensive use of analog circuitry and functions in its W33SA handset to enable reception of Japan's mobile DTV broadcast.
2008-10-29 GooglePhone responds to Android's aspirations
Smart phones are again the talk of the town. This time it's the T-Mobile G1, a distinctly un-Apple, un-iPhone-like slider. Is the new "GooglePhone" a true revolution or simply a creative reuse?
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